CN201471857U - Thermal printer head - Google Patents
Thermal printer head Download PDFInfo
- Publication number
- CN201471857U CN201471857U CN2009203094700U CN200920309470U CN201471857U CN 201471857 U CN201471857 U CN 201471857U CN 2009203094700 U CN2009203094700 U CN 2009203094700U CN 200920309470 U CN200920309470 U CN 200920309470U CN 201471857 U CN201471857 U CN 201471857U
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- CN
- China
- Prior art keywords
- ceramic substrate
- heat sink
- groove
- printer head
- thermal printer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a thermal printer head for thermal printers, which comprises a ceramic substrate and a heat-dissipating plate, and the ceramic substrate is provided with an integrated circuit, a gold wire, a packaging rubber layer and output terminals. The thermal printer head has the following characteristics that: a double-sided high-temperature adhesive tape is arranged on the ceramic substrate, the heat-dissipating plate is provided with recesses, in which resin glue is arranged, and the ceramic substrate is connected with the heat-dissipating plate by the double-sided high-temperature adhesive tape and the resin glue. The ceramic substrate is uniformly bonded with the heat-dissipating plate, the bonding force is large, consequently, the operation reliability of the thermal printer head is improved, and the printing effect of the thermal printer head is enhanced.
Description
Technical field
The utility model relates to printer, at length says it is a kind of thermal printing head.
Background technology
At present, thermal printing head (thermalprint head, be called for short TPH) generally be on insulated substrate, to adopt methods such as thick film or film to form heating resistor and electrode cable, by packaging technology insulated substrate, integrated circuit, spun gold, packaging plastic, output and heat sink are connected, form thermal printing head.
Insulated substrate adopts ceramic material, being connected between insulated substrate and heat sink adopts high temperature two-sided tape or the gluing mode that connects of resin bonding to connect, the advantage that adopts high temperature two-sided tape mode to connect is bonding even, shortcoming is that bonding force is little, influences the functional reliability of thermal printing head under the abominable service condition; Adopting the gluing mode advantage that connects of resin bonding is that bonding force is big, and shortcoming is that crawling is even because the flowability of resin bonding glue is poor, cause between ceramic substrate and heat sink and have the space, the existence in during printing because space makes that heat radiation is inhomogeneous, thereby causes printing inhomogeneous.
Summary of the invention:
The purpose of this utility model is to solve above-mentioned the deficiencies in the prior art, provide bonding evenly, thermal printing head that bonding force is big.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of thermal printing head comprises ceramic substrate and heat sink, and ceramic substrate is provided with integrated circuit, spun gold, encapsulation glue-line and lead-out terminal, it is characterized in that ceramic substrate is connected with heat sink with the resin bonding glue-line by two-sided high temperature gummed tape.
The utility model ceramic substrate is provided with two-sided high temperature gummed tape, heat sink is provided with groove, injection has resin bonding glue in the groove, and ceramic substrate is connected with heat sink with the resin bonding glue-line by two-sided high temperature gummed tape, make ceramic substrate be connected with heat sink evenly, firm.
The utility model further groove generally is located on the heat sink of ceramic substrate end, groove is provided with resin bonding glue inlet, resin bonding glue inlet can be provided with separately, the part of the groove on the heat sink is exposed at outside the ceramic substrate, and the limit mouth of using groove is as resin bonding glue inlet.
The utility model on heat sink, have can the injecting resin bonded adhesives notch, link to each other by two-sided high temperature gummed tape and resin bonding glue-line dual mode between ceramic substrate and heat sink, make between ceramic substrate and heat sink both bonding evenly, bonding force is big again, improve the reliability of thermal printing head work, improve the printing effect of thermal printing head.
Description of drawings
Fig. 1 is a kind of structural representation of the present utility model
Fig. 2 is the right view of Fig. 1
Fig. 3 is the vertical view of Fig. 1
Mark among the figure: heat sink 1, insulated substrate 2, encapsulation glue-line 3, rubber roll 4, paper 5, high temperature two-sided tape 6, resin bonding glue 7, groove 8, lead-out terminal 9.
The specific embodiment:
Below in conjunction with accompanying drawing the utility model is further described:
A kind of thermal printing head, comprise ceramic substrate 2 and heat sink 1, ceramic substrate 2 is provided with integrated circuit, spun gold, encapsulation glue-line 3 and lead-out terminal 9, above-mentioned same as the prior art, this does not give unnecessary details, the ceramic substrate 2 that is characterised in that of the present utility model is provided with two-sided high-temp glue belt 6, heat sink 1 is provided with groove 8, groove 8 can be square, circular, also can be triangular in shape, " T " font etc., injection has resin bonding glue 7 in the groove 8, ceramic substrate 2 is connected with heat sink 1 with resin bonding glue-line 7 by two-sided high temperature gummed tape 6, ceramic substrate 2 is connected with heat sink 1 evenly, firmly, groove 8 described in the utility model generally is located on the heat sink 1 of ceramic substrate 2 ends, groove 8 is provided with resin bonding glue inlet, resin bonding glue inlet can be provided with separately, be connected with groove 8 by hand-hole, 8 parts of the groove on the heat sink 1 are exposed at outside the ceramic substrate 1, with the limit mouth of groove 8 as resin bonding glue inlet, the utility model on heat sink, have can the injecting resin bonded adhesives notch, link to each other by two-sided high temperature gummed tape and resin bonding glue dual mode between ceramic substrate and heat sink, make between ceramic substrate and heat sink both bonding evenly, bonding force is big again, improve the reliability of thermal printing head work, improve the printing effect of thermal printing head.
Claims (3)
1. a thermal printing head comprises ceramic substrate and heat sink, and ceramic substrate is provided with integrated circuit, spun gold, encapsulation glue-line and lead-out terminal, it is characterized in that ceramic substrate is connected with heat sink with the resin bonding glue-line by two-sided high temperature gummed tape.
2. a kind of thermal printing head according to claim 1, it is characterized in that ceramic substrate is provided with two-sided high temperature gummed tape, heat sink is provided with groove, injects resin bonding glue in the groove, and ceramic substrate is connected with heat sink with the resin bonding glue-line by two-sided high temperature gummed tape.
3. a kind of thermal printing head according to claim 2 is characterized in that groove is located on the heat sink of ceramic substrate end, and heat sink is provided with groove resin bonding glue inlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009203094700U CN201471857U (en) | 2009-09-02 | 2009-09-02 | Thermal printer head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009203094700U CN201471857U (en) | 2009-09-02 | 2009-09-02 | Thermal printer head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201471857U true CN201471857U (en) | 2010-05-19 |
Family
ID=42408102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009203094700U Expired - Lifetime CN201471857U (en) | 2009-09-02 | 2009-09-02 | Thermal printer head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201471857U (en) |
-
2009
- 2009-09-02 CN CN2009203094700U patent/CN201471857U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 264200 Torch Road, hi tech Industrial Development Zone, Shandong, Weihai 159 Patentee after: SHANDONG HUALING ELECTRONICS CO., LTD. Address before: 264209 Weihai high tech Industrial Development Zone, Shandong Torch Road, No. 159 Patentee before: Hualing Electronics Co., Ltd., Shandong |
|
| CX01 | Expiry of patent term |
Granted publication date: 20100519 |
|
| CX01 | Expiry of patent term |