CN201442384U - Spliced thermosensitive printing head - Google Patents
Spliced thermosensitive printing head Download PDFInfo
- Publication number
- CN201442384U CN201442384U CN2009200290210U CN200920029021U CN201442384U CN 201442384 U CN201442384 U CN 201442384U CN 2009200290210 U CN2009200290210 U CN 2009200290210U CN 200920029021 U CN200920029021 U CN 200920029021U CN 201442384 U CN201442384 U CN 201442384U
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- Prior art keywords
- ceramic substrate
- spliced
- printing
- splicing
- oblique line
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- Expired - Lifetime
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Abstract
The utility model relates to a printer, in particular to a spliced thermosensitive printing head. The spliced thermosensitive printing head comprises a ceramic substrate formed by an insulating material, a printed circuit board, a radiating plate, an encapsulation glue layer and an integrated circuit and is characterized in that the ceramic substrate is formed by splicing two ceramic wafers at least; a splicing line is shaped like an oblique line along the width direction of the ceramic substrate; and the angle range of the oblique line is 10 degrees to 30 degrees. The printer adopts an accurate cutting technology and a special wiring mode, as the edge of the spliced substrate adopts the oblique line, so a convex part is formed at the oblique line and adopts the special wiring mode, equivalently, a convex word-printing area is formed; the formed area fills a future spliced seam, and a height difference is formed when the ceramic substrate is spliced, therefore, the filling of the spliced seam is further guaranteed, thus achieving the printing effect without gaps and the printing effect the same as that of printing by single product and meeting the requirement of long-size printing.
Description
Technical field
The utility model relates to thermal printer, at length says it is a kind of splicing thermal printing head.
Background technology
At present; thermal printing head (thermal print head; abbreviation TPH) generally comprises formations such as ceramic substrate, printed substrate, heat sink, encapsulation glue-line, integrated circuit; ceramic substrate and printed substrate are adhered on the heat sink; integrated circuit is adhered on ceramic substrate or the printed substrate, carries out packaging protection with packaging plastic then.
Printed circuit on the substrate is by the break-make of integrated circuit realization circuit.Because ceramic substrate is a ceramic material, its length can not be oversize, and because device-restrictive, traditional thermal printing head can not satisfy the very wide requirement of some printing amplitudes, in order to overcome this difficulty, the way of a plurality of ceramic substrate splicings that we take is assembled, thereby but the existence of splicing the gap causes occurring always in the print pattern gap.Have a strong impact on print quality.
Summary of the invention:
The objective of the invention is to overcome above-mentioned the deficiencies in the prior art, provide a kind of and can realize the splicing thermal printing head that no relief width amplitude is printed.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of splicing thermal printing head, comprise ceramic substrate, printed substrate, heat sink, encapsulation glue-line, integrated circuit that insulating materials constitutes, it is characterized in that ceramic substrate is made up of the splicing of two ceramic substrates at least, splicing line is oblique line shape along the ceramic substrate width, and the oblique line angular range should be at 10 °～30 °.
The utility model adopts accurate cutting technique and special wire laying mode, because the splicing substrate edges adopts oblique line, so just form a ledge at the oblique line place, adopt special wire laying mode in this part, be equivalent to form a ledge lettering district, piece has in the future been filled up in the formation in this zone, add ceramic substrate and when splicing, form a difference in height, so further guaranteed filling up to piece, thereby reach gapless printing effect, reached with the separate unit product and printed the same effect, satisfied the requirement of long size marking.
Description of drawings
Fig. 1 is the structural representation of background technology.
Fig. 2 structural representation of the present utility model.
Mark among the figure: ceramic substrate 1, ceramic substrate S1 and ceramic substrate S2, printed substrate 2, heat sink 3, encapsulation glue-line 4, ceramic substrate gap A1, ceramic substrate height difference H, ceramic substrate edge tilt angle [alpha].
The specific embodiment:
Below in conjunction with accompanying drawing the utility model is further described:
As shown in the figure; a kind of splicing thermal printing head; comprise the ceramic substrate 1 that constitutes by insulating materials; on ceramic substrate 1, form heater resistance; ceramic substrate and printed circuit board (PCB) 2 are adhered on the heat sink 3 side by side; integrated circuit is adhered on ceramic substrate or the printed substrate; by spun gold circuit on the ceramic substrate is connected with circuit on the printed substrate; with packaging plastic 4 integrated circuit and spun gold are carried out packaging protection then; above-mentioned same as the prior art; this does not give unnecessary details; for realizing the more printing of wide cut degree; ceramic substrate S1 with ceramic substrate; its sheet of multi-discs such as ceramic substrate S2 pottery is spliced; the bevel(l)ing hypotenuse inclination angle, edge of the splicing mutually of ceramic substrate S1 and ceramic substrate S2 is generally at 10 °～30 °; form a ledge after the splicing mutually of ceramic substrate S1 and ceramic substrate S2; adopt special wire laying mode in this part; be equivalent to form a ledge lettering district; the formation in this zone has been filled up piece in the future and has been added ceramic substrate height difference H of formation when splicing; further guaranteed the filling up of piece, thereby reached gapless printing effect.
Claims (2)
1. one kind splices thermal printing head, comprise ceramic substrate, printed substrate, heat sink, encapsulation glue-line, integrated circuit that insulating materials constitutes, it is characterized in that ceramic substrate is made up of the splicing of two ceramic substrates at least, splicing line is oblique line shape along the ceramic substrate width.
2. a kind of splicing thermal printing head according to claim 1 is characterized in that splicing line oblique line angle is 10 °～30 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200290210U CN201442384U (en) | 2009-07-01 | 2009-07-01 | Spliced thermosensitive printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200290210U CN201442384U (en) | 2009-07-01 | 2009-07-01 | Spliced thermosensitive printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201442384U true CN201442384U (en) | 2010-04-28 |
Family
ID=42547060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200290210U Expired - Lifetime CN201442384U (en) | 2009-07-01 | 2009-07-01 | Spliced thermosensitive printing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201442384U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102490474A (en) * | 2011-12-12 | 2012-06-13 | 山东新北洋信息技术股份有限公司 | Heat printer and printing control method thereof |
| CN104742529A (en) * | 2015-04-20 | 2015-07-01 | 山东华菱电子股份有限公司 | Packaging device for thermal-printing heads |
| CN109986884A (en) * | 2018-01-18 | 2019-07-09 | Rf打印技术有限责任公司 | The inkjet print head of printhead unit containing classification alignment |
-
2009
- 2009-07-01 CN CN2009200290210U patent/CN201442384U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102490474A (en) * | 2011-12-12 | 2012-06-13 | 山东新北洋信息技术股份有限公司 | Heat printer and printing control method thereof |
| WO2013086910A1 (en) * | 2011-12-12 | 2013-06-20 | 山东新北洋信息技术股份有限公司 | Thermal printer and printing control method thereof |
| CN102490474B (en) * | 2011-12-12 | 2015-04-22 | 山东新北洋信息技术股份有限公司 | Heat printer and printing control method thereof |
| CN104742529A (en) * | 2015-04-20 | 2015-07-01 | 山东华菱电子股份有限公司 | Packaging device for thermal-printing heads |
| CN104742529B (en) * | 2015-04-20 | 2017-06-27 | 山东华菱电子股份有限公司 | Thermal printing head packaging system |
| CN109986884A (en) * | 2018-01-18 | 2019-07-09 | Rf打印技术有限责任公司 | The inkjet print head of printhead unit containing classification alignment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 264200 Torch Road, hi tech Industrial Development Zone, Shandong, Weihai 159 Patentee after: SHANDONG HUALING ELECTRONICS CO., LTD. Address before: 264200 Torch Road, hi tech Industrial Development Zone, Shandong, Weihai 159 Patentee before: Hualing Electronics Co., Ltd., Shandong |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100428 |