CN201291641Y - Thermal printing head - Google Patents
Thermal printing head Download PDFInfo
- Publication number
- CN201291641Y CN201291641Y CNU2008202254568U CN200820225456U CN201291641Y CN 201291641 Y CN201291641 Y CN 201291641Y CN U2008202254568 U CNU2008202254568 U CN U2008202254568U CN 200820225456 U CN200820225456 U CN 200820225456U CN 201291641 Y CN201291641 Y CN 201291641Y
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- printing head
- thermal printing
- edge part
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a printer, in particular to a thermal printing head; a ceramic substrate and a printed wiring board are spliced on a heat dissipating plate in parallel; an integrated circuit is spliced on the ceramic substrate or the printed wiring board, and the circuit on the ceramic substrate and the circuit on the printed wiring board are connected by a gold wire, and then encapsulation glue is used for encapsulating and protecting the integrated circuit and the gold wire; the thermal printing head is characterized in that: adhesive tapes are formed by the material such as coating resin with a certain specification between the edge part of the side surface of a heating body of the ceramic substrate and the heat dissipating plate; the thermal printing head has the beneficial effects that: as the resin adhesive tape forms a smooth transition on the edge part of the surface of the ceramic substrate, the friction of paper and the ceramic substrate is reduced and the printing effect is improved.
Description
Technical field
The utility model relates to thermal printer, at length says it is a kind of thermal printing head.
Background technology
At present, thermal printing head (thermal print head is called for short TPH) generally comprises formations such as ceramic substrate, printed substrate, heat sink, packaging plastic, integrated circuit, spun gold.
The traditional thermal printhead: normally ceramic substrate and printed substrate are adhered on the heat sink side by side.Integrated circuit is adhered on ceramic substrate or the printed substrate, by spun gold circuit on the ceramic substrate is connected with circuit on the printed substrate; With packaging plastic integrated circuit and spun gold are carried out packaging protection then.
Because ceramic substrate is a ceramic material, it is cut is to form by cutting after the laser boring, and cutting back ceramic base plate surface edge part is comparatively sharp keen, and heat-sensitive paper and ceramic base plate surface edge part produce friction, form cut easily, thereby cause printing effect bad.
Summary of the invention:
Comparatively sharp keen in order to overcome existing product ceramic substrate top surface edge portion, cause the friction of heat-sensitive paper and ceramic base plate surface edge part, form cut easily, thereby cause the bad shortcoming of printing effect, the utility model provides a kind of new thermal printing head, this thermal printing head can obviously reduce because the ceramic surface edge part is sharp keen, and forms the cut phenomenon between heat-sensitive paper, thereby improves printing effect.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of thermal printing head, the ceramic substrate and printed substrate, integrated circuit, spun gold, packaging plastic and the heat sink that are made of insulating materials constitute, on described ceramic substrate, form a plurality of heater resistance, on described printed substrate, be furnished with holding wire, it is characterized in that between ceramic substrate heater side surface edge part and heat sink, scribbling glue-line, the general resin glue that adopts, because resin glue is mobile and smooth and level, resin glue is behind hot setting, form the resin adhesive tape, adhesive tape exceeds ceramic substrate, and the height that adhesive tape exceeds is 0 to 1mm.Adhesive tape and ceramic base plate surface edge part form the transition of a slyness, and the cross section of adhesive tape is smooth arc, improving the surface state of ceramic base plate surface edge part, thereby improve printing effect.
The beneficial effects of the utility model are, this thermal printing head can obviously reduce because the ceramic base plate surface edge part is sharp keen, heat-sensitive paper and the friction of ceramic base plate surface edge part, form cut easily, cause the bad phenomenon of printing effect, thereby improve printing effect, and simple in structure, realize easily.
Description of drawings
Fig. 1 is the structural representation of background technology.
Fig. 2 is the right view of Fig. 1.
Fig. 3 structural representation of the present utility model.
Fig. 4 is the right view of Fig. 3.
Mark among the figure: ceramic substrate 1, printed substrate 2, heat sink 3, packaging plastic 4, printer rubber roll 5, print paper 6, adhesive tape 7.
The specific embodiment:
Below in conjunction with accompanying drawing the utility model is further described:
Under the prior art: as shown in Figure 1, a kind of thermal printing head comprises the ceramic substrate 1 that is made of insulating materials, forms heater resistance on ceramic substrate 1, and ceramic substrate and printed substrate 2 are adhered on the heat sink 3 side by side.Integrated circuit is adhered on ceramic substrate or the printed substrate, by spun gold circuit on the ceramic substrate is connected with circuit on the printed substrate; With packaging plastic 4 integrated circuit and spun gold are carried out packaging protection then.
As shown in Figure 2, printer rubber roll 5 is pressed in print paper 6 at the heater position of ceramic substrate, rotation along with rubber roll, paper just can be realized transmission, and owing to ceramic material, it is cut is to form by cutting after the laser boring under the prior art, cutting back ceramic base plate surface edge part is comparatively sharp keen, heat-sensitive paper rubs with the ceramic base plate surface edge part in the process of transmission, forms cut easily, thereby causes printing effect bad.
Under the technology of the present invention: as shown in Figure 3, between the heater side surface edge part of ceramic substrate 1 and heat sink 3, scribble resin glue, because resin glue is mobile and smooth and level, the resin adhesive tape 7 that forms behind hot setting forms the transition of a slyness in ceramic substrate 1 marginal surface portion.
As shown in Figure 4, printer rubber roll 5 is pressed in the heater position of ceramic substrate 1 with print paper 6, and along with the rotation of printer rubber roll 5, print paper 6 just can be realized transmission.Because resin adhesive tape 7 forms the transition of a slyness in ceramic substrate 1 marginal surface portion, the cross section of adhesive tape is smooth arc, the resin adhesive tape exceeds ceramic substrate, and the height that adhesive tape exceeds is 0 to 1mm, and the utility model can effectively improve the surface state of ceramic substrate 1 marginal surface portion.Significantly reduced heat-sensitive paper and in transmission process, rubbed, reduced the formation of cut, thereby it has been bad effectively to improve printing effect with ceramic substrate 1 marginal surface portion.
The above only is a preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (3)
1. thermal printing head, the ceramic substrate and printed substrate, integrated circuit, spun gold, packaging plastic and the heat sink that are made of insulating materials constitute, on described ceramic substrate, form a plurality of heater resistance, on described printed substrate, be furnished with holding wire, it is characterized in that between ceramic substrate heater side surface edge part and heat sink, scribbling glue-line.
2. thermal printing head according to claim 1 is characterized in that glue-line through forming adhesive tape behind the hot setting between ceramic substrate heater side surface edge part and heat sink, and adhesive tape and ceramic base plate surface edge part form the transition of a slyness.
3. thermal printing head as claimed in claim 1 is characterized in that adhesive tape exceeds ceramic substrate, and the height that adhesive tape exceeds is 0 to 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202254568U CN201291641Y (en) | 2008-11-13 | 2008-11-13 | Thermal printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202254568U CN201291641Y (en) | 2008-11-13 | 2008-11-13 | Thermal printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201291641Y true CN201291641Y (en) | 2009-08-19 |
Family
ID=41005101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202254568U Expired - Fee Related CN201291641Y (en) | 2008-11-13 | 2008-11-13 | Thermal printing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201291641Y (en) |
-
2008
- 2008-11-13 CN CNU2008202254568U patent/CN201291641Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 264200 Torch Road, hi tech Industrial Development Zone, Shandong, Weihai 159 Patentee after: SHANDONG HUALING ELECTRONICS CO., LTD. Address before: 264200 Torch Road, hi tech Industrial Development Zone, Shandong, Weihai 159 Patentee before: Hualing Electronics Co., Ltd., Shandong |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090819 Termination date: 20171113 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |