CN201207390Y - 表面粘着型led及其金属支架、线架结构 - Google Patents
表面粘着型led及其金属支架、线架结构 Download PDFInfo
- Publication number
- CN201207390Y CN201207390Y CN 200820117312 CN200820117312U CN201207390Y CN 201207390 Y CN201207390 Y CN 201207390Y CN 200820117312 CN200820117312 CN 200820117312 CN 200820117312 U CN200820117312 U CN 200820117312U CN 201207390 Y CN201207390 Y CN 201207390Y
- Authority
- CN
- China
- Prior art keywords
- bearing portion
- conducting terminal
- metallic support
- chip bearing
- bowl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 title claims abstract description 24
- 238000010276 construction Methods 0.000 title description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 28
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 230000004308 accommodation Effects 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 9
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 1
- 238000005755 formation reaction Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820117312 CN201207390Y (zh) | 2008-06-02 | 2008-06-02 | 表面粘着型led及其金属支架、线架结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820117312 CN201207390Y (zh) | 2008-06-02 | 2008-06-02 | 表面粘着型led及其金属支架、线架结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201207390Y true CN201207390Y (zh) | 2009-03-11 |
Family
ID=40466447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200820117312 Expired - Fee Related CN201207390Y (zh) | 2008-06-02 | 2008-06-02 | 表面粘着型led及其金属支架、线架结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201207390Y (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102437151A (zh) * | 2011-11-17 | 2012-05-02 | 佛山市蓝箭电子有限公司 | 一种全彩smd led支架结构及其封装产品装置 |
CN104838509A (zh) * | 2012-10-22 | 2015-08-12 | 传感器电子技术股份有限公司 | 双端子封装 |
-
2008
- 2008-06-02 CN CN 200820117312 patent/CN201207390Y/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102437151A (zh) * | 2011-11-17 | 2012-05-02 | 佛山市蓝箭电子有限公司 | 一种全彩smd led支架结构及其封装产品装置 |
CN102437151B (zh) * | 2011-11-17 | 2013-10-16 | 佛山市蓝箭电子股份有限公司 | 一种全彩smd led支架结构及其封装产品装置 |
CN104838509A (zh) * | 2012-10-22 | 2015-08-12 | 传感器电子技术股份有限公司 | 双端子封装 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: CHEN YONGHUA Free format text: FORMER OWNER: TATO PRECISION INDUSTRIAL CO., LTD. Effective date: 20100122 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20100122 Address after: Postcode of Taiwan County, Taipei, china: Patentee after: Chen Yonghua Address before: Postcode of Taiwan County, Taipei, china: Patentee before: Daduo Precision Ind Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090311 Termination date: 20140602 |