CN202242343U - Thermal print head - Google Patents
Thermal print head Download PDFInfo
- Publication number
- CN202242343U CN202242343U CN2011203480939U CN201120348093U CN202242343U CN 202242343 U CN202242343 U CN 202242343U CN 2011203480939 U CN2011203480939 U CN 2011203480939U CN 201120348093 U CN201120348093 U CN 201120348093U CN 202242343 U CN202242343 U CN 202242343U
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- CN
- China
- Prior art keywords
- testing
- ceramic substrate
- print head
- thermal print
- pressure welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a print head, and detailedly relates to a thermal print head. The thermal print head comprises a ceramic substrate formed by insulating materials, a printed circuit board, an integrated circuit, spun gold, packaging glue and a heat dissipating plate, wherein a plurality of heating element resistors are formed on the ceramic substrate; the wiring of the printed circuit board comprises a circuit continuation of the ceramic substrate and a signal circuit on the printed circuit board; the ceramic substrate is connected with the integrated circuit by using the spun gold; the circuit on the printed circuit board is connected with the integrated circuit; and a packaging glue layer is arranged on the integrated circuit and the spun gold. The thermal print head is characterized in that testing pads and pressure welding pads are respectively arranged on the ceramic substrate, wherein the testing pads are used for testing lap joint points of a testing jig over a circuit of the ceramic substrate. According to the thermal print head, the pads specially used for testing are added, the testing is not conducted through the pressure welding pads, the pressure welding performance can no longer be influenced by testing dents detained on the pads due to the testing, and thereby the failure rate of subsequent working procedures brought by the testing is reduced and the production effectiveness can be improved; and the thermal print head has the advantages that the structure is simple, the realization is easy, the operation is simplified, and a guarantee effect is achieved on the improvement of the performance of the thermal print head.
Description
Technical field
The utility model relates to thermal printer, at length says it is a kind of thermal printing head.
Background technology
At present, thermal printing head (thermal print head is called for short TPH) generally comprises formations such as ceramic substrate, printed substrate, heat sink, packaging plastic, integrated circuit, wire.
The traditional thermal printhead: normally ceramic substrate and printed substrate are adhered on the heat sink.Integrated circuit is adhered on ceramic substrate or the printed substrate, through wire circuit on circuit on the ceramic substrate and the printed substrate is connected; With packaging plastic integrated circuit and wire are carried out packaging protection then.
Owing on ceramic substrate, formed a plurality of heater resistance, resistance, circuit on-off will be tested, and test is all on wire pressure welding pad at present; Can not produce impression at diverse location because test position is fixing after the pad test; Or because the ceramic base plate surface state is different, the dynamics that test presses down lays particular stress on, and can make bond pad surface form pit; It is not firm to adhere when causing the pressure welding wire, causes rosin joint or disengaging.
More and more stricter along with product cost is required, existing thermal printing head material is brought in constant renewal in, and the cheap metal slurry descends the bond pad surface state; The more and more meticulousr wire of specification but requires increasingly high to the bond pad surface state; In addition, owing to add, test point is special-purpose; The pressure welding pad is special-purpose, does not influence each other.Because the pressure welding pad is the mechanism that depends on integrated circuit; Receive size, the pressure welding point specification limits of integrated circuit; Spatial development leeway is little, and a present assembly welding dish has also influenced the physical dimension of testing jig naturally, and different integrated circuits just requires different testing jigs corresponding; Cause the variation of testing jig kind, do not utilize and use and management.
Summary of the invention
The purpose of the utility model is in order to overcome the deficiency of prior art, to propose a kind of thermal printing head that in production technology, can guarantee the surface state of pressure welding pad.
The utility model solves the technical scheme that its technical problem adopted:
A kind of thermal printing head; The ceramic substrate and printed substrate, integrated circuit, spun gold, packaging plastic and the heat sink that are made up of insulating materials constitute; On said ceramic substrate, form a plurality of heater resistance, it is characterized in that ceramic substrate is respectively equipped with testing weld pad and pressure welding pad, testing weld pad is used for the test of testing jig to the test overlapped points of ceramic substrate circuit; Can concentrate the general character of different integrated circuits; Form a kind of testing jig of structure, on ceramic substrate,, reach the pressure welding pad that satisfies different integrated circuit pressure welding point through the wiring of adjustment with testing weld pad.
Pad in the utility model is made up of special test pad and pressure welding pad, can guarantee the surface state of pressure welding pad, makes it unaffected; The testing weld pad uniform specification makes the testing jig construction standardization, has reduced the kind of testing jig; Be convenient to produce and management; Have simple in structurely, realize easily, the performance that guarantees thermal printing head is played good reliability effect.
Description of drawings
Fig. 1 is the structural representation of printhead.
Fig. 2 is a kind of structural representation of prior art.
A kind of structural representation of Fig. 3 the utility model.
The another kind of structural representation of Fig. 4 the utility model.
Mark among the figure: ceramic substrate 1, printed substrate 2, heat sink 3, packaging plastic 4, test impression 5, pressure welding point 6, connection wire 7, basic pad 8, testing weld pad 9, pressure welding pad 10, integrated circuit 11.
The specific embodiment:
Below in conjunction with accompanying drawing the utility model is further described:
As shown in Figure 1, a kind of thermal printing head comprises the ceramic substrate 1 that is made up of insulating materials; On ceramic substrate 1, form heater resistance; Ceramic substrate and printed substrate 2 are adhered on the heat sink 3 side by side, and integrated circuit is adhered on ceramic substrate 1 or the printed substrate 2, the basic pad of wire one end pressure welding on ceramic substrate; The other end links to each other with integrated circuit, and circuit also is connected through wire on integrated circuit and the printed substrate 2; With packaging plastic 4 integrated circuit and wire are carried out packaging protection then.
Shown in Fig. 2; Pressure welding pad on the ceramic substrate 1 of prior art plays the effect of testing weld pad simultaneously; Be called basic pad 8 at this, because the test of resistance, circuit on-off is also carried out on basic pad, test impression 5 and the pressure welding point 6 that produces in the test process has the zone of coincidence; The state of test impression 5 can influence the state of pressure welding point 6, thereby influences the connection status of basic pad 8 and wire 7.
As shown in Figure 3; The utility model is divided into pressure welding pad and testing weld pad with basic pad; Added testing weld pad 9, test impression 5 is stayed on the testing weld pad 9, and wire 7 is fixed on the pressure welding pad 10 in pressure welding point on the ceramic substrate; Test impression 5 is not being deposited the zone that overlaps with pressure welding point 6, has just removed the performance hidden danger that produces because of overlapping.Identical test pad structure can adapt to different integrated circuit structures, as illustrates shown in 4, on ceramic substrate 1, through the wiring of adjustment pressure welding pad 10 with testing weld pad 9, makes test pad structure constant, and the pressure welding pad also can well combine with integrated circuit.
The above only is the preferred implementation of the utility model; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; Can also make some improvement and retouching, these improvement and retouching also should be regarded as the protection domain of the utility model.
Claims (3)
1. thermal printing head; The ceramic substrate and printed substrate, integrated circuit, spun gold, packaging plastic and the heat sink that are made up of insulating materials constitute; On said ceramic substrate, form a plurality of heater resistance, it is characterized in that ceramic substrate is respectively equipped with testing weld pad and pressure welding pad.
2. thermal printing head according to claim 1 is characterized in that the pressure welding pad is located on same the straight line.
3. thermal printing head according to claim 1 is characterized in that testing weld pad is distributed on two two parallel straight lines at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203480939U CN202242343U (en) | 2011-09-16 | 2011-09-16 | Thermal print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203480939U CN202242343U (en) | 2011-09-16 | 2011-09-16 | Thermal print head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202242343U true CN202242343U (en) | 2012-05-30 |
Family
ID=46103633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203480939U Expired - Lifetime CN202242343U (en) | 2011-09-16 | 2011-09-16 | Thermal print head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202242343U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107405929A (en) * | 2015-03-27 | 2017-11-28 | 京瓷株式会社 | Thermal head and thermal printer |
-
2011
- 2011-09-16 CN CN2011203480939U patent/CN202242343U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107405929A (en) * | 2015-03-27 | 2017-11-28 | 京瓷株式会社 | Thermal head and thermal printer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 264200 Weihai high tech Zone, Shandong Torch Road, No. 159 Patentee after: SHANDONG HUALING ELECTRONICS CO., LTD. Address before: 264209 fire road 159, hi tech District, Shandong, Weihai Patentee before: Hualing Electronics Co., Ltd., Shandong |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120530 |