CN201294680Y - Microwave high-frequency multi-layer circuit board - Google Patents
Microwave high-frequency multi-layer circuit board Download PDFInfo
- Publication number
- CN201294680Y CN201294680Y CNU2008201611939U CN200820161193U CN201294680Y CN 201294680 Y CN201294680 Y CN 201294680Y CN U2008201611939 U CNU2008201611939 U CN U2008201611939U CN 200820161193 U CN200820161193 U CN 200820161193U CN 201294680 Y CN201294680 Y CN 201294680Y
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- single piece
- circuit board
- plate
- piece plate
- layer circuit
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Abstract
The utility model discloses a microwave high-frequency multiple-layer circuit board which comprises a plurality of inner single-web plates (1) and a plurality of outer single-web plates (2), wherein the surfaces of the inner single-web plates (1) and the outer single-web plates (2) are pasted with films, square grooves are arranged on the inner single-web plates (1), the inner single-web plates (1) and the outer single-web plates (2) are alternatively superposed, and form a plate body after laminating, and the plate body is provided with a positioning hole (3). A binding sheet of the utility model is polytetrafluoroethylene vitrified cloth, which can improve the stability of the multiple-layer circuit board, guarantees smaller dielectric constant and lower dielectric loss, and improves weldability and pull-off strength. The inner single-web plates and the outer single-web plates of the utility model adopt glass fiber reinforced tetrafluoroethylene coated copper foil plates, ceramic stuffed polytetrafluoroethylene coated copper foil plates or ceramic stuffed thermosetting resin coated copper foil plates, which can improve dielectric performance and mechanical performance of the circuit board.
Description
Technical field
The utility model relates to a kind of microwave high-frequency multi-layer circuit board, particularly is applied to the multilayer circuit board of high-frequency signal transmission electronic product and high-speed logic signal transmission signals electronic product.
Background technology
Along with the direction of electronic product to miniaturization, high frequencyization, digitlization, high reliabilityization develops, the microwave current high-frequency multi-layer circuit board adopts epoxy resin board (FR-4) to be adhesive sheet in the course of processing, but its kind is single, solderability is low, and dielectric loss is big, and dielectric constant is big, and the processing of hole wall is to adopt sodium salt solution to handle in the present in addition manufacturing process, but so just reduced the stability of circuit board, particularly the stability of Zhu Cuning.
Summary of the invention
The utility model provides a kind of microwave high-frequency multi-layer circuit board, and it is the precision height not only, stable performance, and also dielectric constant is stable, and dielectric loss is little.
The utility model has adopted following technical scheme: a kind of microwave high-frequency multi-layer circuit board, it comprises some internal layer single piece plate and plurality of outer-layer single piece plate, pad pasting is carried out on surface in internal layer single piece plate and outer single piece plate, the internal layer single piece plate is provided with square groove, outer single piece plate and internal layer single piece plate replace overlapping and carry out forming plate body behind the lamination, are provided with location hole on plate body.
Described location hole is a plated-through hole.Adopt bonding sheet to bond between described every internal layer single piece plate and every outer single piece plate.Described bonding sheet is a polytetrafluoroethylene vitrifying cloth.
Described internal layer single piece plate and outer single piece plate are that glass fibre strengthens tetrafluoroethene copper coated foil plate, ceramic filled polytetrafluoroethylene copper coated foil plate or ceramic filled thermoset resin coating copper foil plate.The outer surface of described plate body is provided with electrodeposited coating.Described electrodeposited coating is copper electroplating layer or electrogilding layer.
The utlity model has following beneficial effect: bonding sheet of the present utility model is a polytetrafluoroethylene vitrifying cloth, can improve the stability of multilayer circuit board like this, guarantee less dielectric constant and lower dielectric loss, improved solderability and pull-off strength simultaneously.What internal layer single piece plate of the present utility model and outer single piece plate adopted is that glass fibre strengthens tetrafluoroethene copper coated foil plate, ceramic filled polytetrafluoroethylene copper coated foil plate or ceramic filled thermoset resin coating copper foil plate, can improve the dielectric property and the mechanical performance of circuit board like this.
Description of drawings
Fig. 1 is a structural representation of the present utility model
Embodiment
In Fig. 1, the utility model is a kind of microwave high-frequency multi-layer circuit board, it comprises some internal layer single piece plate 1 and plurality of outer-layer single piece plate 2, internal layer single piece plate 1 and outer single piece plate 2 strengthen the tetrafluoroethene copper coated foil plate for glass fibre, pottery filled polytetrafluoroethylene copper coated foil plate or ceramic filled thermoset resin coating copper foil plate, in, adopt CAD to carry out graphic designs on the outer single piece plate, pad pasting is carried out on surface in internal layer single piece plate 1 and outer single piece plate 2, internal layer single piece plate 1 is provided with square groove, outer single piece plate 2 replaces overlapping with internal layer single piece plate 1 and carries out forming plate body behind the lamination, adopt bonding sheet 4 to bond between every internal layer single piece plate 1 and every outer single piece plate 2, bonding sheet 4 is a polytetrafluoroethylene vitrifying cloth, on plate body, be provided with location hole 3, location hole 3 is a plated-through hole, the outer surface of plate body is provided with electrodeposited coating 5, and electrodeposited coating 5 is copper electroplating layer or electrogilding layer.
Plate body is being carried out plasma treatment, the process of plasma treatment is that the phase of plasma is because the state of electronics that intensifies in the atom and molecular disorder motion, in the internal vacuum chamber gas molecule, apply energy, the collision of accelerated electron makes molecule, the outermost electron of atom is intensified, and production ion or reactive high free radical, the ion that produces like this, free radical is by continuous collision and destroy the number micrometer range with interior molecular link, induce reduction thickness, produce convex-concave surface, form functional group's Surface Physical of gas componant simultaneously, chemical change, internal layer single piece plate 1 is carried out melanism handle, melanism is handled and comprised following process: at first carry out upper plate, the oil of then removing on the plate is washed, microetch, carry out the washing of secondary adverse current then, preimpregnation, melanism, wash for the third time again, reduction, hot water wash is carried out lower plate at last.
Claims (7)
1, a kind of microwave high-frequency multi-layer circuit board, it is characterized in that it comprises some internal layer single piece plate (1) and plurality of outer-layer single piece plate (2), pad pasting (6) is carried out on surface in internal layer single piece plate (1) and outer single piece plate (2), internal layer single piece plate (1) is provided with square groove, outer single piece plate (2) replaces overlapping with internal layer single piece plate (1) and carries out forming plate body behind the lamination, is provided with location hole (3) on plate body.
2, microwave high-frequency multi-layer circuit board according to claim 1 is characterized in that described location hole (3) is a plated-through hole.
3, microwave high-frequency multi-layer circuit board according to claim 1 is characterized in that adopting bonding sheet (4) to bond between described every internal layer single piece plate (1) and the every outer single piece plate (2).
4, microwave high-frequency multi-layer circuit board according to claim 1 is characterized in that described bonding sheet (4) is a polytetrafluoroethylene vitrifying cloth.
5,, it is characterized in that described internal layer single piece plate (1) and outer single piece plate (2) strengthen tetrafluoroethene copper coated foil plate, ceramic filled polytetrafluoroethylene copper coated foil plate or ceramic filled thermoset resin coating copper foil plate for glass fibre according to claim 1 or 3 described microwave high-frequency multi-layer circuit boards.
6, microwave high-frequency multi-layer circuit board according to claim 1 is characterized in that the outer surface of described plate body is provided with electrodeposited coating (5).
7, microwave high-frequency multi-layer circuit board according to claim 6 is characterized in that described electrodeposited coating (5) is copper electroplating layer or electrogilding layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201611939U CN201294680Y (en) | 2008-11-10 | 2008-11-10 | Microwave high-frequency multi-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201611939U CN201294680Y (en) | 2008-11-10 | 2008-11-10 | Microwave high-frequency multi-layer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201294680Y true CN201294680Y (en) | 2009-08-19 |
Family
ID=41008162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201611939U Expired - Fee Related CN201294680Y (en) | 2008-11-10 | 2008-11-10 | Microwave high-frequency multi-layer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201294680Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102421243A (en) * | 2011-08-06 | 2012-04-18 | 倪新军 | Microwave high-frequency circuit board |
| CN107567209A (en) * | 2017-09-30 | 2018-01-09 | 华宇华源电子科技（深圳）有限公司 | A kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method |
| CN110073560A (en) * | 2016-12-19 | 2019-07-30 | Abb瑞士股份有限公司 | Lamination type multiphase busbar connector and the method for manufacturing it |
-
2008
- 2008-11-10 CN CNU2008201611939U patent/CN201294680Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102421243A (en) * | 2011-08-06 | 2012-04-18 | 倪新军 | Microwave high-frequency circuit board |
| CN110073560A (en) * | 2016-12-19 | 2019-07-30 | Abb瑞士股份有限公司 | Lamination type multiphase busbar connector and the method for manufacturing it |
| CN107567209A (en) * | 2017-09-30 | 2018-01-09 | 华宇华源电子科技（深圳）有限公司 | A kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Wangling Insulating Material Plant, Taizhou Assignor: Gu Genshan Contract record no.: 2010320000225 Denomination of utility model: Method for preparing microwave high-frequency multi-layer circuit board Granted publication date: 20090819 License type: Exclusive License Record date: 20100315 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090819 Termination date: 20171110 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |