CN201527996U - High-temperature co-fired ceramic packaging high-power integrated LED light source - Google Patents
High-temperature co-fired ceramic packaging high-power integrated LED light source Download PDFInfo
- Publication number
- CN201527996U CN201527996U CN2009202546645U CN200920254664U CN201527996U CN 201527996 U CN201527996 U CN 201527996U CN 2009202546645 U CN2009202546645 U CN 2009202546645U CN 200920254664 U CN200920254664 U CN 200920254664U CN 201527996 U CN201527996 U CN 201527996U
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- China
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- packaging
- light source
- base plate
- led light
- heat conducting
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The utility model relates to a high-temperature co-fired ceramic packaging high-power integrated LED light source, which structurally comprises a packaging substrate and LED chips arranged on the packaging substrate. A radiating bottom plate is attached on the bottom surface of the packaging substrate, a groove pit is arranged on the middle portion of the top surface of the packaging substrate, strip-shaped conducting pads and heat conducting pads are distributed inside the groove pit at intervals, the bottom surface of each heat conducting pad is connected with a plurality of heat conducting columns, each heat conducting column penetrates through the packaging substrate and connected with the radiating bottom plate on the bottom surface of the packaging substrate, the LED chips are connected to the heat conducting pads, and two guide electrodes of each LED chip are respectively connected to two conducting pads on two sides of each heat conducting pad. The high-temperature co-fired ceramic packaging high-power integrated LED light source is small in volume, light in weight, thin in thickness, simple in structure and convenient in manufacturing, power of the light source can achieve 5-15W, and products meet actual illumination requirements.
Description
Technical field
The utility model relates to a kind of led light source, specifically a kind of high temperature co-firing ceramic package high power integrated LED light source.
Background technology
The characteristics of ultra-high brightness LED light source are that luminous efficiency height, power consumption are few, long service life, safe and reliable and help environmental protection, therefore obtain application more and more widely, and the trend that replaces old-fashioned incandescent lamp, Halogen lamp LED, fluorescent lamp and HID lamp is arranged.At present, 0.3 the manufacturing technology of the ultra-high brightness LED light source below watt is ripe, but the ultra-high brightness LED light source more than 1 watt is owing to need the assembled package of a plurality of led chips, thereby have also that caloric value is big, radiating effect is poor, problems such as complex structure and cost height, thereby had influence on the dependability of super brightness integrated LED light source.
Summary of the invention
The purpose of this utility model just provides a kind of high temperature co-firing ceramic package high power integrated LED light source, overcoming the deficiency that prior art exists, solves that super brightness integrated LED light source radiating effect is poor, cost height and the low problem of reliability.
The utility model is achieved in that a kind of high temperature co-firing ceramic package high power integrated LED light source, include base plate for packaging and the led chip that is arranged in the base plate for packaging, bottom surface at described base plate for packaging is attached with radiating bottom plate, end face middle part at described base plate for packaging has the groove hole, the conductive welding disk and the thermal land of strip are intervally arranged in described groove hole, be connected to some heating columns in the bottom surface of each described thermal land, each heating column passes described base plate for packaging, joins with the radiating bottom plate of base plate for packaging bottom surface; Described led chip is connected on the described thermal land, and two of led chip connect and draw on two described conductive welding disks that the electrode branch is connected to thermal land both sides, place.
With the base plate for packaging of High Temperature Co Fired Ceramic substrate as integrated LED light source, just can overcome the defective of the not high and high-strength temperature difference of tolerance of reliability that existing base plate for packaging exists, make integrated the be encapsulated into possibility of a plurality of led chips on same base plate for packaging.Split separate conductive welding disk and thermal land in base plate for packaging, led chip is arranged on the thermal land, and the connecing of led chip drawn electrode and be connected on the conductive welding disk.Like this, the heat that a plurality of led chip produced just can be delivered to outside the base plate for packaging by thermal land, heating column and radiating bottom plate fast, the radiating rate and the radiating effect of integrated LED light source have not only been improved thus, but also simplified the structure of high power integrated LED light source, make that the realization of high power integrated LED light source cheaply becomes possibility.
The utility model is cheated embedding and is solidified with substratum transparent at the end face groove of described base plate for packaging.
The utility model volume is little, in light weight, thin thickness, and power can reach 5-15W, and is simple in structure, easily manufactured, the realistic lighting demand of product.
Description of drawings
Fig. 1 is a planar structure schematic diagram of the present utility model.
Fig. 2 is a cross-sectional view of the present utility model.
Embodiment
As shown in Figure 1 and Figure 2, base plate for packaging 1 of the present utility model is the High Temperature Co Fired Ceramic substrate, and profile is preferably the square plate shape.Be pasted with the radiating bottom plate 5 of metal in the bottom surface of base plate for packaging 1.Have the groove hole that diameter is 10mm at the end face middle part of base plate for packaging 1, the groove hole can be cylindricality, bowl type or cup type etc., and its surface is a high reflection layer; Bottom, groove hole is the plane, and the conductive welding disk 2 of strip and thermal land 3 are intervally arranged in bottom, groove hole, and both sides are bonding wire electrodes 6 of power supply usefulness.Conductive welding disk 2 and thermal land 3 are separate.Be welded with the some heating columns 4 that set in a row in the bottom surface of each thermal land 3, each heating column 4 passes base plate for packaging 1, joins with the radiating bottom plate 5 of base plate for packaging 1 bottom surface.Heating column 4 is that the slurry based on the tungsten metal is full of and makes.But the cross section squarely of heating column 4, the length of side is between 0.4-0.6mm.Heating column is thick more, and radiating effect is good more.
During encapsulation, the glue branch of 36 led chips, 7 usefulness high thermal conductivities is affixed on 6 thermal lands 3 in the groove hole of base plate for packaging 1, two of each led chip 7 connect and draw on two conductive welding disks 2 that electrode 8 is welded in thermal land both sides, place respectively (shown in Figure 2), form one 6 * 6 netted electric path (shown in Figure 1) that distributes.
The bottom of radiating bottom plate 5 can be provided with numerous raised points, so that radiating bottom plate more effectively is connected with the heat abstractor that install the bottom.
The quantity of the led chip in each high power integrated LED light source can be determined according to the power of led light source, the selection of led chip is not subjected to the restriction of emission wavelength, can be packaged into RGB three primary colors or other more colors, also can be packaged into the synthetic white light of blue light and fluorescent material.
As shown in Figure 2, after fixing and bonding wire was finished with led chip 7, available suitable transparent adhesive tape injected in the groove hole on the base plate for packaging 1, forms the substratum transparent 9 that embedding is solidified.The transparent adhesive tape preferred index is greater than 1.5 and the strong silica gel of resisting etiolation ability.
Claims (2)
1. high temperature co-firing ceramic package high power integrated LED light source, include base plate for packaging (1) and be arranged on led chip (7) in the base plate for packaging (1), it is characterized in that, be attached with radiating bottom plate (5) in the bottom surface of described base plate for packaging (1), end face middle part at described base plate for packaging (1) has the groove hole, the conductive welding disk (2) and the thermal land (3) of strip are intervally arranged in described groove hole, be connected to some heating columns (4) in the bottom surface of each described thermal land (3), each heating column (4) passes described base plate for packaging (1), joins with the radiating bottom plate (5) of base plate for packaging (1) bottom surface; Described led chip (7) is connected on the described thermal land (3), and two of led chip (7) connect and draw on two described conductive welding disks (2) that the electrode branch is connected to thermal land both sides, place.
2. high temperature co-firing ceramic package high power integrated LED light source according to claim 1 is characterized in that the top embedding in groove hole of base plate for packaging (1) and is solidified with substratum transparent (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202546645U CN201527996U (en) | 2009-11-26 | 2009-11-26 | High-temperature co-fired ceramic packaging high-power integrated LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202546645U CN201527996U (en) | 2009-11-26 | 2009-11-26 | High-temperature co-fired ceramic packaging high-power integrated LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201527996U true CN201527996U (en) | 2010-07-14 |
Family
ID=42519278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202546645U Expired - Fee Related CN201527996U (en) | 2009-11-26 | 2009-11-26 | High-temperature co-fired ceramic packaging high-power integrated LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201527996U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103367346A (en) * | 2013-07-12 | 2013-10-23 | 惠州伟志电子有限公司 | Novel high-power LED light source and implementation method thereof |
-
2009
- 2009-11-26 CN CN2009202546645U patent/CN201527996U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103367346A (en) * | 2013-07-12 | 2013-10-23 | 惠州伟志电子有限公司 | Novel high-power LED light source and implementation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100714 Termination date: 20141126 |
|
| EXPY | Termination of patent right or utility model |