CN201195639Y - Full-automatic transmission apparatus for wafer - Google Patents
Full-automatic transmission apparatus for wafer Download PDFInfo
- Publication number
- CN201195639Y CN201195639Y CN 200820035161 CN200820035161U CN201195639Y CN 201195639 Y CN201195639 Y CN 201195639Y CN 200820035161 CN200820035161 CN 200820035161 CN 200820035161 U CN200820035161 U CN 200820035161U CN 201195639 Y CN201195639 Y CN 201195639Y
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- CN
- China
- Prior art keywords
- negative pressure
- wafer
- full
- lifter plate
- conveying device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a full automatic wafer transport device in a semi-conductor wafer test. The technical scheme provided by the utility model is that a rotary table is arranged on a rotary shaft, a bracket is arranged on the rotary table, a plurality of sliding rails are arranged on a transverse bracket on the bracket, a fetch pliers is connected with the sliding rails in a sliding way, a lifter plate and a lifting driving device are arranged on the lower portion of the fetch pliers, the lifter plate is connected with a guide rod which is fixedly arranged in a sliding way, a detecting rotation shaft is rotatably connected on the lifter plate, a sucker device is arranged on the top end portion of a detecting rotation shaft, and the detecting rotation shaft is connected with the rotating driving device. The utility model has high automation degree, no needing manual operation to fetch wafers and place wafers, and reduces test cost.
Description
Technical field
The utility model relates to and a kind ofly is used at test semiconductor wafer conveying work pieces device especially a kind of full-automatic conveying device for wafer.
Background technology
The ultimate challenge that future, IC test equipment maker faced is how to reduce testing cost.
Improving test speed and testing intellectuality is the necessary ways that reduce the cost.Test machine and the test method that generally adopts is manual test or semi-automatic test at present.Manual test is artificial each wafer of placing, with manual test behind each tube core of optics microscope alignment.Semi-automatic test is for manually being placed on wafer on the test desk, again by optical microscope scanning, hand adjustment wafer angle, first die site etc.Each tube core on the test wafer successively after adjusting.Manually wafer is put back in the film magazine after testing each wafer, got next wafer again and repeat said process.Manual operation has increased the wafer sort time greatly like this, has increased the cost of test.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, a kind of degree of automation height is provided, gets the full-automatic conveying device for wafer that sheet and film releasing need not manual operation, reduce testing cost.
The technical scheme that provides according to the utility model, the rotating disk that on S. A., is provided with, rotating disk is provided with support, laterally set up some one slide rails on support, sliding block joint is got the sheet pincers on slide rail, is provided with lifter plate and lifting drive thereof below getting the sheet pincers, lifter plate and the guide rod sliding block joint that fixedly installs, be rotatably connected to the detection rotating shaft on lifter plate, the top ends that detects rotating shaft is provided with Acetabula device, detects rotating shaft and links to each other with its device of rotation driving.
The Acetabula device upper surface is provided with some negative pressure air drains, is provided with the negative pressure pore that is communicated with the negative pressure air drain in the negative pressure air drain, is provided with the negative pressure gas-tpe fitting in the S. A. bottom, and described negative pressure gas-tpe fitting is communicated with the negative pressure pore.The concentric circles cell body that described negative pressure air drain is offered for the Acetabula device upper surface.Get the sheet pincers and be provided with several at slide rail, they are layered laminate and are arranged in the same perpendicular.
The lower end of getting sheet pincers is fixed with the slide block with the slide rail sliding block joint, side at slide block is provided with the intermediate plate that stretches out, described intermediate plate clamping is provided with the negative pressure joint getting sheet pincers rearward end on rotating band, offer the negative pressure hole that is communicated with the negative pressure joint at the caliper position of getting the sheet pincers.The lifting drive of lifter plate is the screw mandrel that is arranged between rotating disk and the support, respectively establishes a guide rod in the both sides of screw mandrel.
The utility model degree of automation height is got sheet and film releasing need not manual operation, reduces testing cost.
Description of drawings
Fig. 1 is the integrally-built scheme drawing of the utility model.
Fig. 2 is the front view of getting the sheet pincers in the utility model.
Fig. 3 is the back view of getting the sheet pincers in the utility model.
Fig. 4 is the rotating disk in the utility model, the structural representation of detection rotating shaft.
The specific embodiment
The utility model is described in further detail below in conjunction with concrete drawings and Examples.
As shown in the figure: the rotating disk 2 that on S. A. 1, is provided with, rotating disk 2 is provided with support 3, on support 3, laterally set up some one slide rails 4, sliding block joint is got sheet pincers 5 on slide rail 4, be provided with lifter plate 6 and lifting drive thereof below getting sheet pincers 5, lifter plate 6 and guide rod 7 sliding block joints that fixedly install are rotatably connected on lifter plate 6 and detect rotating shaft 8, the top ends that detects rotating shaft 8 is provided with Acetabula device 9, detects rotating shaft 8 and links to each other with its device of rotation driving.
The lower end of getting sheet pincers 5 is fixed with the slide block 13 with slide rail 4 sliding block joints, side at slide block 13 is provided with the intermediate plate 14 that stretches out, described intermediate plate 14 clampings are on rotating band 15, clamp 5 rearward end and be provided with negative pressure joint 16 getting sheet, offer the negative pressure hole 17 that is communicated with negative pressure joint 16 at the caliper position of getting sheet pincers 5.The lifting drive of lifter plate 6 is the screw mandrel 18 that is arranged between rotating disk 2 and the support 3, respectively establishes a guide rod 7 in the both sides of screw mandrel 18.
Referring to shown in Figure 1, get sheet pincers 5 by slide block 13 and slide rail 4 sliding block joints, slide block 13 passes through intermediate plate 14 clampings of its side setting on rotating band 15, and rotating band 15 drive motor link to each other.Getting negative pressure joint 16 and the negative pressure hole 17 at the caliper position of getting sheet pincers 5 offered of sheet pincers 5 by its rear end gets wafer on the sheet pincers 5 from being adsorbed on after film magazine takes off, take off wafer from film magazine and get back to the prealignment device position, prealignment device links to each other with drive motor by detecting rotating shaft 8, detecting rotating shaft 8 is fixed on the lifter plate 6, lifter plate 6 and guide rod 7 are by the slide block sliding block joint, and lifter plate 6 is provided with leading screw 18 and driver train thereof.When wafer during in the prealignment device position, leading screw 18 and driver train thereof drive lifter plate 6, detect rotating shaft 8 rises wafer to be adsorbed on detect to break away from the rotating shaft 8 in conjunction with vacuum control unit and gets sheet pincers 5, drive the wafers rotation and make wafer and get sheet pincers 5 and reach appointed positions in conjunction with getting sheet retractor device 1 again by detecting rotating shaft 8 in conjunction with the optical identification position fixing system, leading screw 18 and driver train thereof drive lifter plate 6, detect rotating shaft 8 and descend and make wafer break away from prealignment in conjunction with vacuum control unit to detect rotating shaft 8 and wafer is adsorbed onto get on the sheet pincers 5 then.Get sheet retractor device 1 and prealignment device and be separately fixed on the rotating disk 2, rotating disk 2 is connected with drive motor by S. A. 1, and rotating disk 2 drives and gets the sheet retractor device, prealignment device horizontally rotates detection platform by getting the sheet position of platform.Drive by telescopic boom 6 again and get sheet arm 4 and wafer is put on the test platform in conjunction with vacuum control unit.
After getting sheet and finishing, get sheet pincers 5 and return to original position and get back to the film magazine position by rotating disk 2 rotations and repeat just now the sheet process of getting.When wafer detects the back that finishes by getting sheet pincers 5 in conjunction with vacuum control unit, on detection platform, wafer is taken away, get sheet pincers 5 simultaneously and got the wafer that sheet gets in conjunction with the vacuum control unit handle and be put on the detection platform.Getting sheet pincers 5 gets back to the film magazine position and repeats the prealignment process by prealignment device in conjunction with the optical identification position fixing system and make wafer and get sheet pincers 5 and reach assigned address.Prealignment is finished, and in conjunction with vacuum control unit wafer is put back to the film magazine original place by getting sheet pincers 5, gets sheet pincers 5 another wafer of taking off film magazine simultaneously and repeats just now process, has realized the full automatic transmission course of getting sheet and film releasing to wafer.In the process of getting sheet and film releasing, need in conjunction with vacuum control unit still relieving of wafer absorption.
Claims (6)
1. full-automatic conveying device for wafer, comprise the rotating disk (2) that is arranged on the S. A. (1), rotating disk (2) is provided with support (3), it is characterized in that: on support (3), laterally set up some one slide rails (4), go up sliding block joint at slide rail (4) and get sheet pincers (5), below getting sheet pincers (5), be provided with lifter plate (6) and lifting drive thereof, lifter plate (6) and guide rod (7) sliding block joint that fixedly installs, on lifter plate (6), be rotatably connected to and detect rotating shaft (8), the top ends that detects rotating shaft (8) is provided with Acetabula device (9), detects rotating shaft (8) and links to each other with its device of rotation driving.
2. full-automatic conveying device for wafer as claimed in claim 1, it is characterized in that: Acetabula device (9) upper surface is provided with some negative pressure air drains (10), in negative pressure air drain (10), be provided with the negative pressure pore (11) that is communicated with negative pressure air drain (10), be provided with negative pressure gas-tpe fitting (12) in S. A. (1) bottom, described negative pressure gas-tpe fitting (12) is communicated with negative pressure pore (11).
3. full-automatic conveying device for wafer as claimed in claim 2 is characterized in that: the concentric circles cell body that described negative pressure air drain (10) is offered for Acetabula device (9) upper surface.
4. full-automatic conveying device for wafer as claimed in claim 1 is characterized in that: get sheet pincers (5) and be provided with several at slide rail (4), they are layered laminate and are arranged in the same perpendicular.
5. full-automatic conveying device for wafer as claimed in claim 4, it is characterized in that: the lower end of getting sheet pincers (5) is fixed with the slide block (13) with slide rail (4) sliding block joint, side at slide block (13) is provided with the intermediate plate (14) that stretches out, described intermediate plate (14) clamping is on rotating band (15), be provided with negative pressure joint (16) getting sheet pincers (5) rearward end, offer the negative pressure hole (17) that is communicated with negative pressure joint (16) at the caliper position of getting sheet pincers (5).
6. full-automatic conveying device for wafer as claimed in claim 1 is characterized in that: the lifting drive of lifter plate (6) is respectively established a guide rod (7) for being arranged on the screw mandrel (18) between rotating disk (2) and the support (3) in the both sides of screw mandrel (18).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820035161 CN201195639Y (en) | 2008-04-14 | 2008-04-14 | Full-automatic transmission apparatus for wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820035161 CN201195639Y (en) | 2008-04-14 | 2008-04-14 | Full-automatic transmission apparatus for wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201195639Y true CN201195639Y (en) | 2009-02-18 |
Family
ID=40415276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200820035161 Expired - Lifetime CN201195639Y (en) | 2008-04-14 | 2008-04-14 | Full-automatic transmission apparatus for wafer |
Country Status (1)
Country | Link |
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CN (1) | CN201195639Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101259921B (en) * | 2008-04-14 | 2011-03-16 | 无锡市易控系统工程有限公司 | Full-automatic conveying device for wafer |
CN102976123A (en) * | 2012-11-28 | 2013-03-20 | 天津市环欧半导体材料技术有限公司 | Feeding mechanism of chamfering device |
-
2008
- 2008-04-14 CN CN 200820035161 patent/CN201195639Y/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101259921B (en) * | 2008-04-14 | 2011-03-16 | 无锡市易控系统工程有限公司 | Full-automatic conveying device for wafer |
CN102976123A (en) * | 2012-11-28 | 2013-03-20 | 天津市环欧半导体材料技术有限公司 | Feeding mechanism of chamfering device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20090218 Effective date of abandoning: 20080414 |