CN201471856U - Thermal printer head - Google Patents
Thermal printer head Download PDFInfo
- Publication number
- CN201471856U CN201471856U CN2009203093888U CN200920309388U CN201471856U CN 201471856 U CN201471856 U CN 201471856U CN 2009203093888 U CN2009203093888 U CN 2009203093888U CN 200920309388 U CN200920309388 U CN 200920309388U CN 201471856 U CN201471856 U CN 201471856U
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- CN
- China
- Prior art keywords
- heating resistor
- heating
- printing head
- thermal printing
- resistance value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
A thermal printer head comprises at least two monomer printer heads which consist of an insulating base plate, a heating resistor body, an electrode lead and an encapsulation adhesive layer, and are spliced on a heating panel; the thermal printer head is characterized in that a resistance value of the heating resistor body at the end part of the splicing end of the insulating base plate is changed into a value smaller than that of the heating resistor bodies at other parts. In the utility model, the resistance value of the heating resistor body at the end part of the splicing end of the insulating base plate is changed into a value smaller than that of the heating resistor bodies at other parts, as the resistance value at the point is smaller than that of other points, the heating amount is more than that of other points when in printing, thus resulting that the printing point is larger than other points, reducing or eliminating the gaps between printing letters, and improving the printing quality.
Description
Technical field
The utility model relates to thermal printer, at length says it is a kind of thermal printing head.
Background technology
At present, thermal printing head (thermalprint head, be called for short TPH) generally be on insulated substrate, to adopt methods such as thick film or film to form resistance, identical heating resistor and the electrode cable in interval, by packaging technology insulated substrate, integrated circuit, spun gold, packaging plastic, output and heat sink are connected, form thermal printing head.
Insulated substrate adopts ceramic material, owing to be subjected to equipment and process limitation, the general maximum of its effective print length is accomplished 256mm, in order to overcome this deficiency, increase print length, the way of taking to carry out the substrate splicing on a long size heat sink is assembled more, earlier with the bonding integrated circuit of going up of a plurality of separate unit ceramic substrates, spun gold, the encapsulation glue-line, then ceramic substrate is bonded on the long size thermal printing head heat sink, though can increase effective print length like this, but the splicing precision is low, and splicing gap and difference in height problem between substrate affect print quality always.
Summary of the invention:
The purpose of this utility model is to solve above-mentioned the deficiencies in the prior art, and a kind of precision height, thermal printing head that print quality is good of splicing is provided.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of thermal printing head, comprise that at least two monomer printheads of being made up of insulated substrate, heating resistor, electrode cable, encapsulation glue-line splice on heat sink, it is characterized in that end-heating resistive element resistance with the insulated substrate splice ends is modified to the heating resistor less than other position, the thick film or the film that is to say the insulated substrate splice ends are narrow, and the heating resistor resistance of other heat generating spots of heating resistor resistance value ratio of splicing end points is little by 5% to 40%.
The utility model is modified to heating resistor less than other position with the end-heating resistive element resistance of insulated substrate splice ends, because this resistance value is put little than other, so heating is more than other some heatings when printing, cause print point bigger than other points, thereby reduce or eliminate the lettering gap, improve print quality.
Description of drawings
Fig. 1 is the structural representation of the technology of the present invention.
Fig. 2 is that the technology of the present invention is printed schematic diagram
Mark among the figure: heat sink 1, insulated substrate 2, encapsulation glue-line 3, rubber roll 4, paper 5, heating resistor 6, end-heating resistive element 7.
The specific embodiment:
Below in conjunction with accompanying drawing the utility model is further described:
A kind of thermal printing head comprises that at least two monomer printheads of being made up of insulated substrate 2, heating resistor 6, encapsulation glue-line 3 and electrode cable splice on heat sink 1.The monomer printhead generally is to form ground glaze layer on insulated substrate 2, on ground glaze layer and substrate, adopt methods such as thick film or film to form electrode cable and heating resistor 6, by packaging technology insulated substrate, integrated circuit, spun gold, packaging plastic 3, output and heat sink are connected, form thermal printing head, the structure of monomer printhead and splicing are same as the prior art in the mode of heat sink 1, and this does not give unnecessary details.Spliced thermal printing head can be realized long size lettering.This mode shortcoming is that the splicing back is because the existence of piece causes existing the lettering gap, influence print quality, of the present utility modelly be characterised in that end-heating resistive element 7 resistances with insulated substrate 2 splice ends are modified to the heating resistor 6 less than other position, the heat formula of the utility model institute foundation is:
Mark in the above-mentioned formula: E caloric value, U print voltage, T time-write interval, R heating resistor resistance.
The utility model is modified to heating resistor less than other position with the heating resistor resistance of insulated substrate splice ends, because this resistance value is put little than other, the thick film or the film that is to say the insulated substrate splice ends are narrow, make its resistance little, so heating is more than other some heatings when printing, cause print point bigger, thereby reduce or eliminates lettering gap, raising print quality than other points.
Engagement positions is adjusted separate unit thermal printing head spacing.Two adjacent ceramic height difference H also can be adjusted by increase adjusting pad 8 between monomer heat sink and long size heat sink.
The long size thermal printing head that splices with this mode of mistake has splicing precision height, can adjust the splicing difference in height.Thereby reduce splicing place lettering gap, improve the advantage of lettering quality.Breakage takes place as product in the thermal printing head that adopts mode of the present invention to assemble simultaneously, can change the monomer printhead of breakage easily, and need not scrap long size thermal printing head integral body.
More than diagram only describes with the thermal printing head splicing growth size thermal printing head of two monomers.Many thermal printing head connecting methods are identical, also should be considered as protection domain of the present utility model.
Claims (2)
1. thermal printing head, comprise at least two monomer printheads splicings of being made up of insulated substrate, heating resistor, electrode cable, encapsulation glue-line on heat sink, the end-heating resistive element resistance that it is characterized in that the insulated substrate splice ends is modified to the heating resistor less than other position.
2. thermal printing head according to claim 1 is characterized in that the heating resistor resistance of other heat generating spots of end-heating resistive element resistance value ratio is little by 5% to 40%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009203093888U CN201471856U (en) | 2009-09-01 | 2009-09-01 | Thermal printer head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009203093888U CN201471856U (en) | 2009-09-01 | 2009-09-01 | Thermal printer head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201471856U true CN201471856U (en) | 2010-05-19 |
Family
ID=42408101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009203093888U Expired - Lifetime CN201471856U (en) | 2009-09-01 | 2009-09-01 | Thermal printer head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201471856U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102529415A (en) * | 2010-11-02 | 2012-07-04 | Tdk株式会社 | Thermosensitive head and thermosensitive printer employing the same |
| CN108016141A (en) * | 2017-12-07 | 2018-05-11 | 山东华菱电子股份有限公司 | A kind of thermal printing head repaiies resistance method |
-
2009
- 2009-09-01 CN CN2009203093888U patent/CN201471856U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102529415A (en) * | 2010-11-02 | 2012-07-04 | Tdk株式会社 | Thermosensitive head and thermosensitive printer employing the same |
| CN108016141A (en) * | 2017-12-07 | 2018-05-11 | 山东华菱电子股份有限公司 | A kind of thermal printing head repaiies resistance method |
| CN108016141B (en) * | 2017-12-07 | 2019-08-20 | 山东华菱电子股份有限公司 | A kind of thermal printing head repairs resistance method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 264200 Torch Road, hi tech Industrial Development Zone, Shandong, Weihai 159 Patentee after: SHANDONG HUALING ELECTRONICS CO., LTD. Address before: 264209 Weihai high tech Industrial Development Zone, Shandong Torch Road, No. 159 Patentee before: Hualing Electronics Co., Ltd., Shandong |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100519 |