CN203004532U

CN203004532U - A spliced thermal printing head

Info

Publication number: CN203004532U
Application number: CN 201320019898
Authority: CN
Inventors: 赵哲; 李月娟; 杨涛
Original assignee: HUALING ELECTRONICS CO Ltd SHANDONG
Current assignee: Shandong Hualing Electronics Co Ltd
Priority date: 2013-01-15
Filing date: 2013-01-15
Publication date: 2013-06-19
Anticipated expiration: 2023-01-15

Abstract

The utility model relates to a spliced thermal printing head. The spliced thermal printing head is characterized in that an insulating substrate is formed by splicing at least two ceramic substrates, that adjacent ceramic substrates along the main printing direction are spliced in a staggered manner, that the splicing end of the ceramic substrate presents a shape of a vertical inclined plane, and that angle of a conductor wire on the ceramic substrate uniformly varies from large to little until the conductor wire is overlapped with a line in parallel with the main printing direction. The conductor wires which are staggered along the main printing direction can be spliced in a manner that a latter ceramic substrate is integrally staggered relative to a former ceramic substrate, or can be spliced in a manner that part conductor wires close to a splicing seam are staggered relative to other conductor wires on the same ceramic substrate along the main printing direction. The staggered ceramic substrates or the staggered conductor wires can be staggered at top or staggered at bottom. The spliced thermal printing head is flexible in splicing requirements and angle control of the substrate edges and has characteristics of simple and feasible implement technology, accurate positioning, and reliable connection. The spliced thermal printing head prevents problems of white lines generated at printing points and strict requirements for edge cutting precision of the substrate.

Description

A kind of splicing thermal printing head

Technical field

The utility model relates to a kind of thermal printing head, particularly a kind of splicing thermal printing head of realizing seamless spliced printing.

Background technology

as everyone knows, thermal printing head is provided with insulated substrate and hard printed substrate, insulated substrate and hard printed substrate are adhered on heat sink side by side, insulated substrate is provided with ground glaze layer, be provided with conductor lines on ground glaze layer, conductor lines is divided into individual electrode and common electrode, in conductor lines along leading India side to forming heating resistor, individual electrode one end is connected with heating resistor along secondary Print direction, the other end is connected with control IC, one end of common electrode is connected with heating resistor along secondary Print direction, the other end is connected with common wire pattern, control IC, common wire pattern is adhered on insulated substrate or hard printed substrate, by spun gold, circuit on insulated substrate is connected with circuit on the hard printed substrate, then with the protection glue-line, integrated circuit and spun gold are carried out packaging protection formation thermal printing head.

Usually be parallel to insulated substrate along insulated substrate length master Print direction, secondary Print direction is perpendicular to insulated substrate, insulated substrate is along the equidistant arrangement conductor lines of secondary Print direction, conductor lines forms resistive element by covering resistance slurry, each resistive element prints a point by applying voltage, point evenly distributes with the distance dot density as required of point, such as: when needing dot density to be 200dpi, distance between points is 0.125mm, the distance of consecutive points is all 0.125mm on secondary Print direction.

Insulated substrate generally adopts ceramic material to make, due to the restriction that is subject to apparatus and process, it is oversize that ceramic substrate can not be made, print in order to realize wide cut, the general method that adopts the splicing of polylith ceramic substrate, for the splicing printhead, the distance of printing the splice point at splicing line two ends is 0.125mm, namely be considered to seamless spliced printhead, Fig. 2 realizes seamless spliced conductor lines arrangement mode under perfect condition.Splicing line 6 two ends consecutive points spacing X equate with conventional dot spacing P, limit owing to being subjected to the installation site, the substrate splicing can't realize absolute gapless, be that under regular situation, X can be greater than P, realize seamless spliced, just require the cutting accuracy of insulated substrate splicing place very high, lead the processing cost multiplication, and present equipment and process is difficult to reach.

a kind of splicing thermal printing head has been invented by our company, the patent No. is 200920029021.0, its principal character is that splicing line is oblique line shape along the substrate width direction, it includes the ceramic substrate that insulating materials consists of, form heater resistance on ceramic substrate, ceramic substrate and printed circuit board (PCB) are bonded on heat sink side by side, integrated circuit is bonded on ceramic substrate or printed substrate, by spun gold, circuit on ceramic substrate is connected with circuit on printed substrate, then with packaging plastic, integrated circuit and spun gold are carried out packaging protection, for realizing the more printing of wide cut degree, the multi-disc ceramic substrates such as ceramic substrate S1 and ceramic substrate S2 are spliced, the edge bevel(l)ing that insulated substrate splices mutually, the hypotenuse inclination alpha is generally at 10 °～30 °, ceramic substrate S1 splices ledge of rear formation mutually with S2, adopt special wire laying mode in this part, be equivalent to form an outstanding belly lettering district, this patent item is emphasized special wiring in wiring, do not explicitly point out, in order to realize the gapless printing effect that continues, crucial mode at conductor wiring, regional at outstanding lettering of substrate oblique line splicing position formation like this, and go winding displacement by mistake, realize seamless spliced between jigsaw, but it emphasizes to adopt the substrate cut technology of high precision, realizing seamless spliced also not clear and definite its special wire laying mode.

Summary of the invention

The purpose of this utility model is exactly in order to solve substrate cut and substrate wiring problem, to adopt italic conductor lines structure and dislocation wiring, a kind of technique simple possible is provided, realizing the splicing thermal printing head of seamless process at the insulated substrate of splicing.

The utility model can reach by following measure.

a kind of splicing thermal printing head, be provided with insulated substrate, printed substrate and heat sink, insulated substrate is provided with ground glaze layer, be provided with conductor lines on ground glaze layer, conductor lines is divided into individual electrode and common electrode, in conductor lines along leading India side to forming heating resistor, individual electrode one end is connected with heating resistor along secondary Print direction, the other end is connected with control IC, one end of common electrode is connected with heating resistor along secondary Print direction, the other end is connected with common wire pattern, control IC, common wire pattern is adhered on insulated substrate or hard printed substrate, by spun gold, circuit on insulated substrate is connected with circuit on the hard printed substrate, insulated substrate and printed substrate are arranged on heat sink, it is characterized in that insulated substrate is spliced by two ceramic substrates at least, along the adjacent ceramic substrate dislocation splicing of main Print direction, the ceramic substrate splice ends is vertical inclined plane shape, conductor lines on ceramic substrate by splice ends rise angle by greatly evenly diminish to overlap along main Print direction.

Described in the utility model along main Print direction adjacent ceramic substrate splicing standard implementation 1mm dislocation, namely the dislocation 0.125mm of 8 points multiply by 8 integral points that equal 1mm and controls, also can different dislocation be set according to the multiple relation of dot spacing, such as calculating by the 200dpi dot density, 4 points that misplace can misplace and multiply by 4 apart from 0.125mm and equal 0.5mm, and 12 points misplace, can misplace and multiply by 12 apart from 0.125mm and equal 1.5mm, maximum dislocation distance is controlled at 2mm.

The utility model is vertical inclined plane shape along secondary Print direction ceramic substrate splice ends, and angular range can be 10 ° to 30 ° settings.Ceramic substrate splice ends article one conductor lines and secondary Print direction are 30 °, progressively evenly reduce by 2 ° of angles along secondary Print direction conductor lines, be that article one conductor lines is by 28 °, the second wire body is 26 °, article three, wire body is 24 °, be extended to the 16th strip conductor line just with secondary Print direction non-angular,, follow-uply all be conventional vertical conductor line.The angle of gradual change also can be set to other as 1 ° or 5 ° etc. according to design requirement.

Wire body along from leading India side to dislocation described in the utility model can be the integral body dislocation of the rear relatively last ceramic substrate of a ceramic substrate in splicing, the wire body that also can close on splicing seams for part with respect to other conductor lines of same ceramic substrate along leading India side to dislocation, ceramic substrate or the conductor lines of dislocation can be all upper dislocation, can be also lower dislocation.

The present invention adopts said structure to carry out particular design to the substrate angle of lay, it is controlled nimbly and freely in piece requirement and basic bevel angle, realize that technique simple and feasible, accurate positioning, connection are reliable, avoided the problem that white line and substrate trimming precision are strict with occurring at print point.

Description of drawings

Fig. 1 splices the overall structure schematic diagram of thermal printing head.

Fig. 2 is that in Fig. 1, seamless spliced conductor lines wire structures schematic diagram is thought in the A processing.

Fig. 3 is the splicing construction schematic diagram of existing conventional conductor lines structure.

Fig. 4 is a kind of conductor lines structural representation of the present utility model, and connecting method is the integral body dislocation of the relatively last ceramic substrate of a rear ceramic substrate.

Fig. 5 is another kind of wire body structural representation of the present utility model, be close on splicing seams wire body with respect to other conductor lines of same ceramic substrate along leading India side to the dislocation mode.

Mark in figure: the invalid gap Y of ceramic substrate 1, ceramic substrate S1, ceramic substrate S2, printed substrate 2, heat sink 3, encapsulation glue-line 4, conductor lines 5, splicing line 6, splicing line consecutive points spacing X, conventional consecutive points spacing P, active conductor line and splicing line, ceramic substrate conductor lines dislocation height difference H, ceramic substrate edge tilt angle [alpha], conductor lines tilt angle alpha 1

The specific embodiment

The invention will be further described below in conjunction with accompanying drawing and example.

Fig. 1 is the structural representation based on the splicing thermal printing head of patent " 200920029021.0 ", and it realizes that the seamless spliced of wire can amplify to illustrate by A section.

Fig. 2 realizes seamless spliced conductor lines arrangement mode under perfect condition, splicing line 6 two ends consecutive points spacing X equate with conventional dot spacing P, limited by the ceramic substrate installation deviation, cause X greater than P.

Fig. 3 is the mode of only having splicing line to tilt, and conductor lines 5 is evenly distributed to splicing line 6 along main Print direction, and due to the restriction that is subjected to line style to want Vertical Uniform to arrange, the invalid gap Y of conductor lines splicing line is very narrow, to the just increase of required precision on cutting plate limit.And the ceramic substrate that the joins ceramic lettering district that forms by hypotenuse can not reach desirable combining closely and realizes seamless spliced effect, namely splice point spacing X is greater than the dot spacing P that requires, and printing blank can occur and namely can't realize seamless spliced without putting the district.

Example 1.

Fig. 4 is the rake angle conductor lines plane enlarged diagram of this working of an invention form.Conductor lines 5 is arranged along main Print direction, vertically tilts in the conductor lines 5 near splicing line 6, arranges with the splicing line angle is consistent, along with conductor lines 5 away from splicing line 6, the angle [alpha] 1 of conductor lines 5 progressively diminishes, until reach 0 °, namely conductor lines returns to and main Print direction vertical mode.Because conductor lines 5 is consistent with splicing line 6 angle [alpha], the invalid gap Y of conductor lines splicing line just broadens, to better control of craft precision requirement on cutting plate limit.And the ceramic substrate that the joins ceramic lettering district that forms by hypotenuse can adjust at any time by the invalid gap Y of retention on cutting plate limit, can satisfy and combine closely and realize seamless spliced effect, namely splicing line consecutive points spacing X adjusts as requested in good time, make X satisfy conventional dot spacing P, print result is in regulatable scope, realizes seamless printing splicing.

Example 2.

Fig. 5 is the enlarged diagram of the longitudinal conductor dislocation design of this working of an invention form.5 at least 1 of conductor lines are dislocation vertically, on form the dislocation height difference H with conventional conductor lines after moving or moving down, by adjusting height difference H, can make splice point spacing X consistent with conventional dot spacing P, or reach any requirement.Satisfy the different size requirement in splicing gap.Dislocation increases the invalid gap Y of splicing line with the design of rake angle, and cutting plate technique is better controlled.

Claims

1. one kind splices thermal printing head, be provided with insulated substrate, printed substrate and heat sink, insulated substrate is provided with ground glaze layer, be provided with conductor lines on ground glaze layer, conductor lines is divided into individual electrode and common electrode, in conductor lines along leading India side to forming heating resistor, individual electrode one end is connected with heating resistor along secondary Print direction, the other end is connected with control IC, one end of common electrode is connected with heating resistor along secondary Print direction, the other end is connected with common wire pattern, control IC, common wire pattern is adhered on insulated substrate or hard printed substrate, by spun gold, circuit on insulated substrate is connected with circuit on the hard printed substrate, insulated substrate and printed substrate are arranged on heat sink, it is characterized in that insulated substrate is spliced by two ceramic substrates at least, along the adjacent ceramic substrate dislocation splicing of main Print direction, the ceramic substrate splice ends is vertical inclined plane shape, conductor lines on ceramic substrate by splice ends rise angle by greatly evenly diminish to overlap along main Print direction.

2. a kind of splicing thermal printing head according to claim 1, is characterized in that the dislocation distance of adjacent ceramic substrate is at 0.5-2mm.