CN217373919U

CN217373919U - Heating substrate for high-resolution thermal printing head

Info

Publication number: CN217373919U
Application number: CN202221139266.0U
Authority: CN
Inventors: 陈文卓; 曹永茂; 王吉刚; 冷正超; 于庆涛
Original assignee: Shandong Hualing Electronics Co Ltd
Current assignee: Shandong Hualing Electronics Co Ltd
Priority date: 2022-05-12
Filing date: 2022-05-12
Publication date: 2022-09-06
Anticipated expiration: 2032-05-12

Abstract

The utility model relates to a thermal printing makes technical field, specific can show and reduce electrode impedance, reduce electric energy loss's high resolution thermal printing head with base plate that generates heat, a serial communication port, the overglaze layer including set up at the upside overglaze layer of insulating substrate upper surface, set up at the downside overglaze layer of insulating substrate lower surface and set up in insulating substrate end side and respectively with the terminal surface overglaze layer that upside overglaze layer and downside overglaze layer link to each other, the resistive element that generates heat sets up on the overglaze layer, electrode wire with the resistive element that generates heat link to each other and distribute on upper underglaze layer, terminal surface overglaze layer and lower floor overglaze layer, compare with prior art, have rational in infrastructure, reliable operation, the advantage that electric energy consumption low grade is showing.

Description

Heating substrate for high-resolution thermal printing head

Technical Field

The utility model relates to a thermal print head makes technical field, specific can show and reduce electrode impedance, reduces electric energy loss's high resolution thermal print head with base plate that generates heat that says so.

Background

As is well known, a thick film thermal print head in the prior art includes an insulating substrate, a ground coat layer is provided on the surface of the insulating substrate, a common electrode and an individual electrode are provided on the surfaces of the insulating substrate and the ground coat layer, and then a heating resistor is disposed between the two electrodes, wherein one end of the common electrode is connected to the heating resistor, and the other end is connected to a power supply; one end of the individual electrode is connected with the heating resistor body, the other end of the individual electrode is connected with the bonding pad, then an insulating glass glaze protective layer is arranged on the surfaces of the heating resistor body, the individual electrode and the common electrode, the two electrodes are matched with the single heating resistor body to form a plurality of heating element units, and the plurality of heating element units generate heat under the control of external control data and are in contact with a thermal printing medium, so that the thermal paper is developed to finish the printing work.

In order to reduce the power loss of the circuit, the resistances of the individual electrodes and the common electrodes constituting the heat conductive circuit of the thermal print head should be as low as possible, and common ways to reduce the resistance include increasing the thickness of the electrodes, increasing the width of the electrode lines, etc., but due to the material cost, the increase in the thickness of the electrodes is limited, and due to the limitation of the wiring space, it is difficult to reduce the resistance of the electrodes by increasing the width of the conductive lines, and thus the requirement of the high-resolution thermal print head cannot be satisfied.

Disclosure of Invention

The utility model discloses shortcoming and not enough to exist among the prior art, provided one kind and can show and reduce electrode impedance, and then reduced the high resolution thermal printing head of thermal printing head thermal circuit's electric energy loss and used the base plate that generates heat.

The utility model discloses a following measure reaches:

a heating substrate for a high-resolution thermal printing head is provided with an insulating substrate, wherein the surface of the insulating substrate is provided with a ground coat layer and a thermal printing heating conductive loop consisting of an electrode lead and a heating resistor body, the electrode lead comprises a common electrode and an individual electrode, the heating resistor body is arranged between the two electrodes, one end of the common electrode is connected with the heating resistor body, the other end of the common electrode is connected with a power supply, one end of the individual electrode is connected with the heating resistor body, and the other end of the individual electrode is connected with a control IC; the ground coat is characterized by comprising an upper ground coat layer arranged on the upper surface of an insulating substrate, a lower ground coat layer arranged on the lower surface of the insulating substrate and an end face ground coat layer arranged on the end side surface of the insulating substrate and respectively connected with the upper ground coat layer and the lower ground coat layer, wherein the heating resistor body is arranged on the upper ground coat layer, and the electrode leads are connected with the heating resistor body and distributed on the upper ground coat layer, the end face ground coat layer and the lower ground coat layer.

The utility model discloses a sharing electrode includes a plurality of common electrode monomers that set up along vice direction of printing, and adjacent three sharing electrode monomer both ends are linked to each other by the portion of bending, form S form connector, and sharing electrode comprises a plurality of S form connector that sets up in succession, and wherein the portion of bending outside is equipped with the extension, and the extension is used for linking to each other with the power, individuation electrode contains a plurality of along the individuation electrode monomer of vice direction of printing setting, and individuation electrode monomer sets up between two adjacent sharing electrode monomers, sets up promptly in the opening space of the S form connector of sharing electrode.

The common electrode and the individual electrode of heating resistor body one side directly set up on the upper ground coat layer, and the common electrode and the individual electrode of opposite side extend to on the ground coat layer of lower floor by terminal surface ground coat layer to increase wiring space.

The common electrode monomer in the common electrode and the individual electrode monomer in the individual electrode are respectively arranged on the upper surface and the lower surface of the insulating substrate according to the odd number and the even number interval.

The utility model discloses an upper and lower surface and the terminal side face at insulating substrate set up the overglaze layer, the wiring space of electrode line in the conductive circuit that generates heat has been increased to the thermal printing, wherein change the common electrode structure of original pectination into the new-type common electrode structure of constituteing in succession by a plurality of S form connector, make common electrode and individual electrode can distribute at insulating substrate' S upper surface, side end face and lower surface, it has increased wiring area to show, make the electrode wire can satisfy the low impedance requirement, compared with the prior art, it is rational in infrastructure to have, reliable operation, the advantage that electric energy consumption hangs down etc. and show.

Description of the drawings:

fig. 1 is a cross-sectional view of the present invention.

Fig. 2 is a schematic diagram of a front surface structure of an insulating substrate in the prior art.

Fig. 3 is a schematic diagram of the front structure of the middle insulating substrate of the present invention.

Reference numerals: an insulating substrate 1, an under coat layer 2, an electrode line 3, a common electrode 3a, a common electrode extension portion 3b, an individual electrode 3c, a heating resistor 4, an insulating protective layer 5, and a substrate side end face 6.

The specific implementation mode is as follows:

the present invention will be further described with reference to the accompanying drawings and examples.

Example 1:

as shown in fig. 1 and 3, the present example provides a heating substrate for a high resolution thermal print head, comprising an insulating substrate 1, an enamel layer 2 made of amorphous glass material is provided on the upper and lower surfaces and the substrate side end surfaces of the insulating substrate 1, a common electrode 3a, a common electrode extension portion 3b and an individual electrode 3c are provided on the surface of the enamel layer 2, wherein a heating resistor 4 is arranged between the common electrode and the individual electrode 3 along the main printing direction and is positioned on the upper surface of the insulating substrate; one end of the common electrode is connected to the heating resistor 4 in the sub-printing direction, and the other end, i.e., the common electrode extension 3b, is used for connecting to a power supply; one end of the individual electrode 3c is connected to the heating resistor 4 in the sub-printing direction, and covers the surfaces of the heating resistor 4, the common electrode 3a, the common electrode extension portion 3b, and the individual electrode 3c with a protective layer 5 to protect the heating substrate;

in this example, the common electrode 3a, the common electrode extending portion 3b and the individual electrode 3c are respectively arranged on the upper and lower surfaces of the substrate in the main printing direction in the order of odd number and even number of the heating resistor, the common electrode 3a on the upper surface of the substrate is in a periodic S-shape along the main printing direction, the common electrode extending portion 3b connected to the power supply is formed at the bent portion of each S-shaped common electrode 3a along the sub-printing direction, and is distributed on both sides of the heating resistor 4 in parallel with the individual electrode 3c at intervals, the common electrode 3a and the individual electrode 3c above the heating resistor 4 on the upper surface of the substrate are electrically connected to the common electrode 3a and the individual electrode 3c distributed in one direction on the lower surface of the substrate through the substrate side end surface 6;

the size of the heating resistor in the embodiment is changed from L to L/2 in the prior art, the printing resolution is improved, the problem of insufficient wiring space is solved on the basis of not increasing the wire resistance by using a double-sided wiring mode, and the thermal printing head with 2 times of resolution in the prior art is realized.

Compared with the prior art, the utility model, have rational in infrastructure, reliable operation, electric energy consumption low grade advantage that is showing.

Claims

1. A heating substrate for a high-resolution thermal printing head is provided with an insulating substrate, wherein the surface of the insulating substrate is provided with a ground coat layer and a thermal printing heating conductive loop consisting of an electrode lead and a heating resistor body, the electrode lead comprises a common electrode and an individual electrode, the heating resistor body is arranged between the two electrodes, one end of the common electrode is connected with the heating resistor body, the other end of the common electrode is connected with a power supply, one end of the individual electrode is connected with the heating resistor body, and the other end of the individual electrode is connected with a control IC; the ground coat is characterized by comprising an upper ground coat layer arranged on the upper surface of an insulating substrate, a lower ground coat layer arranged on the lower surface of the insulating substrate and an end face ground coat layer arranged on the end side surface of the insulating substrate and respectively connected with the upper ground coat layer and the lower ground coat layer, wherein the heating resistor body is arranged on the upper ground coat layer, and the electrode leads are connected with the heating resistor body and distributed on the upper ground coat layer, the end face ground coat layer and the lower ground coat layer.

2. The heating substrate for the high-resolution thermal printing head according to claim 1, wherein the common electrode comprises a plurality of common electrode monomers arranged along the secondary printing direction, two ends of three adjacent common electrode monomers are connected by a bending part to form an S-shaped connector, the common electrode comprises a plurality of S-shaped connectors arranged continuously, wherein an extension part is arranged outside the bending part and used for connecting with a power supply.

3. The heat-generating substrate for a high-resolution thermal printhead according to claim 2, wherein the individual electrode includes a plurality of individual electrode cells arranged in the sub-printing direction, and the individual electrode cells are arranged between two adjacent common electrode cells, that is, in the open space of the S-shaped connection body of the common electrode.

4. The heat-generating substrate for a high-resolution thermal print head according to claim 2, wherein the common electrode and the individual electrode on one side of the heat-generating resistor are directly provided on the upper layer of the under coat layer, and the common electrode and the individual electrode on the other side extend from the end surface of the under coat layer to the lower layer of the under coat layer.

5. The heat-generating substrate for a high-resolution thermal printhead according to claim 2, wherein the single common electrode in the common electrodes and the single individual electrode in the individual electrodes are disposed at odd and even intervals on the upper and lower surfaces of the insulating substrate, respectively.