CN201204214Y - Chip type LED - Google Patents
Chip type LED Download PDFInfo
- Publication number
- CN201204214Y CN201204214Y CNU2008200954984U CN200820095498U CN201204214Y CN 201204214 Y CN201204214 Y CN 201204214Y CN U2008200954984 U CNU2008200954984 U CN U2008200954984U CN 200820095498 U CN200820095498 U CN 200820095498U CN 201204214 Y CN201204214 Y CN 201204214Y
- Authority
- CN
- China
- Prior art keywords
- chip
- thermal column
- type led
- lead bracket
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a light emitting diode chip as a light source, which is a chip-type LED constituted after lens packaging. The chip-type LED includes a chip, a lead wire bracket, lead wires connected between the chip and the lead wire bracket, and a metal heat radiation pole, wherein the top and bottom terminal of the heat radiation pole are provided with planes, the chip is provided on the top plane of the heat radiation pole in a eutectic soldering mode, high temperature resistant rubber shell is packaged on the lateral surface of the heat radiation pole, and a lens is provided above the heat radiation pole; the lens, the high temperature resistant rubber shell and the heat radiation pole form a closed space, the chip is located in the closed space; the lateral surface of the heat radiation pole is also provided with a sidestep which is also located in the closed space; one end of the lead wire bracket is perforated in the high temperature resistant rubber shell and extends in the closed space, and is provided on the sidestep; and a high temperature resistant insulator is also provided between the lead wire bracket and the sidestep. The utility model provides a chip-type LED with good heat radiation effect.
Description
Technical field
The utility model relates to a kind of light-emitting diode chip for backlight unit as light source, with the chip-type LED that constitutes after the lens packages.
Background technology
LED in the application of lighting field more and more widely, but heat dissipation problem is perplexing popularizing of LED lighting technology always.LED can cause serious light decay or electrically bad when heat radiation is bad, and dead lamp phenomenon.
Chip type LED in the past, chip all is arranged on above the insulated substrate.As notification number is the disclosed LED of Chinese invention patent document of CN1698214A, and its chip promptly is arranged on above the insulated substrate.The heat that this structure makes chip produce when work can not in time transmit to the external world, and it is overheated often to occur.
The utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art part and chip-type LED that a kind of good heat dissipation effect is provided.
The purpose of this utility model can be achieved through the following technical solutions:
Chip-type LED, comprise chip, down-lead bracket, and be connected in lead-in wire between chip and the down-lead bracket, it is characterized in that: the thermal column that also comprises metal material, the top of thermal column and bottom all have the plane, chip is arranged on the plane on thermal column top by eutectic weldering mode, the side encapsulation high-temperature plastic shell of thermal column, the top of thermal column is provided with lens, lens, the high-temperature plastic shell, thermal column constitutes the space of a sealing, chip is positioned at described enclosure space, and the side of thermal column also has step, and described step also is positioned at the inside of described enclosure space, one end of described down-lead bracket is arranged in the high-temperature plastic shell, stretch into the inside of described enclosure space, and be erected on the described step, also be provided with the high-temperature insulation body between down-lead bracket and the described step.
Chip-type LED is characterized in that: inboard, described high-temperature plastic shell top has a ring-shaped step, and the described lens described ring-shaped step of packing into connects in gluing mode.
Chip-type LED is characterized in that: be provided with a chip in the described enclosure space.
Chip-type LED is characterized in that: be provided with a plurality of chips in the described enclosure space.
Chip-type LED, it is characterized in that: described down-lead bracket is formed by the electric conducting material bending, comprise vertically section and two horizontal segments, vertically the upper end of section bends inwards into interior horizontal segment, and extension causes an end of the inside formation down-lead bracket of described enclosure space, vertically the lower end of section outwards is bent into outer horizontal segment, form the other end of down-lead bracket, and the bottom of the outer horizontal segment of down-lead bracket and described thermal column is in a horizontal plane.
The chip type LED that the utility model relates to, chip is set directly at the thermal column end face of metal material in eutectic weldering mode, and the heat that produces during chip operation can in time pass to thermal column.Because of the bottom surface of thermal column be a plane, can cooperate conductive sole plate to use (, promptly being provided with the aluminum substrate of insulating barrier and printed circuit) as aluminium base, radiating effect is better.Compare with the technical scheme that chip is arranged at insulated substrate of prior art, heat radiation conduction pattern of the present utility model is direct, and radiating effect is better.
Description of drawings
Fig. 1 is the cross-sectional schematic of first embodiment of the utility model.
Fig. 2 is the vertical view of first embodiment of the utility model.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
With reference to figure 1, Fig. 2, first embodiment of the utility model is a kind of chip-type LED, comprise chip 101, down-lead bracket 102, and be connected in lead-in wire 103 between chip 101 and the down-lead bracket 102, the thermal column 104 that also comprises metal material, in the present embodiment, thermal column 104 adopts the copper material of good heat conductivity, certainly, a kind of variation as present embodiment, also can adopt aluminium or other heat-conducting metal, the top of thermal column 104 and bottom all have the plane, chip 101 is arranged on the plane on thermal column 104 tops by eutectic weldering mode, the side encapsulation high-temperature plastic shell 105 of thermal column 104, in the present embodiment, high-temperature plastic shell 105 adopts LCP (LiquidCrystalline Polymer, be liquid crystal polymer), the top of thermal column 104 is provided with lens 106, with reference to figure 1, the thin type lens that adopt in the present embodiment, lens 106, high-temp glue shell 105, thermal column 104 constitutes the space of a sealing, chip 101 is positioned at described enclosure space, the side of thermal column 104 also has step, described step also is positioned at the inside of described enclosure space, and an end of described down-lead bracket 102 is arranged in high-temperature plastic shell 105, stretches into the inside of described enclosure space, and be erected on the described step, also be provided with high-temperature insulation body 107 between down-lead bracket 102 and the described step, in the present embodiment, high-temperature insulation body 107 adopts AlN pottery (being aluminium nitride ceramics), its heat resisting temperature is more than 500 ℃, so that satisfy the requirement to temperature of eutectic weldering.Inboard, described high-temperature plastic shell 105 top has a ring-shaped step, and the described lens 106 described ring-shaped step of packing into connects in gluing mode.In the present embodiment, be provided with a chip 101 in the described enclosure space.Certainly, as a distortion of present embodiment, also can be provided with a plurality of chips 101 in the described enclosure space, down-lead bracket 102 is provided with accordingly with chip 101 quantity.In the present embodiment, described down-lead bracket 102 is formed by the electric conducting material bending, comprise vertically 1021 and two horizontal segments 1022 of section and 1023, horizontal segment 1022 in vertically the upper end of section 1021 bends inwards, and extension causes an end of the inside formation down-lead bracket 102 of described enclosure space, vertically the lower end of section 1021 outwards is bent into outer horizontal segment 1023, form the other end of down-lead bracket 102, and the outer horizontal segment 1023 of down-lead bracket 102 is in a horizontal plane with the bottom of described thermal column 104, so that when on aluminium base, LED being installed, thermal column 104 can be close to aluminium base, reaches better radiating effect.
Claims (5)
1, a kind of chip-type LED, comprise chip, down-lead bracket, and be connected in lead-in wire between chip and the down-lead bracket, it is characterized in that: the thermal column that also comprises metal material, the top of thermal column and bottom all have the plane, chip is arranged on the plane on thermal column top by eutectic weldering mode, the side encapsulation high-temperature plastic shell of thermal column, the top of thermal column is provided with lens, lens, the high-temperature plastic shell, thermal column constitutes the space of a sealing, chip is positioned at described enclosure space, and the side of thermal column also has step, and described step also is positioned at the inside of described enclosure space, one end of described down-lead bracket is arranged in the high-temperature plastic shell, stretch into the inside of described enclosure space, and be erected on the described step, also be provided with the high-temperature insulation body between down-lead bracket and the described step.
2, chip-type LED according to claim 1 is characterized in that: inboard, described high-temperature plastic shell top has a ring-shaped step, and the described lens described ring-shaped step of packing into connects in gluing mode.
3, chip-type LED according to claim 1 is characterized in that: be provided with a chip in the described enclosure space.
4, chip-type LED according to claim 1 is characterized in that: be provided with a plurality of chips in the described enclosure space.
5, chip-type LED according to claim 1, it is characterized in that: described down-lead bracket is formed by the electric conducting material bending, comprise vertically section and two horizontal segments, vertically the upper end of section bends inwards into interior horizontal segment, and extension causes an end of the inside formation down-lead bracket of described enclosure space, vertically the lower end of section outwards is bent into outer horizontal segment, form the other end of down-lead bracket, and the bottom of the outer horizontal segment of down-lead bracket and described thermal column is in a horizontal plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200954984U CN201204214Y (en) | 2008-07-11 | 2008-07-11 | Chip type LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200954984U CN201204214Y (en) | 2008-07-11 | 2008-07-11 | Chip type LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201204214Y true CN201204214Y (en) | 2009-03-04 |
Family
ID=40426529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200954984U Expired - Fee Related CN201204214Y (en) | 2008-07-11 | 2008-07-11 | Chip type LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201204214Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102088055A (en) * | 2010-12-03 | 2011-06-08 | 东莞市胤腾光电科技有限公司 | LED support |
| CN102315135A (en) * | 2010-07-09 | 2012-01-11 | 联咏科技股份有限公司 | Chip package and manufacturing process thereof |
| CN111081849A (en) * | 2020-01-03 | 2020-04-28 | 广东省半导体产业技术研究院 | LED packaging structure and packaging method |
-
2008
- 2008-07-11 CN CNU2008200954984U patent/CN201204214Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102315135A (en) * | 2010-07-09 | 2012-01-11 | 联咏科技股份有限公司 | Chip package and manufacturing process thereof |
| CN102315135B (en) * | 2010-07-09 | 2014-08-20 | 联咏科技股份有限公司 | Chip package and manufacturing process thereof |
| CN102088055A (en) * | 2010-12-03 | 2011-06-08 | 东莞市胤腾光电科技有限公司 | LED support |
| CN102088055B (en) * | 2010-12-03 | 2013-03-27 | 东莞市胤腾光电科技有限公司 | LED support |
| CN111081849A (en) * | 2020-01-03 | 2020-04-28 | 广东省半导体产业技术研究院 | LED packaging structure and packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090304 Termination date: 20170711 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |