CN201059481Y - 四基色led - Google Patents

四基色led Download PDF

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Publication number
CN201059481Y
CN201059481Y CNU2007201113784U CN200720111378U CN201059481Y CN 201059481 Y CN201059481 Y CN 201059481Y CN U2007201113784 U CNU2007201113784 U CN U2007201113784U CN 200720111378 U CN200720111378 U CN 200720111378U CN 201059481 Y CN201059481 Y CN 201059481Y
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Prior art keywords
led chip
light
light led
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blue
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Expired - Fee Related
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CNU2007201113784U
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王兆军
卢祖米
彭建平
朱增广
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ZHEJIANG TIANYU LIGHTING CO Ltd
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ZHEJIANG TIANYU LIGHTING CO Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48111Disposition the wire connector extending above another semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

四基色LED,属于装饰灯具技术领域。其特征在于包括电路连接的蓝光LED芯片、红光LED芯片、黄光LED芯片、绿光LED芯片以及外接设置的LED极脚支架,蓝光LED芯片、红光LED芯片、黄光LED芯片、绿光LED芯片分设在透明硅胶隔离体两侧,并安装在LED极脚支架顶部的集光杯内,上述组件整体封装在透明胶体内。该结构形成四基色LED整体性、集成化,并缩小了光源点间距离,提高光学效果。其发光亮度均匀,防水性、安全性好;混光效果佳,不会出现色彩光斑,光的显色效率高,色彩真实、丰富。该四基色LED可制成光带等装饰灯具,通过电路控制能够实现各种色彩文字及图案设计,具有很好的装饰效果。

Description

四基色LED
技术领域
本实用新型属于装饰灯具技术领域,具体为四基色LED。
背景技术
现代生活中,LED和其他光源体已经广泛应用于装饰照明中,如广告招牌,装饰建筑物的外形,装饰圣诞树及特殊照明场合等,具有很好的视觉效果,特别是LED制成的变幻色彩显示灯,成为人们在日常生活中不可缺少的装饰品。但现有变幻的色彩显示灯,都由三个基色LED组成,因光源点间距离较大,混光效果不佳,出现色彩光斑。
实用新型内容
针对现有技术中存在的上述问题,本实用新型的目的在于设计提供一种混光效果好的四基色LED的技术方案,其不会出现色彩光斑,光的显色效率高,色彩真实、丰富。
所述的四基色LED,其特征在于包括电路连接的蓝光LED芯片、红光LED芯片、黄光LED芯片、绿光LED芯片以及外接设置的LED极脚支架,蓝光LED芯片、红光LED芯片、黄光LED芯片、绿光LED芯片分设在透明硅胶隔离体两侧,并安装在LED极脚支架顶部的集光杯内,上述组件整体封装在透明胶体内。
所述的四基色LED,其特征在于蓝光LED芯片、红光LED芯片安装在同一集光杯内,黄光LED芯片、绿光LED芯片安装在同一集光杯内。
所述的四基色LED,其特征在于LED极脚支架为长、短极脚的结构设置,短极脚顶部分别配合设置集光杯。
所述的四基色LED,其特征在于蓝光LED芯片、红光LED芯片和黄光LED芯片、绿光LED芯片采用黄金线作连接导线,设置在同一集光杯中的两个芯片反向并联连接,构成二组光源供电体系。
上述四基色LED,通过将蓝光LED芯片、红光LED芯片、黄光LED芯片、绿光LED芯片分设在透明硅胶隔离体两侧,并安装在LED极脚支架顶部的集光杯内,上述组件整体封装在透明胶体内,形成四基色LED整体性、集成化,并缩小了光源点间距离,提高光学效果。其发光亮度均匀,防水性、安全性好;混光效果佳,不会出现色彩光斑,光的显色效率高,色彩真实、丰富。该四基色LED可制成光带等装饰灯具,通过电路控制能够实现各种色彩文字及图案设计,具有很好的装饰效果。
附图说明
图1为本实用新型的结构示意图;图2为本实用新型的主视截面结构示意图;图3为本实用新型的侧视截面结构示意图;图4为四基色LED芯片电路连接结构示意图;图5为本实用新型应用实施例的控制电路示意图;
图中:1-蓝光LED芯片、2-集光杯、2a-集光杯、3-红光LED芯片、4-黄金线、5-LED极脚支架、5a-LED极脚支架、6-透明硅胶隔离体、7-透明胶体、8-黄光LED芯片、9-绿光LED芯片。
具体实施方式
以下结合说明书附图对本实用新型作进一步说明:
如图所示,该四基色LED包括电路连接的蓝光LED芯片1、红光LED芯片3、黄光LED芯片8、绿光LED芯片9以及外接设置的LED极脚支架5、5a,蓝光LED芯片1、红光LED芯片3、黄光LED芯片8、绿光LED芯片9分设在透明硅胶隔离体6两侧,并安装在LED极脚支架5、5a顶部的集光杯2、2a内,上述组件整体封装在透明胶体7内,形成四基色LED整体性、集成化,并缩小了光源点间距离,提高光学效果。蓝光LED芯片1、红光LED芯片3可安装在同一集光杯2内,黄光LED芯片8、绿光LED芯片9可安装在同一集光杯2a内,也可以根据需要采用其它分设方式。设置透明硅胶隔离体6能确保供电体系安全,提高LED的安全性。利用透明胶体7封装光源体,具有良好光导性能,在光的传输过程中消除局部光斑,光的显色效率高。
LED极脚支架5、5a为长、短极脚的结构设置,集光杯2、2a分别配合设置在短极脚顶部。蓝光LED芯片1、红光LED芯片3和黄光LED芯片8、绿光LED芯片9采用黄金线4(用黄金制成的细导线)作连接导线,设置在同一集光杯中的两个芯片反向并联连接,充分发挥二极管的单向性特点,在特定的供电条件下,LED芯片均可以独立工作,构成二组光源供电体系。
该四基色LED可制成光带等装饰灯具,通过电路控制能够实现各种色彩文字及图案设计,具有很好的装饰效果。如图5所示,图中:B-LED为蓝光LED芯片1、R-LED为红光LED芯片3、G-LED为黄光LED芯片8、Y-LED为绿光LED芯片9,B为B路控制器,R为R路控制器,G为G路控制器,Y为Y路控制器。B路控制器打开,发出蓝色;R路控制器打开,发出红色;G路控制器打开,发出绿光;Y路控制器打开,发出黄光;B、R路控制器打开,发出粉红光;G、Y路控制器打开,发出黄绿光;G、R路控制器打开,发出淡黄光;B、G路控制器打开,发出天蓝光;B、Y路控制器打开,发出冷白光;R、Y路控制器打开,发出琥珀光;R、G、B路控制器打开,发出白光;R、Y、G、B路控制器打开,发出暖白光。

Claims (4)

1.四基色LED,其特征在于包括电路连接的蓝光LED芯片(1)、红光LED芯片(3)、黄光LED芯片(8)、绿光LED芯片(9)以及外接设置的LED极脚支架(5、5a),蓝光LED芯片(1)、红光LED芯片(3)、黄光LED芯片(8)、绿光LED芯片(9)分设在透明硅胶隔离体(6)两侧,并安装在LED极脚支架(5、5a)顶部的集光杯(2、2a)内,上述组件整体封装在透明胶体(7)内。
2.如权利要求1所述的四基色LED,其特征在于蓝光LED芯片(1)、红光LED芯片(3)安装在同一集光杯(2)内,黄光LED芯片(8)、绿光LED芯片(9)安装在同一集光杯(2a)内。
3.如权利要求1所述的四基色LED,其特征在于LED极脚支架(5、5a)为长、短极脚的结构设置,短极脚顶部分别配合设置集光杯(2、2a)。
4.如权利要求1所述的四基色LED,其特征在于蓝光LED芯片(1)、红光LED芯片(3)和黄光LED芯片(8)、绿光LED芯片(9)采用黄金线(4)作连接导线,设置在同一集光杯中的两个芯片反向并联连接,构成二组光源供电体系。
CNU2007201113784U 2007-06-27 2007-06-27 四基色led Expired - Fee Related CN201059481Y (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101915390A (zh) * 2010-07-27 2010-12-15 东莞市环宇激光工程有限公司 一种红绿蓝黄四色激光灯
CN102182942A (zh) * 2011-03-28 2011-09-14 浙江英特来光电科技有限公司 具有红黄光芯片的led白灯
CN103779347A (zh) * 2013-09-26 2014-05-07 深圳市迈克光电子科技有限公司 高亮度可调光cob光源、射灯及日光灯cob工艺

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101915390A (zh) * 2010-07-27 2010-12-15 东莞市环宇激光工程有限公司 一种红绿蓝黄四色激光灯
CN102182942A (zh) * 2011-03-28 2011-09-14 浙江英特来光电科技有限公司 具有红黄光芯片的led白灯
CN103779347A (zh) * 2013-09-26 2014-05-07 深圳市迈克光电子科技有限公司 高亮度可调光cob光源、射灯及日光灯cob工艺
CN103779347B (zh) * 2013-09-26 2017-03-22 深圳市迈克光电子科技有限公司 高亮度可调光cob光源、射灯及日光灯cob工艺

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Termination date: 20120627