CN201141877Y - Low-impedance spring connecting wire - Google Patents
Low-impedance spring connecting wire Download PDFInfo
- Publication number
- CN201141877Y CN201141877Y CNU2008200027108U CN200820002710U CN201141877Y CN 201141877 Y CN201141877 Y CN 201141877Y CN U2008200027108 U CNU2008200027108 U CN U2008200027108U CN 200820002710 U CN200820002710 U CN 200820002710U CN 201141877 Y CN201141877 Y CN 201141877Y
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- Prior art keywords
- spring
- circuit board
- test
- connecting wire
- impedance
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Abstract
Disclosed is a low impedance spring connecting wire used in circuit board testing equipment. The low impedance spring connecting wire can effectively solve the problem that the impedance becomes high when the testing current passes through the spring thread during the testing of circuit board. The low impedance spring connecting wire includes a spring and a conducting wire. One end of the conducting wire penetrates in the spring and is connected with the upper end of the spring; meanwhile, the end of the conducting wire can plug up the upper end of the spring, forming a test probe holder. When test, the probe card of the testing equipment extrudes the circuit board, making the upper end of the test probe contact the test point of the circuit board, and at the same time, the lower end of the probe moves down and directly contacts the conducting wire for a elastic conduction. The low impedance spring connecting wire can effectively reduce the impedance when current is conducted and increase the test stability.
Description
Affiliated technical field:
The utility model relates to a kind of circuit board detection equipment, especially circuit board testing jig.
Background technology:
Employed spring line feature is in the circuit board testing jig at present: the spring upper end is the test probe base body of spring wire one coiled, and electronic wire is welded in the spring lower end.Test probe can place probe card up and downly, be in circuit board tested point below, the movable contact shoe spring of test probe upper end, when circuit board testing, probe card in the measurement jig is mutually to circuit board is pushed up and down, make test probe upper end in the probe card when touching circuit board test point, the lower end of test probe moves down the spring upper end base body that touches in the spring line, measuring current will flow to electronic wire by the test machine winding displacement, to spring, realize conductive test by the electronic wire turn of tidal stream thereby after walking around spring, flow to test probe again.The effect of spring is that moving down of test probe played buffer action, avoids test probe to stab circuit board.But present this spring line is when the circuit board testing electrical property, because measuring current is when electronic wire flows to test probe, to after walking around spring wire, flow to test probe again, because meticulous (the 0.08-0.15 millimeter) of spring wire, longly cause the current lead-through impedance excessive, so almost can't test the circuit board of high-accuracy requirement, when the ifs circuit plate is wanted the measurement circuit impedance, can only on spring, add the thick Gold plated Layer of Plating several times, test reluctantly, but because the material of spring uses the qin steel wire in surface gold-plating, after so the spring line is surveyed time back (being that test probe is to several ten thousand grazings of spring) through several ten thousand, the gold-plated wears gradually in test probe holder mouth place of spring upper end, remaining electric conductor just is the qin steel wire, but the electric conductivity of qin steel wire is relatively poor relatively, so tool just becomes extremely unstable after inferior through several ten thousand surveys, the vacation survey often occurs, directly have influence on tested productivity and test quality, increase testing cost.
Summary of the invention:
For the existing deficiency of the performance that overcomes above-mentioned spring line, the utility model provides a kind of Low ESR spring line, this Low ESR spring line not only when circuit board testing, can effectively reduce current impedance and improve stable testing, and more convenient when weld job.
The technical scheme that its technical matters that solves the utility model adopts is:
The connected mode of this Low ESR spring line adopts: a termination of electronic wire is pierced between spring, be arranged in the spring top, the spring upper port can be blocked in the electronic wire termination simultaneously, form the probe base body, can make test probe when moving down, the contact of lower end can directly touch electronic wire, forms conducting.And spring can play buffer action equally when probe moves down.
The beneficial effects of the utility model are:
Because Low ESR spring line is in when test, test probe can directly touch electronic wire and realize conducting, and can effectively avoid the measuring current will be through walking around the too high problem of impedance that spring wire brings, thereby realizes reducing the conduction impedance.Because touching of test probe lower end a little is the special good electronic wire copper wire entity of electric conductivity, so no matter wear and tear through the how many times grazing of test probe, can not reduce its stability.And the utility model simple, reliable operation rational in infrastructure.
Below in conjunction with drawings and Examples the utility model is further specified.
Description of drawings:
Fig. 1 is a structural drawing of the present utility model.
Fig. 2 is first kind of combination exemplifying embodiment sectional view of Low ESR spring line.
Fig. 3 is second kind of combination exemplifying embodiment sectional view of Low ESR spring line.
Indicate among the figure: 1-spring, 2-electronic wire, 3-metallic object,
Embodiment:
In combination embodiment shown in Figure 2:
The connected mode of Low ESR spring line is: the termination of electronic wire (2) is pierced between spring (1), be welded in spring (1) upper end, be combined as the Low ESR spring line of elastic conduction.
In combination embodiment shown in Figure 3:
The connected mode of Low ESR spring line is: adopt in an internal diameter and the spring (1) through corresponding, and better conductivity metallic object (3) is put spring (1) upper end into, use the termination of electronic wire (2) to pierce between spring (1) again, be next to metallic object (3) lower end and weld, be combined as the Low ESR spring line of elastic conduction.This example is applicable to: when spring inside diameter goes out certain limit greatly than electronic wire external diameter.
Claims (1)
- A kind of Low ESR spring line, be equipped with in circuit board detection equipment, this Low ESR spring line comprises: spring and electronic wire, spring and electronic wire connect as one and are combined as an elastic electric conductor, it is characterized in that: electronic wire one end pierces between spring, is arranged in the spring upper end.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008200027108U CN201141877Y (en) | 2008-01-08 | 2008-01-08 | Low-impedance spring connecting wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008200027108U CN201141877Y (en) | 2008-01-08 | 2008-01-08 | Low-impedance spring connecting wire |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201141877Y true CN201141877Y (en) | 2008-10-29 |
Family
ID=40069588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2008200027108U Expired - Fee Related CN201141877Y (en) | 2008-01-08 | 2008-01-08 | Low-impedance spring connecting wire |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201141877Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103439542A (en) * | 2013-08-30 | 2013-12-11 | 渭南高新区木王科技有限公司 | Spring connection wire for PCB special testing machine |
-
2008
- 2008-01-08 CN CNU2008200027108U patent/CN201141877Y/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103439542A (en) * | 2013-08-30 | 2013-12-11 | 渭南高新区木王科技有限公司 | Spring connection wire for PCB special testing machine |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081029 |