KR100403579B1 - Ink jet printing head - Google Patents
Ink jet printing head Download PDFInfo
- Publication number
- KR100403579B1 KR100403579B1 KR10-2000-0041745A KR20000041745A KR100403579B1 KR 100403579 B1 KR100403579 B1 KR 100403579B1 KR 20000041745 A KR20000041745 A KR 20000041745A KR 100403579 B1 KR100403579 B1 KR 100403579B1
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- Prior art keywords
- heater
- circuit board
- substrate
- printed circuit
- ink
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/07—Ink jet characterised by jet control
- B41J2/072—Ink jet characterised by jet control by thermal compensation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/07—Ink jet characterised by jet control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/1408—Structure dealing with thermal variations, e.g. cooling device, thermal coefficients of materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/1412—Shape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14137—Resistor surrounding the nozzle opening
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Abstract
개시된 잉크젯 프린팅 헤드는, 잉크가 충전되는 챔버가 형성된 기판과; 기판상에 설치되는 것으로, 통전에 의해 발열됨으로써 챔버에 충전된 잉크내에 버블을 형성시키는 히터와, 히터로의 통전 경로를 형성하는 컨덕터 및, 버블 팽창에 의해 밀려나온 잉크 액적이 방출되기 위한 오리피스가 각각 구비된 가요성 인쇄회로기판;를 포함하여 구성된다. 이와 같은 구성의 프린팅 헤드는, 히터와 컨덕터 및 오리피스가 가요성 인쇄회로기판에 마련되기 때문에, 난해한 탭(TAB)본딩(인너리드 본딩이라고도 함) 작업을 생략할 수 있어서 조립 공정을 간소화할 수 있고, 그에 따라 제품 불량도 줄일 수 있는 효과를 가진다.The disclosed inkjet printing head comprises: a substrate having a chamber in which ink is filled; The heater is installed on the substrate, and generates a bubble in the ink filled in the chamber by heat generation, a conductor forming a conduction path to the heater, and an orifice for releasing ink droplets pushed out by the bubble expansion. It is configured to include; each provided a flexible printed circuit board. The printing head having such a configuration can eliminate the difficult tap (TAB) bonding (also called inner lead bonding) because the heater, the conductor and the orifice are provided on the flexible printed circuit board, thereby simplifying the assembly process. As a result, product defects can be reduced.
Description
본 발명은 잉크젯 프린팅 헤드에 관한 것으로서, 특히 탭(TAB)본딩(또는 인너리드 본딩) 공정을 생략할 수 있도록 가요성 인쇄회로기판(flexible printed circuit board)의 구조가 개선된 잉크젯 프린팅 헤드에 관한 것이다.TECHNICAL FIELD The present invention relates to an inkjet printing head, and more particularly, to an inkjet printing head having an improved structure of a flexible printed circuit board so that a tab (TAB) bonding (or inner lead bonding) process can be omitted. .
일반적으로 잉크젯 프린팅 헤드는, 잉크탱크(10)로부터 공급된 잉크의 액적(droplet)을 기록용지 상의 원하는 위치에 방출시켜서 소정 색상의 화상으로 인쇄하는 장치로서, 도 1에 도시된 바와 같이 기판(11)과, 그 기판(11) 위에 설치되며 복수의 오리피스(12a)가 형성된 노즐 플레이트(12)와, 상기 기판(11)의 접속용 패드(11a)에 연결되는 리드(13a)가 마련된 가요성 인쇄회로기판(13)를 포함하여 구성된다. 여기서 상기 기판(11)의 구조를 확대해보면, 도 2에 도시된 바와 같이 잉크탱크(10)에 저장된 잉크가 유입되는 유입장공(11b) 및 그 유입된 잉크가 채워지는 복수의 챔버(11c)가 형성되어 있고, 각 챔버(11c) 안에는 컨덕터(11e)와 연결된 히터(11d)가 설치되어 있다. 그리고, 상기 컨덕터(11e)는 상기 패드(11a)와 연결되어 있다. 참조부호 13b는 프린팅 헤드를 프린터의 콘트롤러(미도시)와 연결하기 위한 접속단자를 나타낸다.In general, an inkjet printing head is a device for ejecting droplets of ink supplied from the ink tank 10 to a desired position on a recording sheet to print an image of a predetermined color, as shown in FIG. ), A printing plate provided on the substrate 11 and having a nozzle plate 12 having a plurality of orifices 12a and a lead 13a connected to the connection pad 11a of the substrate 11. It comprises a circuit board 13. As shown in FIG. 2, when the structure of the substrate 11 is enlarged, an inlet hole 11b into which ink stored in the ink tank 10 flows in and a plurality of chambers 11c in which the inflowed ink is filled are provided. The heater 11d connected with the conductor 11e is provided in each chamber 11c. The conductor 11e is connected to the pad 11a. Reference numeral 13b denotes a connection terminal for connecting the printing head with a controller (not shown) of the printer.
이러한 프린팅 헤드를 조립할 때에는, 상기 노즐 플레이트(12)를 기판(11)에고온고압으로 열압착하여 부착시키고, 기판(11)의 패드(11a)는 탭(TAB)본딩으로 상기 가요성 인쇄회로기판(13)의 리드(13a)에 본딩한다.When assembling such a printing head, the nozzle plate 12 is thermocompression-bonded to the substrate 11 at high temperature and high pressure, and the pad 11a of the substrate 11 is tab-bonded to the flexible printed circuit board. It bonds to the lead 13a of (13).
그런데 이 탭본딩 작업은 각 리드(13a)와 패드(11a)를 초음파를 이용하여 하나씩 접착하는 작업으로서, 작업 자체가 난해하여 시간도 많이 소요될 뿐 아니라, 이 공정에서 불량이 발생되는 확률도 매우 높다. 따라서, 이러한 탭본딩 작업을 생략할 수 있는 새로운 구조의 잉크젯 프린팅 헤드가 요구되고 있다.However, this tab bonding operation is to glue each lead 13a and the pad 11a one by one using ultrasonic waves, which is difficult because the work itself is difficult and takes a lot of time. . Therefore, there is a need for a new inkjet printing head which can omit such a tab bonding operation.
본 발명은 상기의 요구를 감안하여 창출된 것으로, 조립시 탭본딩 작업이 필요없는 간소한 구조의 잉크젯 프린팅 헤드를 제공하는데 그 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made in view of the above requirements, and an object thereof is to provide an inkjet printing head having a simple structure that does not require tab bonding during assembly.
도 1은 종래의 잉크젯 프린팅 헤드를 도시한 분리사시도,1 is an exploded perspective view showing a conventional inkjet printing head,
도 2는 도 1에 도시된 프린팅 헤드 중 기판을 확대하여 도시한 사시도,2 is an enlarged perspective view of a substrate of the printing head shown in FIG. 1;
도 3은 본 발명에 따른 잉크젯 프린팅 헤드를 도시한 분리사시도,3 is an exploded perspective view of the inkjet printing head according to the present invention;
도 4는 도 3에 도시된 프린팅 헤드의 결합 상태를 보인 평면도,4 is a plan view showing a coupling state of the printing head shown in FIG.
도 5a 내지 도 5g는 도 3에 도시된 잉크젯 프린팅 헤드의 제조과정을 설명하기 위한 도면,5a to 5g are views for explaining a manufacturing process of the inkjet printing head shown in FIG.
도 6은 도 3에 도시된 잉크젯 프린팅 헤드 중 가요성 인쇄회로기판의 접속단자 설치부를 도시한 단면도,6 is a cross-sectional view showing a connection terminal installation portion of a flexible printed circuit board of the inkjet printing head shown in FIG.
도 7a는 도 4의 요부를 확대한 평면도,7A is a plan view magnifying the main portion of FIG. 4;
도 7b는 도 7a의 단면도,7B is a cross-sectional view of FIG. 7A;
도 8은 챔버 형성을 위한 격벽부재의 변형 가능한 예를 도시한 평면도.8 is a plan view showing a deformable example of a partition member for chamber formation.
<도면의 주요부분에 대한 부호의 설명><Description of Symbols for Main Parts of Drawings>
100...잉크탱크 110...기판100 ... ink tank 110 ... substrate
111...챔버 111a...격벽부재111 Chamber 111a Bulkhead member
120...가요성 인쇄회로기판 120a...폴리미드 플레이트120 ... flexible printed circuit board 120a ... polyamide plate
120b...히트 싱크층 120c...절연층120b ... heat sink layer 120c ... insulation layer
121...히터 122...오리피스121 Heater 122 Orifice
123...컨덕터 124...접속단자123 ... conductor 124 ... connection terminal
상기 목적을 달성하기 위한 본 발명의 잉크젯 프린팅 헤드는, 잉크가 충전되는 챔버가 형성된 기판과; 상기 기판상에 설치되는 것으로, 통전에 의해 발열됨으로써 상기 챔버에 충전된 잉크내에 버블을 형성시키는 히터와, 상기 히터로의 통전 경로를 형성하는 컨덕터 및, 상기 버블 팽창에 의해 밀려나온 잉크 액적이 방출되기 위한 오리피스가 각각 구비된 가요성 인쇄회로기판;를 포함하는 것을 특징으로 한다.An inkjet printing head of the present invention for achieving the above object comprises a substrate with a chamber filled with ink; A heater disposed on the substrate to generate bubbles in the ink filled in the chamber by being heated by energization, a conductor forming an energization path to the heater, and ink droplets pushed out by the bubble expansion And a flexible printed circuit board each having an orifice to be provided.
이하, 첨부된 도면을 참조하면서 본 발명에 따른 바람직한 실시예를 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 3을 참조하면, 본 발명의 프린팅 헤드는 잉크탱크(100)에 설치되는 기판(110)과 가요성 인쇄회로기판(flexible printed circuit board;120)을 포함하여 구성된다. 먼저, 상기 기판(110)에는 잉크가 채워질 수 있게 격벽부재(111a)로 둘러싸인 챔버(111)가 복수개 형성되어 있다. 그리고, 상기 기판(110)은 2조각으로 분할되어 있는데, 그 분할된 간격(113)으로 잉크탱크(100)로부터의 잉크가 유입되어 상기 챔버(111) 안에 충전된다. 참조부호 112는 기판(110)과 가요성 인쇄회로기판(120)과의 사이에서 잉크가 원활하게 유동될 수 있는 공간을 확보하기 위해 형성된 스페이서를 나타낸다. 이 기판(110)은 실리콘 웨이퍼나 금속, 또는 내열 및 내환경성이 우수한 플라스틱 중 선택할 수 있다.Referring to FIG. 3, the printing head of the present invention includes a substrate 110 installed in the ink tank 100 and a flexible printed circuit board 120. First, the substrate 110 has a plurality of chambers 111 surrounded by the partition member 111a to be filled with ink. In addition, the substrate 110 is divided into two pieces, and ink from the ink tank 100 flows into the chamber 111 at the divided interval 113. Reference numeral 112 denotes a spacer formed to secure a space in which ink can flow smoothly between the substrate 110 and the flexible printed circuit board 120. The substrate 110 may be selected from a silicon wafer, a metal, or a plastic having excellent heat and environmental resistance.
상기 가요성 인쇄회로기판(120)은 예컨대 열압착에 의해 기판(110) 위에 부착된다. 그리고 가요성 인쇄회로기판(120)에는 잉크 방출을 위한 복수의 오리피스(122)가 형성되어 있는데, 각 오리피스(122)는 상기한 각 챔버(111)에 대응하여 그 상방에 위치된다. 또한, 각 오리피스(122)의 주변에는 컨덕터(123)와 연결되어 전류 공급에 따라 발열되는 히터(121)가 설치된다. 즉, 상기 오리피스(122) 뿐 아니라, 컨덕터(123)와 히터(121)도 상기 가요성 인쇄회로기판(120)에 구비되어 있는 것이다. 참조부호 124는 프린팅 헤드를 프린터의 콘트롤러(미도시)와 연결하기 위한 접속단자들로서 컨덕터(123)를 통해 히터(121)와 연결되어 있다. 이와 같은 가요성 인쇄회로기판(120)이 기판(110)에 결합되면, 도 4에 도시된 바와 같이, 각 챔버(111) 마다 오리피스(122)와 히터(121)가 하나씩 대응되어 배치된다. 도면에 기판(110)의 테두리를 따라 점선으로 표시된 부분은 잉크의 누수를 방지하고 기판(110)을 잉크탱크(100)에 견고하게 부착하기 위한 본딩층을 나타낸다.The flexible printed circuit board 120 is attached onto the substrate 110 by, for example, thermocompression bonding. In addition, a plurality of orifices 122 are formed on the flexible printed circuit board 120 to discharge ink, and each orifice 122 is located above the corresponding chambers 111. In addition, a heater 121 connected to the conductor 123 is generated around each orifice 122 to generate heat according to the current supply. That is, not only the orifice 122 but also the conductor 123 and the heater 121 are provided in the flexible printed circuit board 120. Reference numeral 124 is a connection terminal for connecting the printing head to a controller (not shown) of the printer and is connected to the heater 121 through the conductor 123. When the flexible printed circuit board 120 is coupled to the substrate 110, as shown in FIG. 4, an orifice 122 and a heater 121 are correspondingly arranged for each chamber 111. A portion indicated by a dotted line along the edge of the substrate 110 in the drawing represents a bonding layer for preventing leakage of ink and firmly attaching the substrate 110 to the ink tank 100.
그리고, 히터(121) 및 컨덕터(123)가 가요성 인쇄회로기판(120)에 설치되기 때문에, 그 사이에 도 5g에 도시된 바와 같이 절연층(120c) 및 히트 싱크층(120b)을 형성하는 것이 바람직하다. 상기 히트 싱크층(120b)은 히터(121)에서 발생된 열에 신속하게 방열, 냉각시킴으로써 가요성 인쇄회로기판(120)이 손상되는 것을 방지하기 위해 마련되는 것으로, 금속 플레이트의 라미네이팅(laminating) 또는 도금 방식으로 형성할 수 있다. 또한, 상기 절연층(120c)은 상기 컨덕터(123)에 전류가 흐를 때 전기적인 쇼트가 발생되는 것을 방지하기 위해 마련되는 층으로서, 예컨대 SiO2, Si3N4등의 재질로 구성할 수 있다.In addition, since the heater 121 and the conductor 123 are installed in the flexible printed circuit board 120, the insulating layer 120c and the heat sink layer 120b are formed therebetween as shown in FIG. 5G. It is preferable. The heat sink layer 120b is provided to prevent the flexible printed circuit board 120 from being damaged by rapidly dissipating and cooling the heat generated by the heater 121, and laminating or plating the metal plate. Can be formed in a manner. In addition, the insulating layer 120c is a layer provided to prevent electrical short when the current flows in the conductor 123. For example, the insulating layer 120c may be formed of a material such as SiO 2 , Si 3 N 4, or the like. .
이와 같은 가요성 인쇄회로기판(120)은 예를 들어 도 5a 내지 도 5g에 도시된 바와 같은 순서의 공정으로 제작될 수 있다. 먼저, 폴리미드(polyimide) 플레이트(120a)를 가요성 인쇄회로기판(120)의 베이스부재로서 준비한다(도 5a). 그리고 여기에 구멍(120d)을 펀칭한다(도 5b). 이 구멍(120d)은 도 6에 도시된 바와 같이 나중에 콘트롤러의 연결단자(200)와 접속될 접속단자(124)가 연결되는 통로가 된다. 이후 상기와 같이 금속 플레이트를 라미네이팅 하거나 도금하는 방법으로 히트 싱크층(120b)을 형성한다(도 5c). 이때 히트 싱크층(120b)을 기판(110)과 접촉되는 전체 면적에 형성할 수도 있고, 부분적으로 히터(121)가 설치될 곳의 주변에만 형성할 수도 있다. 이어서 SiO2, Si3N4등의 재질로 구성된 절연층(120c)을 형성한다(도 5d). 그리고는 포토리소그래피 공정을 이용하여 히트 싱트층(120b)과 절연층(120c)에 오리피스(122)와 연통되는 리세스(recess)부(120')를 만든다(도5e). 이와 같이 히트 싱크층(120b)과 절연층(120c)이 형성되면, 그 위에 히터(121)를 설치한다(도 5f). 이어서 히터(121)와 접속단자(124)를 연결하는 컨덕터(123)를 설치하고, 오리피스(122)를 엑시머레이저 가공으로 형성한다(도 5g). 이 컨덕터(123)도 상기 히트 싱크층(120b)과 마찬가지로 금속 플레이트를 라미네이팅 하거나 도금하는 방법으로 형성한다.Such a flexible printed circuit board 120 may be manufactured by, for example, a process as shown in FIGS. 5A to 5G. First, a polyimide plate 120a is prepared as a base member of the flexible printed circuit board 120 (FIG. 5A). And the hole 120d is punched here (FIG. 5B). As shown in FIG. 6, the hole 120d is a passage through which the connection terminal 124 to be connected to the connection terminal 200 of the controller is connected later. Thereafter, as described above, the heat sink layer 120b is formed by laminating or plating the metal plate (FIG. 5C). In this case, the heat sink layer 120b may be formed in the entire area that is in contact with the substrate 110, or may be partially formed only around the place where the heater 121 is to be installed. Subsequently, an insulating layer 120c made of a material such as SiO 2 , Si 3 N 4, or the like is formed (FIG. 5D). Then, a recess 120 'in communication with the orifice 122 is formed in the heat sink layer 120b and the insulating layer 120c by using a photolithography process (FIG. 5E). When the heat sink layer 120b and the insulating layer 120c are formed in this way, the heater 121 is provided on it (FIG. 5F). Next, the conductor 123 connecting the heater 121 and the connection terminal 124 is provided, and the orifice 122 is formed by excimer laser processing (FIG. 5G). Like the heat sink layer 120b, the conductor 123 is formed by laminating or plating a metal plate.
이와 같이 제작된 가요성 인쇄회로기판(120)을 상기한 기판(110) 위에 열압착하여 붙이면 도 7a 및 도 7b에 도시된 바와 같이 조립된 프린팅 헤드가 완성되며, 이것을 잉크가 저장된 잉크 카트리지(100)에 설치하면 된다. 도 7a는 전술한 도 4의 요부를 확대한 것이고, 도 7b는 그 단면도이다.When the flexible printed circuit board 120 manufactured as described above is thermocompressed and attached to the substrate 110, the printed head assembled as shown in FIGS. 7A and 7B is completed, and the ink cartridge 100 storing the ink is completed. ) Can be installed. 7A is an enlarged view of the main portion of FIG. 4 described above, and FIG. 7B is a cross-sectional view thereof.
상기 구성에 있어서, 기판(110)으로 유입된 잉크는 챔버(111) 내에 채워지며, 이때 컨덕터(123)를 통해 히터(121)에 전류가 공급되면, 히터(121)가 발열하여 챔버(111)내에 버블을 형성시킨다. 그러면 이 버블의 팽창에 의해 챔버(111) 내에 충전된 잉크의 액적(droplet)이 상기 오리피스(122)를 통해 방출된다.In the above configuration, the ink flowing into the substrate 110 is filled in the chamber 111, and when a current is supplied to the heater 121 through the conductor 123, the heater 121 generates heat to generate the chamber 111. Bubbles are formed within. A droplet of ink filled in the chamber 111 by the expansion of this bubble is then discharged through the orifice 122.
이와 같은 본 발명의 프린팅 헤드는, 히터(121)와 컨덕터(123) 및 오리피스(122)를 가요성 인쇄회로기판(120)에 마련하고 있기 때문에, 조립시 기판(110)과 가요성 인쇄회로기판(120)을 열압착시키기만 하면 된다. 이것은 가요성 인쇄회로기판의 리드를 기판의 패드와 하나씩 탭본딩하던 종래에 비해 조립 공정을 크게 간소화시킬 수 있는 장점이 된다. 또한 탭본딩 작업시에 불량이 많이 발생되기 때문에, 그 공정을 생략함으로써 불량율을 줄일 수 있는 효과도 생기게 된다.Since the printing head of the present invention has the heater 121, the conductor 123, and the orifice 122 provided on the flexible printed circuit board 120, the substrate 110 and the flexible printed circuit board at the time of assembly are provided. It is only necessary to thermally compress the 120. This is an advantage of greatly simplifying the assembly process compared to the conventional tab bonding of the lead of the flexible printed circuit board with the pad of the substrate one by one. In addition, since a large number of defects are generated during the tap bonding operation, it is possible to reduce the defective rate by omitting the process.
한편, 본 실시예에서는 상기 기판(110)을 2조각으로 분할된 것을 예시하였는데, 이를 도 1에 도시된 바와 같이 중앙에 장공(11b)이 형성된 한 조각으로 대체할 수도 있음은 물론이다.Meanwhile, in the present embodiment, the substrate 110 is divided into two pieces. As shown in FIG. 1, the substrate 110 may be replaced with a piece having a long hole 11b formed in the center thereof.
또한, 상기한 챔버용 격벽부재(111b)의 모양도 도 8에 도시된 바와 같이 변화시키더라도, 잉크가 충전되는 챔버만 형성할 수 있으면 무난히 채용될 수 있다.In addition, even if the shape of the chamber partition member 111b described above is changed as shown in FIG. 8, it can be employed without limitation as long as it can form only a chamber filled with ink.
상술한 바와 같이 본 발명에 따른 프린팅 헤드는, 히터와 컨덕터 및 오리피스를 가요성 인쇄회로기판에 마련하기 때문에, 난해한 탭본딩 작업을 생략할 수 있어서 조립 공정을 간소화할 수 있으며 제품 불량도 줄일 수 있는 효과를 가진다.As described above, in the printing head according to the present invention, since the heater, the conductor, and the orifice are provided on the flexible printed circuit board, troublesome tap bonding can be omitted, thereby simplifying the assembly process and reducing product defects. Has an effect.
본 발명은 상기에 설명되고 도면에 예시된 것에 의해 한정되는 것은 아니며, 다음에 기재되는 청구의 범위 내에서 더 많은 변형 및 변용예가 가능한 것임은 물론이다.It is to be understood that the invention is not limited to that described above and illustrated in the drawings, and that more modifications and variations are possible within the scope of the following claims.
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| KR10-2000-0041745A KR100403579B1 (en) | 2000-07-20 | 2000-07-20 | Ink jet printing head |
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| KR10-2000-0041745A KR100403579B1 (en) | 2000-07-20 | 2000-07-20 | Ink jet printing head |
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