CN103439542A - Spring connection wire for PCB special testing machine - Google Patents
Spring connection wire for PCB special testing machine Download PDFInfo
- Publication number
- CN103439542A CN103439542A CN2013103855134A CN201310385513A CN103439542A CN 103439542 A CN103439542 A CN 103439542A CN 2013103855134 A CN2013103855134 A CN 2013103855134A CN 201310385513 A CN201310385513 A CN 201310385513A CN 103439542 A CN103439542 A CN 103439542A
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- China
- Prior art keywords
- spring
- connection wire
- testing machine
- pcb
- spring connection
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Abstract
The invention discloses a spring connection wire for a PCB special testing machine. The spring connection wire for the PCB special testing machine comprises a testing probe supporting body winded integrally by spring mill rolls arranged in the middle and at the two ends of the spring and electronic wires connected with the spring. The spring connection wire for the PCB special testing machine is characterized in that the diameter Phi of the spring is within the range from 0.13 to 0.45, and elastic force of the spring is 5g to 20g. According to the spring connection wire for the PCB special testing machine, the spring size enables the separation distance between every two testing points to be within the range from 0.20mm to 0.22mm, the testing points are relatively concentrated, density is high, cost is low, and the spring connection wire for the PCB special testing machine can be applied to 80 % of density boards (testing fixtures needed by smart cell phones, laptop computers and the like) in the current market.
Description
Technical field
The present invention relates to the PCB testing apparatus, more particularly, relate to a kind of PCB test special machine spring connecting wire that comprises spring and electronic wire.
Background technology
At present, the spring connecting wire that PCB test machine is used comprises the test probe base body be coiled into through the spring wire one, and electronic wire is welded in the spring lower end.Test probe can be placed in probe card up and downly, in PCB tested point below, the test probe movable contact is in the spring upper end, when PCB tests, probe card in upper and lower measurement jig is mutually to PCB is pushed, make test probe upper end in probe card when touching circuit board test point, the lower end of test probe moves down the spring upper end base body touched in spring connecting wire, measuring current will flow to electronic wire by the test machine winding displacement, to spring, thereby flow to again test probe after walking around spring, realize conductive test by the electronic wire turn of tidal stream.The effect of spring is that moving down of test probe played to buffer action, avoids test probe to stab PCB.
Traditional spring connecting wire is of a size of 0.45mm in the current minimum of spring section, that is to say, the conventional art maximum can solve the test point spacing at 0.6mm, and test point can not be too concentrated.Conventional art can not solve at present can only mobile phone, the highdensity hardboard test of handheld PC lamp.
Summary of the invention
The object of the present invention is to provide a kind of with low cost, the closely spaced PCB of test point test special machine spring connecting wire.
To achieve these goals, the technical solution adopted in the present invention is as described below: a kind of PCB test special machine spring connecting wire, comprise the close volume one of the spring be provided with two ends by the spring stage casing test probe base body be coiled into and the electronic wire be connected with spring, it is characterized in that: the diameter of phi of described spring is 0.45>Φ >=0.13, and elastic force is 5g～20g.
According to above-mentioned the present invention, its beneficial effect is, spring size of the present invention can make the test point spacing at 0.22mm～0.20mm, and test point can be relatively concentrated, density is high, and with low cost, can be for 80% density board (the required test fixtures such as smart mobile phone, Hand Personal Computer) on the market at present.
The accompanying drawing explanation
Below in conjunction with accompanying drawing and embodiment, the present invention is conducted further description:
Fig. 1 is structural drawing of the present invention.
Embodiment
As described in Figure 1, a kind of PCB test special machine spring connecting wire, comprise the spring be provided with two ends by spring stage casing 2 close volume 1,3 one the test probe base body be coiled into and the electronic wire 4 be connected with spring, the diameter of phi of described spring is 0.45>Φ >=0.13, and elastic force is 5g～20g.
Embodiment mono-
A kind of PCB test special machine spring connecting wire, comprise the spring be provided with two ends by spring stage casing 2 close volume 1,3 one the test probe base body be coiled into and the electronic wire 4 be connected with spring, and the diameter of phi of described spring is 0.44mm, and elastic force is 20g.
It is 0.22mm that this spring size and elastic force can make the test point spacing.
Embodiment bis-
A kind of PCB test special machine spring connecting wire, comprise the spring be provided with two ends by spring stage casing 2 close volume 1,3 one the test probe base body be coiled into and the electronic wire 4 be connected with spring, and the diameter of phi of described spring is 0.32mm, and the elastic force of this spring is 15g.
This spring size and elastic force can make the test point spacing at 0.21mm.
Embodiment tri-
A kind of PCB test special machine spring connecting wire, comprise the spring be provided with two ends by spring stage casing 2 close volume 1,3 one the test probe base body be coiled into and the electronic wire 4 be connected with spring, and the diameter of phi of described spring is 0.13mm, and the elastic force of this spring is 5g.
This spring size and elastic force can make the test point spacing at 0.20mm.
Although the present invention describes with reference to the above embodiments; but those of ordinary skill in the art can very clearly recognize that above embodiment is only for the present invention is described fully; wherein can make various changes and revise and not break away from a broad sense the present invention; so not as limitation of the invention; as long as in connotation scope of the present invention, within all falling into to variation, the distortion of above-described embodiment the protection domain that the present invention requires.
Claims (1)
1. a PCB tests the special machine spring connecting wire, comprise the close volume one of the spring be provided with two ends by the spring stage casing test probe base body be coiled into and the electronic wire be connected with spring, it is characterized in that: the diameter of phi of described spring is 0.45>Φ >=0.13, and elastic force is 5g～20g.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103855134A CN103439542A (en) | 2013-08-30 | 2013-08-30 | Spring connection wire for PCB special testing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103855134A CN103439542A (en) | 2013-08-30 | 2013-08-30 | Spring connection wire for PCB special testing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103439542A true CN103439542A (en) | 2013-12-11 |
Family
ID=49693247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103855134A Pending CN103439542A (en) | 2013-08-30 | 2013-08-30 | Spring connection wire for PCB special testing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103439542A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106771409A (en) * | 2017-02-16 | 2017-05-31 | 苏州微缜电子科技有限公司 | A kind of high-frequency test socket |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2685883Y (en) * | 2004-02-10 | 2005-03-16 | 王云阶 | Speical spring for electronic and testing industry detecting apparatus |
| CN201141877Y (en) * | 2008-01-08 | 2008-10-29 | 黄琼彪 | Low-impedance spring connecting wire |
| WO2011162362A1 (en) * | 2010-06-25 | 2011-12-29 | 日本発條株式会社 | Contact probe and probe unit |
| CN102466740A (en) * | 2010-11-12 | 2012-05-23 | 金英杰 | Kelvin test probe of semi-conductor |
| CN203101441U (en) * | 2013-02-21 | 2013-07-31 | 东莞市连威电子有限公司 | Low-resistance test probe |
| CN203101440U (en) * | 2013-02-21 | 2013-07-31 | 东莞市连威电子有限公司 | Special spring for low resistance test |
-
2013
- 2013-08-30 CN CN2013103855134A patent/CN103439542A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2685883Y (en) * | 2004-02-10 | 2005-03-16 | 王云阶 | Speical spring for electronic and testing industry detecting apparatus |
| CN201141877Y (en) * | 2008-01-08 | 2008-10-29 | 黄琼彪 | Low-impedance spring connecting wire |
| WO2011162362A1 (en) * | 2010-06-25 | 2011-12-29 | 日本発條株式会社 | Contact probe and probe unit |
| CN102466740A (en) * | 2010-11-12 | 2012-05-23 | 金英杰 | Kelvin test probe of semi-conductor |
| CN203101441U (en) * | 2013-02-21 | 2013-07-31 | 东莞市连威电子有限公司 | Low-resistance test probe |
| CN203101440U (en) * | 2013-02-21 | 2013-07-31 | 东莞市连威电子有限公司 | Special spring for low resistance test |
Non-Patent Citations (1)
| Title |
|---|
| 田民波等: "《高密度封装基板》", 30 September 2003, 清华大学出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106771409A (en) * | 2017-02-16 | 2017-05-31 | 苏州微缜电子科技有限公司 | A kind of high-frequency test socket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20131211 |
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| RJ01 | Rejection of invention patent application after publication |