CN201508851U - LED bracket structure - Google Patents

LED bracket structure Download PDF

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Publication number
CN201508851U
CN201508851U CN2009201756097U CN200920175609U CN201508851U CN 201508851 U CN201508851 U CN 201508851U CN 2009201756097 U CN2009201756097 U CN 2009201756097U CN 200920175609 U CN200920175609 U CN 200920175609U CN 201508851 U CN201508851 U CN 201508851U
Authority
CN
China
Prior art keywords
rubber base
recess
light
emitting diode
metal pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2009201756097U
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Chinese (zh)
Inventor
朱振丰
陈原富
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUSHENG PRECISION INDUSTRY CO., LTD.
Original Assignee
Fusheng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fusheng Co Ltd filed Critical Fusheng Co Ltd
Priority to CN2009201756097U priority Critical patent/CN201508851U/en
Application granted granted Critical
Publication of CN201508851U publication Critical patent/CN201508851U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

An LED bracket structure comprises a rubber base with a hollow function area and a plurality of metal pins. The metal pins extend from the interior of the hollow function area to the exterior of the rubber base, each metal pin respectively comprises at least a first concave part and a corresponding first convex part, the first concave parts are positioned in the area where the metal pins are conjugated with the rubber base, and the top surfaces of the first convex parts are exposed at the bottom part of the rubber base.

Description

Light-emitting diode support structure
Technical field
The utility model relates to a kind of light-emitting diode packaging technology, particularly a kind of light-emitting diode support structure.
Background technology
(light-emitting diodes LED) has advantages such as life-span length, power saving, size is little, so can be widely used in the light source of various electronic installation to light-emitting diode.In addition, light-emitting diode is towards the development of full-color and high brightness in recent years, can be applied to large-sized display with on the traffic sign.In light-emitting diode packaging technology, the thermal diffusivity of luminous efficiency and LED encapsulation body is important problem.
Please refer to Fig. 1, light-emitting diode chip for backlight unit (not showing on the figure) is fixed in the LED support 100 usually.Rubber base 110 is formed on the metal pin 120 with the plastics injection molding method.Wherein, rubber base 110 has bowl-shape hollow functional areas 112.Metal pin 120 is arranged at the both sides of rubber base 110, extends in hollow functional areas 112 outside the rubber base 110.The structure of LED support 100 can be provided with chip bearing 130.In order to improve radiating effect and slimming demand, chip bearing 130, metal pin 120 are the isoplanar with 110 of rubber bases.Can make the interior cup degree of depth in the hollow functional areas 112 be equivalent to outer cup degree of depth functional areas outside, and chip bearing 130 is designed to expose the colloid bottom with metal pin 120 and dispel the heat.Yet aqueous vapor is infiltrated with rubber base 110 joints from chip bearing 130, metal pin 122 easily, and then influences the reliability and the life-span of light-emitting diode.
The utility model content
In order to address the above problem, one of the utility model purpose is for providing a kind of light-emitting diode support structure, by the joint of at least one recess in metal pin and rubber base is set, and the end face of the protuberance corresponding with recess can be exposed to the rubber base bottom, this structural design can increase the contact area of metal pin and rubber base, and then elongates aqueous vapor and infiltrate required path from the rubber base outside along the metal pin.
One of the utility model purpose provides a kind of light-emitting diode support structure, can take into account high-cooling property and keep its reliability.
One of the utility model purpose provides a kind of light-emitting diode support structure, comprising: rubber base has the hollow functional areas; And a plurality of metal pins, in the hollow functional areas, outside rubber base, extend.Wherein, the metal pin comprises at least one first recess position and corresponding first protuberance respectively; First recess is in metal pin and zone that rubber base engages; And the top surface of first protuberance is exposed to the bottom of rubber base.
Description of drawings
Figure 1 shows that the schematic diagram of existing LED support.
Fig. 2 A and Fig. 2 B are depicted as the schematic diagram according to the different embodiment of the utility model.
Fig. 3 A and Fig. 3 B are depicted as the schematic diagram according to the different embodiment of the utility model.
Fig. 4 A, Fig. 4 B and Fig. 4 C are depicted as the partial schematic diagram according to the different embodiment of the utility model.
Figure 5 shows that schematic diagram according to the utility model one embodiment.
The element numbers explanation
10 Rubber base
12 The hollow functional areas
20 The metal pin
22 First recess
22’ First protuberance
24 Second recess
24’ Second protuberance
30 The chip bearing
34 Second recess
34’ Second protuberance
100 LED support
110 Rubber base
112 The hollow functional areas
120 The metal pin
130 The chip bearing
Embodiment
Fig. 2 A is depicted as the generalized section according to the light-emitting diode support structure of the utility model one embodiment.In the present embodiment, light-emitting diode support structure comprises: rubber base 10; And a plurality of metal pins 20.Rubber base 10 has hollow functional areas 12.Metal pin 20 is 12 interior extensions outside rubber base 10 from the hollow functional areas.
The above-mentioned explanation that continues, wherein, metal pin 20 comprises at least one first recess 22 and corresponding first protuberance 22 ' respectively.First recess 22 is positioned at the zone that metal pin 20 engages with rubber base 10.The top surface of first protuberance 22 ' is exposed to the bottom of rubber base 10.In one embodiment, light-emitting diode chip for backlight unit (not showing on the figure) can be arranged on the metal pin 20 that is exposed to hollow functional areas 12.
Please refer to Fig. 2 B, in one embodiment, metal pin 20 is used to place light-emitting diode chip for backlight unit (not showing on the figure) and locates also can be provided with second recess 24 and corresponding second protuberance 24 '.Wherein, second recess 24 is towards hollow functional areas 12, and the top surface of second protuberance 24 ' is exposed to the bottom of rubber base 10.
Fig. 3 A and Fig. 3 B are depicted as the schematic diagram according to the different embodiment of the utility model.As shown in Figure 3A, in one embodiment, light-emitting diode support structure can comprise that chip bearing 30 is arranged in the hollow functional areas 12.Wherein, chip bearing 30 comprises at least one second recess 34 and corresponding second protuberance 34 '.The end face of second protuberance 34 ' is exposed to the bottom of rubber base 10, so chip great heat radiation effect on it can be provided.
Continue, please refer to Fig. 3 B, in one embodiment, the top of first protuberance 22 ' of metal pin 20 protrudes from the bottom of rubber base 10, in the time of can increasing tin sticky and the contact area of tin material.(do not show on the figure) that in one embodiment the metal bearing also can be rubber base and is coated in it.
Generally speaking, metal pin 20 is utilized technologies such as etching or punching press to be made by metal sheet.
Fig. 4 A, Fig. 4 B and Fig. 4 C are depicted as the partial schematic diagram according to different embodiment in the utility model.Please refer to Fig. 4 A, in one embodiment, the bottom thickness h of first recess 22 of metal pin 20 can be less than metal pin 20 other regional thickness H.
In one embodiment, metal pin 20 can be provided with a plurality of first recesses 22, shown in Fig. 4 B.So, when can increase by 20 tin sticky of metal pin and the contact area of tin material.In one embodiment, shown in Fig. 4 C, the bottom thickness of first recess 22 of metal pin 20 also can equal metal pin 20 other regional thickness H.Continuation is with reference to Fig. 4 C, the recess that first recess 22 of metal pin 20 can be designed to have stepped cross-section.
The above-mentioned explanation that continues, first recess 22 of the metal pin 20 in the utility model has various ways, also is not limited thereto, and will be understood that, and aforementioned second recess 34 or 24 in metal bearing 30 or metal pin 20 also can have similar design.
Then, please refer to Fig. 5, in one embodiment, first recess 22 of metal pin 20 can be depression.
In the utility model, first recess 22 of metal pin 20 is arranged at the edge of hollow functional areas 12, shown in Fig. 2 B and Fig. 3 B.In different embodiment, first recess 22 of metal pin 20 can trim or protrude from the outer rim of rubber base 10, shown in Fig. 2 A and Fig. 3 A.Therefore, when aqueous vapor was infiltrated by the sidewall of rubber base 10, aqueous vapor could be infiltrated hollow functional areas 12 after can advancing to first recess, 22 surfaces along metal pin 20 surfaces.Therefore first recess 22 of metal pin 20 has elongated aqueous vapor infiltration path, has improved the reliability of assembly indirectly.In addition, first protuberance 22 ' of metal pin 20 also can be designed to help the structure of tin sticky according to need.When aqueous vapor when the tin sticky of metal pin 20 is infiltrated, also must advance with the surface of other regional metal pin 20 and could infiltrate the hollow functional areas along the sidewall of first protuberance 22 ', effectively overcome the problem of the easy infiltration of aqueous vapor in the past.
Comprehensively above-mentioned, the utility model is by being provided with the joint of at least one recess in metal pin and rubber base, and the end face of the protuberance corresponding with recess can be exposed to the rubber base bottom, and this structural design can increase the contact area of metal pin and rubber base and then elongate aqueous vapor and infiltrate required path from the rubber base outside along the metal pin.Light-emitting diode support structure of the present utility model also can be provided with the chip bearing with recessed cup structure, can take into account high-cooling property simultaneously and keep its reliability.
Above-described embodiment only is explanation technological thought of the present utility model and characteristics, its purpose makes those skilled in the art can understand content of the present utility model and is implementing according to this, when not limiting the utility model with this, be that every equivalence of doing according to spirit disclosed in the utility model changes or modification, must be encompassed in the claim of the present utility model.

Claims (8)

1. a light-emitting diode support structure is characterized in that, comprises:
One rubber base has hollow functional areas; And
A plurality of metal pins extend outside described rubber base in described hollow functional areas, wherein
More described metal pin comprises at least one first recess and corresponding one first protuberance respectively;
More described first recess is in more described metal pin and described rubber base engaging zones; And
The top surface of more described first protuberance is exposed to the bottom of described rubber base.
2. light-emitting diode support structure as claimed in claim 1 is characterized in that, also comprises a chip bearing and is arranged at described hollow functional area.
3. light-emitting diode support structure as claimed in claim 2 is characterized in that, described chip bearing comprises at least one second recess and corresponding one second protuberance, and the end face of described second protuberance is exposed to the bottom of described rubber base.
4. light-emitting diode support structure as claimed in claim 1, it is characterized in that, one of more described metal pin has one second recess and corresponding one second protuberance in described hollow functional areas, and the end face of described second protuberance is exposed to the bottom of described rubber base.
5. light-emitting diode support structure as claimed in claim 1 is characterized in that, more described first recess can trim or protrude from the outer rim of described rubber base.
6. light-emitting diode support structure as claimed in claim 1 is characterized in that, the top of described first protuberance protrudes from the bottom of described rubber base.
7. light-emitting diode support structure as claimed in claim 1 is characterized in that, a cross section of described first recess is stepped.
8. light-emitting diode support structure as claimed in claim 1 is characterized in that, described first recess is a depression.
CN2009201756097U 2009-09-04 2009-09-04 LED bracket structure Expired - Lifetime CN201508851U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201756097U CN201508851U (en) 2009-09-04 2009-09-04 LED bracket structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009201756097U CN201508851U (en) 2009-09-04 2009-09-04 LED bracket structure

Publications (1)

Publication Number Publication Date
CN201508851U true CN201508851U (en) 2010-06-16

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102683563A (en) * 2011-03-10 2012-09-19 富士康(昆山)电脑接插件有限公司 Lead frame for luminous chip
CN102751425A (en) * 2012-05-30 2012-10-24 日月光半导体制造股份有限公司 Light-emitting diode packaging structure and bearing piece thereof
CN105514249A (en) * 2012-03-16 2016-04-20 日月光半导体制造股份有限公司 LED package and carrying board
CN105655471A (en) * 2012-05-30 2016-06-08 日月光半导体制造股份有限公司 Light emitting diode packaging structure and bearing part thereof
CN105702841A (en) * 2012-05-18 2016-06-22 九尊城网络科技(深圳)有限公司 Light emitting diode and packaging method thereof
CN105720162A (en) * 2012-05-18 2016-06-29 九尊城网络科技(深圳)有限公司 Light emitting diode and packaging method thereof
CN105742459A (en) * 2012-05-18 2016-07-06 九尊城网络科技(深圳)有限公司 Light emitting diode and encapsulating method thereof
CN105845807A (en) * 2012-05-07 2016-08-10 日月光半导体制造股份有限公司 Flip chip package structure of light-emitting diode
CN113540330A (en) * 2021-07-12 2021-10-22 格力电器(合肥)有限公司 Light-emitting diode

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102683563A (en) * 2011-03-10 2012-09-19 富士康(昆山)电脑接插件有限公司 Lead frame for luminous chip
CN105514249B (en) * 2012-03-16 2018-06-12 日月光半导体制造股份有限公司 LED package and loading plate
CN105514249A (en) * 2012-03-16 2016-04-20 日月光半导体制造股份有限公司 LED package and carrying board
CN105845807A (en) * 2012-05-07 2016-08-10 日月光半导体制造股份有限公司 Flip chip package structure of light-emitting diode
CN105720162B (en) * 2012-05-18 2018-03-06 深圳市百洲半导体光电科技有限公司 Light emitting diode and its method for packing
CN105702841A (en) * 2012-05-18 2016-06-22 九尊城网络科技(深圳)有限公司 Light emitting diode and packaging method thereof
CN105720162A (en) * 2012-05-18 2016-06-29 九尊城网络科技(深圳)有限公司 Light emitting diode and packaging method thereof
CN105742459A (en) * 2012-05-18 2016-07-06 九尊城网络科技(深圳)有限公司 Light emitting diode and encapsulating method thereof
CN105702841B (en) * 2012-05-18 2018-06-19 东莞市光华电子有限公司 Light emitting diode and its packaging method
CN105655471A (en) * 2012-05-30 2016-06-08 日月光半导体制造股份有限公司 Light emitting diode packaging structure and bearing part thereof
CN102751425B (en) * 2012-05-30 2016-05-04 日月光半导体制造股份有限公司 Encapsulation structure of LED and bearing part thereof
CN102751425A (en) * 2012-05-30 2012-10-24 日月光半导体制造股份有限公司 Light-emitting diode packaging structure and bearing piece thereof
CN105655471B (en) * 2012-05-30 2019-01-18 日月光半导体制造股份有限公司 Encapsulation structure of LED and its load-bearing part
CN113540330A (en) * 2021-07-12 2021-10-22 格力电器(合肥)有限公司 Light-emitting diode

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: FUSHENG PRECISION INDUSTRY CO., LTD.

Free format text: FORMER OWNER: FUSHENG CO., LTD.

Effective date: 20110622

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: NO. 172, SECTION 2 OF NANJING EAST ROAD, TAIPEI CITY, TAIWAN, CHINA TO: NO. 17, GONGYE EAST 9TH ROAD, HSINCHU SCIENCE AND INDUSTRIAL PARK, TAIWAN, CHINA

TR01 Transfer of patent right

Effective date of registration: 20110622

Address after: No. nine, industrial East Road, Hsinchu Science Industrial Park, Taiwan, China. 17

Patentee after: FUSHENG PRECISION INDUSTRY CO., LTD.

Address before: Taipei, Taiwan, China Nanjing East Road, paragraph 172, No. 2

Patentee before: Fusheng Co., Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20100616