CN201910422U - 一种5050led支架及其制成的led光源 - Google Patents

一种5050led支架及其制成的led光源 Download PDF

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CN201910422U
CN201910422U CN2010206453638U CN201020645363U CN201910422U CN 201910422 U CN201910422 U CN 201910422U CN 2010206453638 U CN2010206453638 U CN 2010206453638U CN 201020645363 U CN201020645363 U CN 201020645363U CN 201910422 U CN201910422 U CN 201910422U
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Prior art keywords
pad
led
bonding pads
light
main
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Expired - Fee Related
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CN2010206453638U
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廖家扬
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ANHUI ZHONGZHI LIGHT SOURCE TECHNOLOGY Co Ltd
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ANHUI ZHONGZHI LIGHT SOURCE TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种5050LED支架及LED光源，LED支架它包括反光杯[1]和与反光杯[1]注塑成形而固定在一起的焊盘，所述的焊盘有六个，分别为位于反光杯[1]底部中央的主焊盘[5]，主焊盘[5]上焊接有发光晶片[2]，其他副焊盘分布于主焊盘[5]的四周，其中二个副焊盘上各固定有发光晶片，所述的发光晶片通过金线[9]与相对应的焊盘进行电路桥接，导通点亮；其特征是所述的固定在主焊盘[5]和二个副焊盘上的三个发光晶片中心线位于经过反光杯杯底圆心的同一直线上。本实用新型使得LED晶片能够固定在焊盘位于杯底圆中心线上，可提高发光强度和发光效率，扩大发光角度。

Description

一种5050LED支架及其制成的LED光源
技术领域
本实用新型涉及LED支架，尤其是支架内的发光晶片的位置。
背景技术
随着LED照明技术日益发展，LED在人们日常生活中的应用越来越广泛，其中5050 LED由于功率相对较大(0.5W)，既可固三颗白光晶片做成白光LED，又可固三色RGB晶片做成多彩LED，应用较为普遍。如何保证5050白光LED发光强度、发光角度又要不影响多彩（RGB）5050的混色效果，成为支架厂商追求的目标。现有的贴片型 5050 LED 晶片分布主要呈等腰三角形分布，如图1所示。目前，5050 LED 支架包括反光杯和与反光杯注塑成形从而固定在一起的焊盘，焊盘有六个，第一个焊盘设置在反光杯底部中间位置，用于放置发光晶片，另五个焊盘围着第一个焊盘四周分布。在其中三个焊盘上各固有一发光晶片，晶片通过金线与相对应的焊盘进行电路桥接，导通点亮。现有技术中的LED支架的焊盘结构限制了发光晶片只能呈等腰三角形分布，使得LED晶片发光强度、角度、出光效率均受到一定限制。
实用新型内容
本实用新型的目的就是解决现有LED发光晶片呈等腰三角形分布，使得发光强度、角度、出光效率均受到一定限制的问题。
本实用新型采用的技术方案是：一种5050 LED支架，它包括反光杯和与反光杯注塑成形而固定在一起的焊盘，所述的焊盘有六个，分别为位于反光杯底部中央的主焊盘，主焊盘上焊接有发光晶片，其他副焊盘分布于主焊盘的四周，其中二个副焊盘上各固定有发光晶片，所述的发光晶片通过金线与相对应的焊盘进行电路桥接，导通点亮；其特征是所述的固定在主焊盘和二个副焊盘上的三个发光晶片中心线位于同一直线上。
一种LED光源，它包括上述5050 LED支架。
本实用新型的有益效果是：本实用新型结构简单，其改变了焊盘的位置，使焊盘固晶位置呈分布于同一直线上，使得LED晶片能够固定在焊盘位于杯底圆中心线上，可提高发光强度和发光效率，扩大发光角度。
附图说明
图1为现有的5050 LED支架结构示意图。
图2为本实用新型5050 LED支架结构示意图。
图中，1、反光杯，2、发光晶片，3、副焊盘，4、副焊盘，5、主焊盘，6、副焊盘，7、副焊盘,  8、副焊盘，9、金线。
具体实施方式
下面结合附图说明对本实用新型作详细的说明。
本实用新型一种5050 LED支架，如图2所示，它包括反光杯1和与反光杯1注塑成形而固定在一起的焊盘，焊盘有六个，分别为位于反光杯1底部中央的主焊盘5，主焊盘5上焊接有发光晶片2，其他副焊盘3、4、6、7、8分布于主焊盘5的四周，其中二个副焊盘上各固定有发光晶片，发光晶片通过金线9与相对应的焊盘进行电路桥接，导通点亮；固定在主焊盘5和二个副焊盘上的三个发光晶片中心线位于经过反光杯杯底圆心的同一直线上。
一种LED光源，它包括上述5050 LED支架。

Claims (2)

1.一种5050 LED支架，它包括反光杯[1]和与反光杯[1]注塑成形而固定在一起的焊盘，所述的焊盘有六个，分别为位于反光杯[1]底部中央的主焊盘[5]，主焊盘[5]上焊接有发光晶片[2]，其他副焊盘[3、4、6、7、8]分布于主焊盘[5]的四周，其中二个副焊盘上各固定有发光晶片，所述的发光晶片通过金线[9]与相对应的焊盘进行电路桥接，导通点亮；其特征是所述的固定在主焊盘[5]和二个副焊盘上的三个发光晶片中心线位于经过反光杯杯底圆心的同一直线上。
2.一种LED光源，其特征是它包括上述5050 LED支架。
CN2010206453638U 2010-12-07 2010-12-07 一种5050led支架及其制成的led光源 Expired - Fee Related CN201910422U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106653723A (zh) * 2017-01-11 2017-05-10 深圳市奥蕾达科技有限公司 全彩cob面板灯珠封装焊盘结构

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106653723A (zh) * 2017-01-11 2017-05-10 深圳市奥蕾达科技有限公司 全彩cob面板灯珠封装焊盘结构

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