CN216708785U - Ink-jet printing head - Google Patents
Ink-jet printing head Download PDFInfo
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- CN216708785U CN216708785U CN202123346873.2U CN202123346873U CN216708785U CN 216708785 U CN216708785 U CN 216708785U CN 202123346873 U CN202123346873 U CN 202123346873U CN 216708785 U CN216708785 U CN 216708785U
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- circuit board
- ink
- inkjet printhead
- driving
- chip
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Abstract
The utility model discloses an ink jet printing head, which comprises a circuit board, a heating resistor, a driving chip and a printing head interface. The circuit board is a thin film circuit board, a plurality of heating resistors for heating ink are arranged on the circuit board, and a plurality of microstructure ink flow channels are formed in the circuit board; at least one driving chip is provided, and the driving chip provides electric power for the heating resistor; when the number of the driving chips is more than 2, the plurality of driving chips are connected in series or in parallel; power and control signals are supplied to the heating resistors and the driver chip through the printhead interface. In the utility model, the circuit board is designed into the thin film circuit board, so that the photoetching exposure requirement is low, compared with the semiconductor integrated circuit, the comprehensive cost is low, and in addition, a plurality of driving chips are connected in series or in parallel, so that the large size of the sprayer is realized.
Description
Technical Field
The utility model belongs to the technical field of ink-jet printers, and particularly relates to an ink-jet printing head.
Background
At present, the manufacture of thermal foaming inkjet print head chips basically adopts the manufacture mode of semiconductor integrated circuits, namely, circuits are designed and manufactured on wafers. However, due to the limitation of the size of the exposure unit of the lithography machine and the influence of the yield of large size, the length of a single ink jet printing head is difficult to break through the limitation of one inch, or the manufacturing cost of a large-size nozzle is very high.
Disclosure of Invention
The utility model aims to provide an ink-jet printing head, which solves the technical problems that the length of a single ink-jet printing head in the prior art cannot break through the limit of one inch, or the manufacturing cost of a large-size spray head is very high.
In order to solve the technical problems, the utility model adopts the technical scheme that:
an inkjet printhead comprising:
the circuit board is a thin film circuit board, a plurality of heating resistors for heating ink are arranged on the circuit board, and a plurality of microstructure ink flow channels are formed in the circuit board;
at least one driving chip providing electric power to the heating resistor; when the number of the driving chips is more than 2, the plurality of driving chips are connected in series or in parallel;
and a print head interface through which power and control signals are supplied to the heat-generating resistors and the driving chip.
In the utility model, the circuit board is designed into the thin film circuit board, so that the photoetching exposure requirement is low, and the comprehensive cost is low compared with that of a semiconductor integrated circuit. In addition, the plurality of driving chips are connected in series or in parallel, so that the large size of the spray head is realized.
In a further improvement, the circuit board and the driving chip are two physically independent devices which are connected into a whole in an assembling mode.
The improved structure further comprises a supporting piece, wherein the circuit board and the driving chip are tightly matched through a supporting part, so that the circuit board and the driving chip have a stable position relation. For example, the support member is an aluminum alloy base to which the circuit board of the ink jet head is bonded, and the driving chip is bonded.
In a further improvement, the assembling mode comprises one or more of bonding, welding and bonding.
The assembly mode is bonding, and the heating resistor and the circuit of the driving chip are connected and conducted through metal wire bonding.
The device is further improved in the mode of welding, and the circuit of the heating resistor and the circuit of the driving chip are connected and conducted through flip chip welding.
Further improved, the substrate of the circuit board is Si, SiO2, SiC, GaAs or various ceramic substrates for manufacturing thin-film circuits.
Compared with the prior art, the technical scheme of the utility model has the following beneficial effects:
in the utility model, the circuit board is designed into the thin film circuit board, so that the photoetching exposure requirement is low, compared with the characteristic of low comprehensive cost of a semiconductor integrated circuit, and in addition, a plurality of driving chips are combined to be connected in series or in parallel, so that the large size of the sprayer is realized.
Drawings
FIG. 1 is a system block diagram of an inkjet printhead according to the present invention;
FIG. 2 is a schematic electrical schematic of a portion of an ink jet print head according to the present invention;
FIG. 3 is a schematic circuit diagram of a portion of a cascade of multiple driver chips in an inkjet printhead according to the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in fig. 1, an inkjet printhead includes a circuit board, a driver chip 2, and a printhead interface 4.
The circuit board is a thin film circuit board 1, the substrate of the circuit board is Si, SiO2, SiC, GaAs or various ceramic substrates for manufacturing thin film circuits, and the circuit board is designed into the thin film circuit board, so that the photoetching exposure requirement is low, and the comprehensive cost is low compared with that of a semiconductor integrated circuit.
The circuit board is provided with a plurality of heating resistors 3 for heating ink and a micro-structure ink flow channel; each heating resistor is positioned right above a corresponding micro-structure ink flow channel, and the micro-structure ink flow channel comprises an ink jetting hole penetrating through the circuit board. After the heating resistor heats the ink in the ink box, the ink flows through the micro-structure ink channel and is ejected out of the ink jetting hole for printing.
The driving chip provides electric power for the heating resistor, and drives the heating resistor to normally work to heat the ink. The circuit board and the driving chip are two physically independent devices which are connected into a whole in an assembling mode.
According to specific requirements, the driving chip can be directly assembled on the circuit board in a mode of one or more of bonding, welding and bonding. The driving chip and the circuit board can be assembled together through the supporting piece, the circuit board is tightly matched with the supporting part, and the driving chip is tightly matched with the supporting part, so that the circuit board and the driving chip have stable position relation. For example, the support member is an aluminum alloy base to which the circuit board of the ink jet head is bonded, and the driving chip is bonded.
In the present embodiment, the driving chip is directly bonded to the circuit board, and the heating resistor 3 and the circuit of the driving chip 2 are connected and conducted by bonding with the metal wire 6, as shown in fig. 2.
In other embodiments, the device is formed by soldering, and the heating resistor and the circuit of the driving chip are connected and conducted by flip-chip bonding.
The number of the driving chips can be 1 or more, and the driving chips in the application have the characteristic of controlling more heating resistors by using fewer control lines. When the number of the driving chips is more than 2, the driving chips are connected in series or in parallel, so that the purpose of large size of the sprayer is achieved.
In the embodiment, the driving chips 2 are sequentially connected in series to achieve the purpose of cascade connection, and the driving chips at two ends are electrically connected to the corresponding interfaces of the circuit board through wires, as shown in fig. 3.
The printhead interface includes a power supply interface and a communication interface. The power supply interface provides power for the heating resistor and the driving chip, and the mode of acquiring electric energy from the outside by the power supply interface unit is a physical contact type andor an alternating current wireless coupling type. Such as connecting with an external power supply through a USB interface, or wirelessly charging.
The communication interface enables the driving chip and the external to realize, and transmits the control signal to the driving chip and the heating resistor. The communication interface and the peripheral communication mode are physical contact or non-contact.
The above examples are merely examples for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the utility model.
Claims (7)
1. An inkjet printhead, comprising:
the circuit board is a thin film circuit board, a plurality of heating resistors for heating ink are arranged on the circuit board, and a plurality of microstructure ink flow channels are formed in the circuit board;
at least one driving chip providing electric power to the heating resistor; when the number of the driving chips is more than 2, the plurality of driving chips are connected in series or in parallel;
and a print head interface through which power and control signals are supplied to the heat-generating resistors and the driving chip.
2. The inkjet printhead of claim 1, wherein said circuit board and said driver chip are two physically separate components that are connected together by assembly.
3. The inkjet printhead of claim 2, further comprising a support member, wherein the circuit board and the driver chip are tightly fitted by the support member.
4. The inkjet printhead of claim 2, wherein said driver chip is mounted directly on the circuit board by one or more of adhesive, soldering, and bonding.
5. The inkjet printhead of claim 4, wherein said mounting is adhesive bonding, and the heating resistor and the driving chip are electrically connected by wire bonding.
6. The inkjet printhead of claim 4, wherein said mounting is by soldering, and the heating resistor and the driving chip are electrically connected by flip-chip bonding.
7. The inkjet printhead of claim 1, wherein the substrate of said circuit board is Si, SiO2, SiC, GaAs or various types of ceramic substrates for making thin film circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123346873.2U CN216708785U (en) | 2021-12-29 | 2021-12-29 | Ink-jet printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123346873.2U CN216708785U (en) | 2021-12-29 | 2021-12-29 | Ink-jet printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216708785U true CN216708785U (en) | 2022-06-10 |
Family
ID=81886692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123346873.2U Active CN216708785U (en) | 2021-12-29 | 2021-12-29 | Ink-jet printing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216708785U (en) |
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2021
- 2021-12-29 CN CN202123346873.2U patent/CN216708785U/en active Active
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