CN113540330A - Light-emitting diode - Google Patents
Light-emitting diode Download PDFInfo
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- CN113540330A CN113540330A CN202110783720.XA CN202110783720A CN113540330A CN 113540330 A CN113540330 A CN 113540330A CN 202110783720 A CN202110783720 A CN 202110783720A CN 113540330 A CN113540330 A CN 113540330A
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- emitting diode
- light
- led
- welding
- solder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a light-emitting diode, wherein solder masks are arranged on an anode region and a cathode region on a bonding pad of the light-emitting diode. According to the light-emitting diode provided by the invention, the production process is adjusted, the solder mask is added to prevent failure caused by solder paste infiltration in the welding process, the welding spot reliability is improved by adopting modes of adding gold balls, silver paste reinforcement and the like for the problems of second welding spot desoldering and the like, the use effect is not influenced while the reliability of the light-emitting diode is improved, and the practicability is high.
Description
Technical Field
The invention relates to the technical field of light-emitting diode structure design, in particular to a light-emitting diode.
Background
Light emitting diodes have been used as a general electronic component in all aspects of life, including daily lighting, electrical displays, and traffic lights. However, with the development of science and technology, new patch structure products with small volume and light weight have become the mainstream trend, so the chip light emitting diode will become the most widely used electronic component in life and production.
A gap is reserved between the currently used light emitting diode epoxy resin and a copper substrate, the sealing performance is poor, and due to the large difference of the thermal expansion coefficients of the two materials, the resin is stressed and deformed in a high-temperature welding state, and the gap is further increased. If the too much tin of printing tin volume can climb to copper base plate and resin combination department along gap and copper base plate infiltration inside, because tin stress produces the effect to the resin, the crack can further aggravate, if the resin crack reaches the holding power that the certain degree surpassed the solder joint, the solder joint can appear desoldering and gold thread broken string scheduling problem to the second is bound, thereby lead to the device inefficacy, even resume normal diode after the cooling probably not become invalid at once, there is also the unstable factor, emitting diode's reliability and life-span shorten by a wide margin, the paster diode repaiies failure rate very high in addition, repair temperature and the unable accurate control of tin volume, seriously influence emitting diode's reliability.
Disclosure of Invention
The technical problem to be solved by the invention is to overcome the defects of the prior art, and provide the light-emitting diode, which is adjusted from the production process, increases a solder mask layer to prevent failure caused by solder paste infiltration in the welding process, adopts a mode of adding gold balls and silver paste for reinforcement on the problems of second welding spot desoldering and the like to improve the reliability of the welding spot, does not influence the use effect while improving the reliability of the light-emitting diode, and has strong practicability.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
a solder mask layer is arranged on the positive electrode area and the negative electrode area of a bonding pad of the light-emitting diode.
According to the light-emitting diode, the solder mask layer is additionally arranged on the positive electrode and the negative electrode of the bonding pad, so that the bonding pad and the boxwood resin can be effectively isolated, the phenomenon that the bonding pad creeps too much tin in the welding process and penetrates into the interior along the support to generate tin stress to cause resin cracking to damage a device is effectively prevented, the product reliability of the sealing effect of the light-emitting diode is improved, the problem of resin cracking caused by the tin stress is thoroughly solved, a mainboard is not required to be scrapped even if the diode needs to be repaired, and the product cost and the quality cost can be effectively reduced.
With respect to the above technical solution, further improvements as described below can be made.
In a preferred embodiment of the light emitting diode according to the present invention, the solder resist layer is a printed ink layer.
The positive and negative polarity marks and the solder mask of the surface mount light-emitting diode are completed in a bilateral silk-screen printing mode, a new process and a new die are not needed to be added, the surface mount light-emitting diode is only printed once on the original basis, the operation is simple and convenient, the surface mount light-emitting diode is baked after the printing is completed, the curing of the ink of the solder mask is promoted, the stable solder mask is formed, the infiltration of solder paste can be prevented even in the welding process can be effectively guaranteed, and the effect of improving the reliability of the light-emitting diode product is achieved to a great extent.
Specifically, in a preferred embodiment, the width of the solder mask layer is 0.1-0.13 mm.
The solder mask structure within the width range can well play a role in preventing solder paste from permeating, and can avoid influencing the existing structure of the light-emitting diode as far as possible and save cost.
Specifically, in a preferred embodiment, the thickness of the solder mask layer is 70-100 um.
The solder mask structure within the thickness range can well play a role in preventing solder paste from permeating, and can avoid influencing the existing structure of the light-emitting diode as far as possible and save cost.
Further, in a preferred embodiment, a first fixing structure is additionally arranged at a second welding point where a gold wire of the light emitting diode is combined with the bonding pad.
The bonding force between the gold wire and the bonding pad can be improved by adding the first fixing structure on the second welding point.
Specifically, in a preferred embodiment, a second fixation structure is added to the first fixation structure.
By further adding the second fixing structure, the bonding area between the first fixing structure and the welding spot can be further increased.
In particular, in a preferred embodiment, the first fixation structure comprises a gold ball seeded at the second solder joint.
The method is characterized in that a manner similar to fishtail ending is adopted for welding a second welding spot bound by a gold thread, the gold thread needs to be subjected to pressure extension welding, the welding effect and consistency are difficult to guarantee, the actual welding area and the welding quality are reduced after the chopper is used for a certain time, the probability of desoldering and stress release exists, the most easily split point is the joint of the gold thread and the welding spot when the gold thread is stressed, a gold ball welding ending manner is adopted, the gold thread is directly subjected to ball welding with the actual gold thread at the welding spot, the gold thread does not need to be extended, the stress area of the joint is basically close to the diameter of the gold thread, the possibility of damage does not exist, the area consistency and the reliability of the joint surface welded with a support can be effectively guaranteed, and the stress tensile strength and the welding bonding force are improved.
In particular, in a preferred embodiment, the second fixation structure is a dotted silver paste layer.
The second welding spot welding mode adopts welding spot point silver paste to reinforce the end, can increase gold ball and welding spot combined area, further improves the welding spot reliability to further improve the life of emitting diode product.
Further, in a preferred embodiment, the positive and negative electrode copper support resin packages of the light emitting diode and the pad transition region are provided with a groove structure.
Increase the groove structure in resin encapsulation and device pad encapsulation transition region, can improve device resin and copper support cohesion, improve the high temperature deformation resistance ability of resin and leakproofness, can further ensure effectively to solve the problem that the support extends the infiltration body inside along the tin climbing height.
Further, in a preferred embodiment, the trench structure includes two or more sets.
Through setting up multichannel slot structure, can improve device resin and copper support cohesion to a great extent, improve the high temperature deformation resistance ability of resin and leakproofness.
Compared with the prior art, the invention has the advantages that: from the production technology go up the adjustment, increase the solder mask and stop the inefficacy that the solder paste infiltration leads to among the welding process, take to increase modes such as kind gold ball, silver thick liquid reinforcement and improve the solder joint reliability to second solder joint desoldering scheduling problem, do not influence the result of use when promoting emitting diode's reliability, the practicality is strong.
Drawings
The invention will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:
fig. 1 schematically shows the overall structure of a light emitting diode of an embodiment of the present invention;
FIG. 2 schematically illustrates a printing stencil for a light emitting diode according to an embodiment of the present invention;
FIG. 3 is a view schematically showing a bonding structure of a gold wire in the embodiment of the invention;
FIG. 4 is a schematic diagram showing a top view of a bonding structure of a gold wire in the embodiment of the present invention;
FIG. 5 is a front view schematically showing a bonding structure of a gold wire in the embodiment of the invention;
fig. 6 schematically shows the overall structure of a light emitting diode of an embodiment of the present invention;
fig. 7a to d schematically show the experimental results of an electrical durability test, a constant current test, a cold and hot shock test, and a high temperature moisture test of the light emitting diode according to the embodiment of the present invention in this order.
In the drawings, like parts are provided with like reference numerals. The figures are not drawn to scale.
Detailed Description
The invention will be further explained in detail with reference to the figures and the embodiments without thereby limiting the scope of protection of the invention.
Fig. 1 schematically shows the overall structure of a light emitting diode 10 according to an embodiment of the present invention. Fig. 2 schematically shows a printing stencil of the light emitting diode 10 of the embodiment of the present invention. Fig. 3 schematically shows a bonding structure of a gold wire in the embodiment of the present invention. Fig. 4 schematically shows a top view of a bonding structure of a gold wire in the embodiment of the present invention. Fig. 5 schematically shows a front view of a bonding structure of a gold wire in the embodiment of the present invention. Fig. 6 schematically shows the overall structure of the light emitting diode 10 of the embodiment of the present invention. Fig. 7a to d schematically show the experimental results of an electrical durability test, a constant current test, a cold and hot shock test, and a high temperature moisture test of the light emitting diode 10 according to the embodiment of the present invention in this order.
As shown in fig. 1 and 2, in a light emitting diode 10 according to an embodiment of the present invention, solder resists 1 are provided on positive and negative electrode regions on a pad of the light emitting diode 10. According to the light-emitting diode provided by the embodiment of the invention, the solder mask layer is additionally arranged on the positive electrode and the negative electrode of the bonding pad, so that the bonding pad and the boxwood resin can be effectively isolated, the phenomenon that the bonding pad creeps too much tin in the welding process and penetrates into the interior along the support to generate tin stress to cause resin cracking to damage a device is effectively prevented, the product reliability of the sealing effect of the light-emitting diode is improved, the problem of resin cracking caused by the tin stress is thoroughly solved, a mainboard is not required to be scrapped even if the diode needs to be repaired, and the product cost and the quality cost can be effectively reduced.
As shown in fig. 1 and 2, specifically, in the present embodiment, the solder resist layer 1 is a printed ink layer. The positive and negative polarity marks and the solder mask of the surface mount light-emitting diode are completed in a bilateral silk-screen printing mode, a new process and a new die are not needed to be added, the surface mount light-emitting diode is only printed once on the original basis, the operation is simple and convenient, the surface mount light-emitting diode is baked after the printing is completed, the curing of the ink of the solder mask is promoted, the stable solder mask is formed, the infiltration of solder paste can be prevented even in the welding process can be effectively guaranteed, and the effect of improving the reliability of the light-emitting diode product is achieved to a great extent. Specifically, in the present embodiment, the solder resist layer 1 has a width of 0.1 to 0.13 mm. The solder mask structure within the width range can well play a role in preventing solder paste from permeating, and can avoid influencing the existing structure of the light-emitting diode as far as possible and save cost. Specifically, in a preferred embodiment, the thickness of the solder mask layer is 70-100 um. The solder mask structure within the thickness range can well play a role in preventing solder paste from permeating, and can avoid influencing the existing structure of the light-emitting diode as far as possible and save cost.
As shown in fig. 3 to fig. 5, in this embodiment, a first fixing structure is additionally disposed at a second solder joint where a gold wire of the light emitting diode 10 is bonded to the pad. The bonding force between the gold wire and the bonding pad can be improved by adding the first fixing structure on the second welding point. Specifically, in the present embodiment, the first fixing structure includes a gold ball 2 seeded at the second bonding site. The method is characterized in that a manner similar to fishtail ending is adopted for welding a second welding spot bound by a gold thread, the gold thread needs to be subjected to pressure extension welding, the welding effect and consistency are difficult to guarantee, the actual welding area and the welding quality are reduced after the chopper is used for a certain time, the probability of desoldering and stress release exists, the most easily split point is the joint of the gold thread and the welding spot when the gold thread is stressed, a gold ball welding ending manner is adopted, the gold thread is directly subjected to ball welding with the actual gold thread at the welding spot, the gold thread does not need to be extended, the stress area of the joint is basically close to the diameter of the gold thread, the possibility of damage does not exist, the area consistency and the reliability of the joint surface welded with a support can be effectively guaranteed, and the stress tensile strength and the welding bonding force are improved.
As shown in fig. 4 and 5, in the present embodiment, a second fixing structure is additionally provided to the first fixing structure. By further adding the second fixing structure, the bonding area between the first fixing structure and the welding spot can be further increased. Specifically, in the present embodiment, the second fixing structure is a dotted silver paste layer 3. The second welding spot welding mode adopts welding spot point silver paste to reinforce the end, can increase gold ball and welding spot combined area, further improves the welding spot reliability to further improve the life of emitting diode product.
As shown in fig. 6, in the present embodiment, a groove structure 4 is disposed in the transition region between the positive and negative copper frame resin packages and the bonding pad of the light emitting diode. Increase the groove structure in resin encapsulation and device pad encapsulation transition region, can improve device resin and copper support cohesion, improve the high temperature deformation resistance ability of resin and leakproofness, can further ensure effectively to solve the problem that the support extends the infiltration body inside along the tin climbing height. Further, in the present embodiment, the trench structure 4 includes two or more sets. Through setting up multichannel slot structure, can improve device resin and copper support cohesion to a great extent, improve the high temperature deformation resistance ability of resin and leakproofness.
As shown in fig. 7a to d, the light emitting diode according to the embodiment of the invention performs an electrical durability test, a constant current test, a cold and hot shock test and a high temperature and moisture test according to the requirements of the enterprise standard QJ/GD 12.10.033, and the parameter performance during the test after the test completely meets the requirements of the enterprise standard.
According to the embodiment, the light-emitting diode is adjusted from the aspect of production technology, the solder mask is added to prevent failure caused by solder paste infiltration in the welding process, the reliability of the welding spot is improved by adopting the modes of adding gold balls, silver paste reinforcement and the like for the problems of desoldering of the second welding spot, the reliability of the light-emitting diode is improved, the using effect is not influenced, and the practicability is high.
While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. It is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. The light-emitting diode is characterized in that solder masks are arranged on the positive electrode area and the negative electrode area of a bonding pad of the light-emitting diode.
2. The led of claim 1, wherein said solder mask is a printed ink layer.
3. The light-emitting diode according to claim 1 or 2, wherein the solder resist layer has a width of 0.1 to 0.13 mm.
4. The light-emitting diode according to claim 1 or 2, wherein the solder resist layer has a thickness of 70 to 100 um.
5. The LED of claim 1 or 2, wherein a first fixing structure is additionally arranged at a second welding point where a gold wire of the LED is combined with the bonding pad.
6. The LED of claim 5, wherein a second fixation structure is added to the first fixation structure.
7. The led of claim 6, wherein said first mounting structure comprises gold balls seeded at said second pads.
8. The led of claim 7, wherein said second fastening structure is a dotted silver paste layer.
9. The light-emitting diode according to claim 1 or 2, wherein the transition region between the positive and negative copper support resin packages and the bonding pad of the light-emitting diode is provided with a groove structure.
10. The led of claim 9, wherein the trench structures comprise more than two sets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110783720.XA CN113540330A (en) | 2021-07-12 | 2021-07-12 | Light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110783720.XA CN113540330A (en) | 2021-07-12 | 2021-07-12 | Light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113540330A true CN113540330A (en) | 2021-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110783720.XA Pending CN113540330A (en) | 2021-07-12 | 2021-07-12 | Light-emitting diode |
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| CN (1) | CN113540330A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201508851U (en) * | 2009-09-04 | 2010-06-16 | 复盛股份有限公司 | LED bracket structure |
| CN201725810U (en) * | 2010-03-16 | 2011-01-26 | 深圳市汇大光电科技有限公司 | Packaging structure of high-power LED |
| CN104953004A (en) * | 2014-03-27 | 2015-09-30 | 江苏稳润光电有限公司 | High-reliability LAMP light-emitting diode packaging technology |
| CN212365984U (en) * | 2020-05-20 | 2021-01-15 | 珠海格力电器股份有限公司 | Sheet-shaped LED structure, integrated circuit, lighting device and electric appliance |
-
2021
- 2021-07-12 CN CN202110783720.XA patent/CN113540330A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201508851U (en) * | 2009-09-04 | 2010-06-16 | 复盛股份有限公司 | LED bracket structure |
| CN201725810U (en) * | 2010-03-16 | 2011-01-26 | 深圳市汇大光电科技有限公司 | Packaging structure of high-power LED |
| CN104953004A (en) * | 2014-03-27 | 2015-09-30 | 江苏稳润光电有限公司 | High-reliability LAMP light-emitting diode packaging technology |
| CN212365984U (en) * | 2020-05-20 | 2021-01-15 | 珠海格力电器股份有限公司 | Sheet-shaped LED structure, integrated circuit, lighting device and electric appliance |
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Application publication date: 20211022 |