CN201188690Y - 电容麦克风 - Google Patents
电容麦克风 Download PDFInfo
- Publication number
- CN201188690Y CN201188690Y CNU2008200091814U CN200820009181U CN201188690Y CN 201188690 Y CN201188690 Y CN 201188690Y CN U2008200091814 U CNU2008200091814 U CN U2008200091814U CN 200820009181 U CN200820009181 U CN 200820009181U CN 201188690 Y CN201188690 Y CN 201188690Y
- Authority
- CN
- China
- Prior art keywords
- capacitance microphone
- mentioned
- microphone according
- layer
- capacitance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/01—Electrostatic transducers characterised by the use of electrets
- H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070048038A KR100908452B1 (ko) | 2007-05-17 | 2007-05-17 | 콘덴서 마이크로폰 |
KR1020070048038 | 2007-05-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201188690Y true CN201188690Y (zh) | 2009-01-28 |
Family
ID=40287639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2008200091814U Expired - Fee Related CN201188690Y (zh) | 2007-05-17 | 2008-04-18 | 电容麦克风 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100908452B1 (ko) |
CN (1) | CN201188690Y (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105357616A (zh) * | 2014-07-21 | 2016-02-24 | 美律电子(深圳)有限公司 | 具有立体基板的微机电麦克风封装结构 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101039256B1 (ko) * | 2010-01-18 | 2011-06-07 | 주식회사 비에스이 | 부가 챔버를 사용한 멤스 마이크로폰 패키지 |
KR20120054244A (ko) * | 2010-11-19 | 2012-05-30 | 주식회사 비에스이 | 마이크로폰 |
CN106060688A (zh) * | 2016-07-01 | 2016-10-26 | 合肥天馈信息技术有限公司 | 一种多功能麦克风 |
CN109547907B (zh) * | 2019-01-23 | 2024-01-05 | 东莞泉声电子有限公司 | 驻极体电容传声器及其制作方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3829115B2 (ja) * | 2002-12-16 | 2006-10-04 | 佳樂電子股▲分▼有限公司 | コンデンサーマイクロホン及びその製造方法 |
KR100675023B1 (ko) * | 2005-09-14 | 2007-01-30 | 주식회사 비에스이 | 콘덴서 마이크로폰 및 이를 위한 패키징 방법 |
-
2007
- 2007-05-17 KR KR1020070048038A patent/KR100908452B1/ko not_active IP Right Cessation
-
2008
- 2008-04-18 CN CNU2008200091814U patent/CN201188690Y/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105357616A (zh) * | 2014-07-21 | 2016-02-24 | 美律电子(深圳)有限公司 | 具有立体基板的微机电麦克风封装结构 |
CN105357616B (zh) * | 2014-07-21 | 2020-03-17 | 美律电子(深圳)有限公司 | 具有立体基板的微机电麦克风封装结构 |
Also Published As
Publication number | Publication date |
---|---|
KR20080101374A (ko) | 2008-11-21 |
KR100908452B1 (ko) | 2009-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9002040B2 (en) | Packages and methods for packaging MEMS microphone devices | |
US8625832B2 (en) | Packages and methods for packaging microphone devices | |
EP1992588B1 (en) | Packaging of MEMS microphone | |
EP2352311B1 (en) | Microphone | |
US9485560B2 (en) | Embedded circuit in a MEMS device | |
US8041064B2 (en) | Card type MEMS microphone | |
CN1917720B (zh) | 硅基电容传声器 | |
JP4779002B2 (ja) | Pcbに音孔が形成されたmemsマイクロホンパッケージ | |
JP2007150507A (ja) | マイクロホンパッケージ | |
CN201188690Y (zh) | 电容麦克风 | |
US9120668B2 (en) | Microphone package and mounting structure thereof | |
CN104080033A (zh) | 麦克风 | |
CN109845294B (zh) | 压力传感器,特别是具有改进布局的麦克风 | |
JP2010183312A (ja) | マイクロホンユニット | |
US20150146888A1 (en) | Mems microphone package and method of manufacturing the same | |
JP2011114506A (ja) | マイクロホンユニット | |
CN201188689Y (zh) | 电容麦克风 | |
JP2015532548A (ja) | Memsデバイス内の組込回路 | |
JP2007174635A (ja) | マイクロホンパッケージの製造方法及びマイクロホンパッケージ | |
CN210112277U (zh) | 硅麦克风封装结构 | |
WO2016153871A1 (en) | Embedded circuit in a mems device | |
WO2007024048A1 (en) | Silicon based condenser microphone | |
CN110526199B (zh) | 硅麦克风封装结构及其封装方法 | |
CN111050259A (zh) | 麦克风封装结构以及电子设备 | |
TW201332378A (zh) | 駐極體電容麥克風 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090128 Termination date: 20140418 |