CN211083759U - Embedded L ED light source module - Google Patents

Abstract

The utility model provides an embedded L ED light source module, which comprises a Printed Circuit Board (PCB), the surface is equipped with the recess that is used for pasting L ED chip, the printing has the circuit that matches with L ED chip in the recess, many flip-chip L ED chips, according to predetermineeing the rule solid in the recess of PCB, light emitting area one side of L ED chip is towards the recess outside, locate L ED chip luminous side surface's fluorescent film piece, locate L ED chip high reverse glue around, and fill the silica gel in the recess, it combines with the bottom plate with embedded form, the lamp pearl is because of receiving mechanical collision among the effective prior art, the bad condition of outward appearance appears of manual operation etc. causes, the cost of bottom plate raw material and paster has been saved simultaneously, the outward appearance and the durability of module have been promoted.

Description

Embedded L ED light source module

Technical Field

The utility model belongs to the technical field of the L ED technique and specifically relates to a L ED light source module.

Background

L ED is a brand new light source, and is increasingly integrated into people's lives, at present, L ED module is generally realized by sticking L ED lamp beads on the Surface of PCB, however, in this process, L ED lamp beads are completely exposed on the Surface of PCB, silica gel on the Surface of L ED lamp beads is generally softer, SMT (Surface Mounted Technology) process and L ED module installation process are easy to be touched on L ED lamp beads, which causes white glue to fall off, and affects appearance and performance, etc. furthermore, L ED lamp beads are generally ceramic base plates, and have brittle characteristics, and are easily affected by external stress in SMT stage and client installation L ED module stage, which causes serious deformation and even cracking of ceramic base plates, and causes electric leakage of L ED chips.

SUMMERY OF THE UTILITY MODEL

In order to overcome not enough above, the utility model provides an embedded L ED light source module effectively solves current L ED light source module and influences the technical problem of outward appearance, performance etc. because of the collision.

The utility model provides a technical scheme does:

an embedded L ED light source module, comprising:

the PCB (Printed Circuit Board) is provided with a groove for mounting L ED chips on the surface, and a Circuit matched with the L ED chips is Printed in the groove;

a plurality of L ED chips which are reversely mounted are fixed in the grooves of the PCB according to a preset rule, and one side of the light emitting surface of the L ED chip faces the outer sides of the grooves;

a fluorescent film sheet arranged on the light-emitting side surface of the L ED chip;

high reverse adhesive arranged around the L ED chip, and

and the silica gel is filled in the groove.

The utility model provides an embedded L ED light source module, set up the recess in PCB, with L ED chip direct solid brilliant go on encapsulating behind the recess of PCB inside, combine with embedded form and bottom plate completely with this lamp pearl, effectively avoided among the prior art lamp pearl because of receiving mechanical collision, manual operation etc. cause the bad condition of outward appearance to appear, the cost of bottom plate former material and paster has been saved simultaneously, the outward appearance and the durability of module have been promoted, to ceramic bottom plate's L ED chip, the condition that the fracture can not appear in SMT stage and customer end installation L ED module stage yet.

Drawings

Fig. 1 is a schematic structural view of a middle embedded L ED light source module of the present invention;

FIG. 2 is a schematic structural diagram of a PCB surface circuit;

FIG. 3 is a schematic structural diagram of further printing ink on the ink area on the PCB surface after the circuit is laid;

FIG. 4 is a schematic structural diagram of further preparing a pad layer on a pad region of the PCB surface after printing ink;

fig. 5 is a schematic diagram of the substrate after the pad area is prepared.

Reference numerals:

1-PCB, 2-groove, 3-L ED chip, 4-fluorescent film, 5-high reverse glue, 6-silica gel, 7-circuit area, 8-ink area and 9-pad area.

Detailed Description

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will explain specific embodiments of the present invention with reference to the accompanying drawings. It is obvious that the drawings in the following description are only examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be obtained from these drawings without inventive effort.

As shown in FIG. 1, the structure of the embedded L ED light source module according to the present invention is schematically illustrated, and as can be seen from the drawing, the L ED light source module includes a PCB1 having a groove 2 for mounting a L ED chip 3 on the surface thereof, wherein a circuit matching with the L ED chip 3 is printed in the groove 2, a plurality of flip-chip L ED chips 3 fixed in the groove 2 of the PCB1 according to a predetermined rule, wherein one side of the light emitting surface of the L ED chip 3 faces the outside of the groove 2, a fluorescent film 4 disposed on the light emitting side surface of the L ED chip 3, a high-reflection adhesive 5 disposed around the L ED chip 3, and a silica gel 6 filled in the groove 2.

The size, the shape, the depth and the like of the groove 2 on the PCB1 are not particularly limited, and in practical application, the size, the shape, the depth and the like are determined according to application requirements, when the number of L ED chips 3 to be packaged is large, the size of the groove 2 is larger, when the number of L ED chips 3 to be packaged is small, the size of the groove 2 is smaller, when the L ED chips 3 to be packaged is required to be in a strip shape, the strip-shaped groove 2 is formed, when the L ED chips 3 are required to be packaged to be in a square shape, the square-shaped groove 2 is formed, and the like, in other implementation modes, irregular grooves can be formed according to practical requirements, in order to avoid that the silicon gel 6, the fluorescent film 4 and the like are exposed outside the groove 2 and do not influence the light emission of the L ED chips 3, and the depth of the groove 2 is slightly higher than or equal to the height of the L ED.

In the packaging process, firstly, L ED chip 3 is fixed in a corresponding position in the groove 2 in a die-bonding mode, then further packaging is carried out, and the steps of adhering high-reflection glue (white glue with high reflectivity) around the L ED chip 3, adhering a fluorescent membrane 4 on the surface of the L ED chip 3, filling silica gel 6 in the groove 2 and the like are included.

Fig. 2 to 5 are schematic structural diagrams of a circuit, ink, a pad and the like laid on the surface of a PCB in an example, where fig. 2 is a schematic structural diagram of a circuit laid on the surface of a PCB, specifically, after a groove 2 is formed in the center of the PCB, a circuit is laid in a circuit area 7, the circuit area covers the groove, the pad area and the like, and separates an N electrode area and a P electrode area of an L ED chip, fig. 3 is a schematic structural diagram of ink printing in an ink area 8 on the surface of the PCB after the circuit is laid, the ink area covers all areas except the groove and the pad area of the surface of the PCB, fig. 4 is a schematic structural diagram of a pad layer prepared in a pad area 9 on the surface of the PCB after the ink is printed, where the pad area 9 in the groove is used for welding a L ED chip, and the pad area outside the groove is used for connecting an external power line, and fig. 5 is a schematic structural.

The embedded L ED light source module structure greatly improves the product adverse condition of the module in the prior art due to overlarge stress, compared with the traditional lamp bead, the embedded light source can better protect the lamp bead from being damaged easily, the module process steps are optimized, the SMT printing patch backflow process step is not needed to be completed, and the lamp bead packaging cost and the patch cost are greatly reduced.

It should be noted that the above embodiments can be freely combined as necessary. The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (3)

1. An embedded L ED light source module, comprising:

the surface of the PCB is provided with a groove for mounting an L ED chip, and a circuit matched with the L ED chip is printed in the groove;

a plurality of L ED chips which are reversely mounted are fixed in the grooves of the PCB according to a preset rule, and one side of the light emitting surface of the L ED chip faces the outer sides of the grooves;

a fluorescent film sheet arranged on the light-emitting side surface of the L ED chip;

high reverse adhesive arranged around the L ED chip, and

and the silica gel is filled in the groove.

2. The embedded L ED light source module of claim 1, wherein the top surface of the high-reflectivity adhesive is flush with the light-emitting side surface of the L ED chip.

3. The embedded L ED light source module as claimed in claim 1 or 2, wherein the upper surface of the silicone rubber is flush with the upper surface of the fluorescent film and level with the height of the PCB groove.

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