CN201442383U - Thermal sensitive printing head - Google Patents
Thermal sensitive printing head Download PDFInfo
- Publication number
- CN201442383U CN201442383U CN2009200290206U CN200920029020U CN201442383U CN 201442383 U CN201442383 U CN 201442383U CN 2009200290206 U CN2009200290206 U CN 2009200290206U CN 200920029020 U CN200920029020 U CN 200920029020U CN 201442383 U CN201442383 U CN 201442383U
- Authority
- CN
- China
- Prior art keywords
- printing head
- thermal sensitive
- sensitive printing
- printed wiring
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to printers, in particular to a thermal sensitive printing head. The thermal sensitive printing head comprises a ceramic basal plate made of insulating materials, a printed wiring board, an integrated circuit, a connecting spun gold, a protective glue layer and a heat dissipating plate, wherein the ceramic basal plate is pasted on the heat dissipating plate, a plurality of heater resistances are formed on the ceramic basal plate, the wire layout of the printed wiring board comprises signals circuits on extension of ceramic basal plate and the printed wiring board, the circuit on the printed wiring board and the integrated circuit are connected through the spun gold, the integrated circuit and the spun gold are solidified into a protective glue layer through cutting glue, the thermal sensitive printing head is characterized in that the printed wiring boar is bended, one end is pasted on the ceramic basal plate and the heat dissipating plate, the width of the thermal sensitive printing head can be flexibly adjusted through bending the printed wiring boar, thereby increasing the application range of the thermal sensitive printing head in different width demands, thereby conforming the demands of special printing fields on minimization of thermal sensitive printing head, the thermal sensitive printing head has simple structure and easy realization, can assist to widen the range of printers, and greatly widens the application range of thermal sensitive printers.
Description
Technical field
The utility model relates to thermal printer, at length says it is a kind of thermal printing head.
Background technology
At present, thermal printing head (thermal print head is called for short TPH) generally comprises formations such as ceramic substrate, printed substrate, heat sink, protection glue-line, integrated circuit and connection spun gold.
The traditional thermal printhead: normally ceramic substrate and hard printed substrate are adhered on the heat sink side by side, integrated circuit is adhered on ceramic substrate or the hard printed substrate, by spun gold circuit on the ceramic substrate is connected with circuit on the hard printed substrate; With the protection glue-line integrated circuit and spun gold are carried out packaging protection then.
Can be provided with ground glaze layer on the substrate, to reduce thermal losses, said integrated circuit is that ground glaze layer and substrate surface are provided with lead electrode, lead electrode is divided into individual electrode and common electrode, at lead electrode along leading India side to forming heating resistor, individual electrode one end is connected with heating resistor along secondary Print direction, the other end with control IC and be connected, one end of common electrode is connected with heating resistor along secondary Print direction, and the other end is connected with common lead pattern.
Because ceramic substrate and printed substrate all belong to hard material, designed and process conditions limit, width is difficult to compression, but, along with printing range of needs more and more widely, printhead size is required also more and more to be tending towards short and small,, directly influence the contour structures size of printer because as the size of the thermal printing head of printer critical piece.
Summary of the invention:
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, provides a kind of by the bending printed substrate, can carry out the thermal printing head that the thermal printing head width dimensions is adjusted.
The present invention can reach by following measure:
A kind of thermal printing head; comprise the ceramic substrate that constitutes by insulating materials; printed substrate; integrated circuit; connect spun gold; protection glue-line and heat sink; ceramic substrate is adhered on the heat sink; form a plurality of heater resistance on the ceramic substrate; the wiring of printed substrate has comprised the signal circuit on continuity of ceramic substrate circuit and the printed substrate; by spun gold the circuit on the printed substrate is connected with integrated circuit; the protection glue-line that integrated circuit and spun gold are solidified by packaging plastic; it is characterized in that printed substrate is bending; wherein an end bonding with ceramic substrate and heat sink on, the other end is in free state.
The utility model is owing to adopt flexible printed substrate, by the bending printed substrate can the flexible modulation thermal printing head width, the scope that makes thermal printing head can be applied to the different in width requirement increases and has simple in structure, easy realization, can play a driving role to the field of widening printer.
Description of drawings
Accompanying drawing a kind of configuration state schematic diagram of the present utility model.
Mark among the figure: ceramic substrate 1, printed substrate 2, heat sink 3, protection glue-line 4.
The specific embodiment:
Below in conjunction with accompanying drawing the utility model is further described:
As shown in drawings; a kind of thermal printing head; comprise the ceramic substrate 1 that constitutes by insulating materials; printed substrate 2; integrated circuit; connect spun gold; protection glue-line 4 and heat sink 3; can be provided with ground glaze layer on the substrate 1; to reduce thermal losses; said integrated circuit is that ground glaze layer and substrate surface are provided with lead electrode; lead electrode is divided into individual electrode and common electrode; at lead electrode along leading India side to forming heating resistor; individual electrode one end is connected with heating resistor along secondary Print direction; the other end is connected with control IC; one end of common electrode is connected with heating resistor along secondary Print direction; the other end is connected with common lead pattern; ceramic substrate 1 is adhered on the heat sink 3; the wiring of printed substrate 2 has comprised the signal circuit on continuity of ceramic substrate 1 circuit and the printed substrate 2; by spun gold the circuit on the printed substrate 2 is connected with integrated circuit; integrated circuit and spun gold are provided with the protection glue-line 4 that is solidified by packaging plastic; above-mentioned same as the prior art; this does not give unnecessary details; the printed substrate 2 that is characterised in that of the present utility model is bending; the one end bonding with ceramic substrate 1 and heat sink 3 on; the utility model replaces traditional hard printed substrate by flexible print circuit board; be furnished with on the flexible print circuit board with ceramic substrate on the conductor and the holding wire of heater resistance continuity; ceramic substrate 1 is because be furnished with the conductor of heater electricity sun continuity on the flexible print circuit board; can shorten, heat sink 3 too widely also can shorten because need not carry.By spun gold the circuit on the flexible print circuit board is connected with integrated circuit; on flexible print circuit board, be provided with the protection glue-line then integrated circuit and spun gold are carried out packaging protection; printed substrate can carry out bending; choose bending position as required; wherein an end bonding with ceramic substrate and heat sink on; the other end is in free state, can be deposited on the ceramic substrate or a side of ceramic substrate.
The present invention abandons the printed substrate hard material and can not change narrow limitation in order to reduce the thermal printing head width dimensions, uses flexible print circuit board.Link to each other with integrated circuit the ceramic substrate circuit required and the signal circuit on the printed substrate forming on the flexible print circuit board.Resistive element circuit on the flexible print circuit board continuity ceramic substrate, ceramic substrate can shorten like this.Ceramic substrate is adhered on the heat sink, and flexible print circuit board is bonded on the ceramic substrate, and flexible print circuit board only needs very narrow width to be adhered on the heat sink, and heat sink too widely also can shorten because need not carry.By spun gold the circuit on the flexible print circuit board is connected with integrated circuit, then on flexible print circuit board with packaging plastic with integrated circuit and spun gold encapsulate the protection glue-line.The utility model provides a kind of new thermal printing head, and this thermal printing head can change the size of thermal printing head width, thereby make the thermal printing head width adjustment by the bending flexible print circuit board.
The utility model is owing to flexible print circuit board can crooked bend; although fix with ceramic substrate 1 bonding position; packaging plastic was also fixing after integrated circuit and spun gold carried out packaging protection; but utilize the flexibility at other positions can be bent into certain angle; utilize vertical space, reduced width longitudinally.
Claims (1)
1. thermal printing head; comprise the ceramic substrate that constitutes by insulating materials; printed substrate; integrated circuit; connect spun gold; protection glue-line and heat sink; ceramic substrate is adhered on the heat sink; form a plurality of heater resistance on the ceramic substrate; the wiring of printed substrate has comprised the signal circuit on continuity of ceramic substrate circuit and the printed substrate; by spun gold the circuit on the printed substrate is connected with integrated circuit; integrated circuit and spun gold are solidified protection by packaging plastic; it is characterized in that printed substrate is bending, wherein an end bonding with ceramic substrate and heat sink on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200290206U CN201442383U (en) | 2009-07-01 | 2009-07-01 | Thermal sensitive printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200290206U CN201442383U (en) | 2009-07-01 | 2009-07-01 | Thermal sensitive printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201442383U true CN201442383U (en) | 2010-04-28 |
Family
ID=42547059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200290206U Expired - Lifetime CN201442383U (en) | 2009-07-01 | 2009-07-01 | Thermal sensitive printing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201442383U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108583018A (en) * | 2013-10-28 | 2018-09-28 | 惠普发展公司有限责任合伙企业 | The method for encapsulating bonding line with low profile package body |
-
2009
- 2009-07-01 CN CN2009200290206U patent/CN201442383U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108583018A (en) * | 2013-10-28 | 2018-09-28 | 惠普发展公司有限责任合伙企业 | The method for encapsulating bonding line with low profile package body |
| US10946658B2 (en) | 2013-10-28 | 2021-03-16 | Hewlett-Packard Development Company, L.P. | Encapsulating a bonded wire with low profile encapsulation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 264200 Torch Road, hi tech Industrial Development Zone, Shandong, Weihai 159 Patentee after: SHANDONG HUALING ELECTRONICS CO., LTD. Address before: 264200 Torch Road, hi tech Industrial Development Zone, Shandong, Weihai 159 Patentee before: Hualing Electronics Co., Ltd., Shandong |
|
| CX01 | Expiry of patent term |
Granted publication date: 20100428 |
|
| CX01 | Expiry of patent term |