CN201117649Y - Controller driver circuit radiation structure - Google Patents

Controller driver circuit radiation structure Download PDF

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Publication number
CN201117649Y
CN201117649Y CNU2007201928499U CN200720192849U CN201117649Y CN 201117649 Y CN201117649 Y CN 201117649Y CN U2007201928499 U CNU2007201928499 U CN U2007201928499U CN 200720192849 U CN200720192849 U CN 200720192849U CN 201117649 Y CN201117649 Y CN 201117649Y
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CN
China
Prior art keywords
high power
radiator
power valve
heat
aluminum base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2007201928499U
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Chinese (zh)
Inventor
施世伟
张佐泉
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Individual
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Individual
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Priority to CNU2007201928499U priority Critical patent/CN201117649Y/en
Application granted granted Critical
Publication of CN201117649Y publication Critical patent/CN201117649Y/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a heat removal structure of a controller driving circuit, including a high power valve, an aluminum base and a radiator. An insulated heat-conducting layer is arranged between the welded surface of the aluminum base and a heat removal layer. The side wall of the high power valve adheres to the welded surface of the aluminum base directly. The heat removal layer of the aluminum base is tightly connected with the radiator. The side wall of the high power valve is welded on the welded surface of the aluminum base directly. The aluminum base is provided with a fixing hole arranged on the insulated heat-conducting layer. The aluminum base and the radiator are fixed together directly by bolts through the fixing hole. The heat removal structure of the controller driving circuit of the utility model can eliminate heat in time, which ensures that the circuit can work under a proper temperature. The structure is simpler and compacter and the space taken up on the upper layer of a mainboard is less. The whole connection of the high power valve is stable and the manufacture and the installation are more convenient.

Description

The radiator structure of controller drives circuit
Technical field
The utility model relates to the controller drives circuit, relates in particular to a kind of radiator structure of controller drives circuit.
Background technology
Various automatically controlled circuit boards as the electric motor car automatically controlled circuit board, are equipped with some high power valves above usually, and as shown in Figure 1, existing high power valve 1 all is that the pin 11 by pipe itself is connected on the mainboard 6 of automatically controlled circuit board.Wherein mainboard 6 generally is to be the common line plate of material with epoxy resin.Owing to can distribute a large amount of heats in the high power valve work, as heat in time not being eliminated, high power valve is easy to damage.Therefore, in order in time heat to be eliminated, the sidewall of high power valve 1 is fixed on the radiator 3 with screw 5 usually.As shown in Figure 2, directly contact with radiator 3 or cause short circuit by screw 5 contact with respect to high power valve 1, must add insulating heat-conductive layer 1 at radiator 3 and 1 of high power valve, the while puts an insulating particle 12 on the circular hole on high power valve 1 top.There is more weak point in this structure, be connected trouble between radiator and high power valve, need to take sheaf space on the bigger mainboard plate face in installation process, syndeton is relatively complicated, add-on parts too much also influences the efficient of heat radiation, and the high power valve radiating effect is undesirable.When jagged on the radiator 3 or will damage insulating barrier when in installation process, sandwiching metal fillings or scolding tin, cause short circuit.Need to detect, dismantle radiator 3 so again,, quite bother to fix a breakdown.Screw is manual tightening, and can cause degree of tightness to differ unavoidably, can cause the temperature dispersion inequality like this in the process of heat radiation, does not reach desirable radiating effect, causes burning of high power valve easily.
Summary of the invention
Technical problem to be solved in the utility model just provides a kind of radiator structure of controller drives circuit, its good heat dissipation effect, and heat radiation is evenly, simple and compact for structure, be convenient to install, and it is few to take the space on mainboard plate face upper strata, is specially adapted to the heat radiation of big current work.
In order to solve the problems of the technologies described above, the utility model adopts following technical scheme: the radiator structure of controller drives circuit, comprise high power valve, aluminium base and radiator, it is characterized in that: be provided with insulating heat-conductive layer two between the solder side of described aluminium base and the heat dissipating layer, the high power valve side wall surface directly is mounted on the solder side of aluminium base, and the heat dissipating layer of aluminium base closely links to each other with radiator.
Preferably, described high power valve sidewall directly is welded on the solder side of aluminium base, connects more stablely, and radiating effect is better.
Preferably, described aluminium base is provided with fixing hole, and fixed hole position is on insulating radiation layer two, and screw directly is fixed together aluminium base and radiator by fixing hole.Such connected mode is simple and practical, is convenient to install, and has avoided the scolding tin in the welding process or the burr of radiator to damage insulating barrier two, and this installation method has thoroughly solved the Insulation Problems of high power valve.
The utility model is owing to adopt technique scheme, the high power valve side wall surface directly is mounted on the solder side of aluminium base, and the heat dissipating layer of aluminium base closely links to each other with radiator, and the heat that makes high power valve distribute directly is delivered on the radiator by aluminium base,, make heat in time to shed.The assurance circuit is worked under suitable temperature.This structure is compared with prior radiating structure, because high power valve is attached on the aluminium base, its structure is more simply compact, and the space that takies mainboard plate face upper strata is few, and the whole connection of high power valve is stable, making and easier for installation, perfect heat-dissipating.
Description of drawings
The utility model is described in further detail below in conjunction with accompanying drawing:
Fig. 1 is the radiator structure schematic diagram of existing controller drive circuit.
Fig. 2 is the heat radiation knot standing part structural representation of existing controller drive circuit.
Fig. 3 is the radiator structure schematic diagram of the utility model controller drives circuit.
Fig. 4 is the radiator structure sectional perspective schematic diagram of the utility model controller drives circuit.
Fig. 5 is the local enlarged diagram at the radiator structure A place of Fig. 4 controller drives circuit.
Embodiment
As Fig. 3 Fig. 4 and shown in Figure 5, the radiator structure of the utility model controller drives circuit comprises high power valve 1, aluminium base 2 and radiator 3, is provided with insulating heat-conductive layer 2 22 between the solder side 21 of described aluminium base 2 and the heat dissipating layer 23, for guaranteeing radiating effect, insulating heat-conductive layer 2 22 is extremely thin.High power valve 1 sidewall directly is mounted on aluminium base 2 solders side 21.Adopt ripe welding procedure, guaranteed the quality of welding.The heat dissipating layer 23 of aluminium base 2 closely links to each other by screw 5 with radiator 3 again.At this moment, the solder side 21 of aluminium base 2 part in the course of processing erodes, and the fixing hole 24 that is used to be provided with screw 5 just is arranged on exposed insulating heat-conductive layer 2 22, causes short circuit to avoid solder side 21 to contact with heat dissipating layer 23.Such structure is installed very convenient.Improved the efficient of producing greatly.
During work, because on the solder side 21 of the direct welding of aluminum substrate 2 of described high power valve 1 side wall surface.The heat that high power valve 1 distributes directly is transmitted on the radiator 3 by aluminium base 2, and between the solder side 21 of aluminium base 2 and the heat dissipating layer 23 only every the extremely thin insulating heat-conductive layer 2 22 of one deck.Aluminium base 2 is fixing by fixing hole 24 usefulness screws 5 and radiator 3, and on heat dissipating layer 23 held against heat sink 3, heat can shed immediately.Such structure can guarantee working of entire circuit under normal temperature, and can be owing to high power valve 1 heating, the too high situation that causes pipe itself to damage of temperature, and heat radiation simultaneously is very evenly, fast.
The radiator structure of controller drives circuit of the present utility model not only is confined to use on the electric motor car automatically controlled circuit board.

Claims (3)

1, the radiator structure of controller drives circuit, comprise high power valve (1), aluminium base (2) and radiator (3), it is characterized in that: be provided with insulating heat-conductive layer two (22) between the solder side (21) of described aluminium base (2) and the heat dissipating layer (23), high power valve (1) side wall surface directly is mounted on the solder side (21) of aluminium base (2), and the heat dissipating layer (23) of aluminium base (2) closely links to each other with radiator (3).
2, according to the radiator structure of the described controller drives circuit of claim 1, it is characterized in that: described high power valve (1) directly is welded on the solder side (21) of aluminium base (2).
3, according to the radiator structure of claim 1 or 2 described controller drives circuit, it is characterized in that: described aluminium base (2) is provided with fixing hole (24), and screw (5) is fixed together aluminium base (2) and radiator (3) by fixing hole (24).
CNU2007201928499U 2007-11-28 2007-11-28 Controller driver circuit radiation structure Expired - Fee Related CN201117649Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007201928499U CN201117649Y (en) 2007-11-28 2007-11-28 Controller driver circuit radiation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007201928499U CN201117649Y (en) 2007-11-28 2007-11-28 Controller driver circuit radiation structure

Publications (1)

Publication Number Publication Date
CN201117649Y true CN201117649Y (en) 2008-09-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007201928499U Expired - Fee Related CN201117649Y (en) 2007-11-28 2007-11-28 Controller driver circuit radiation structure

Country Status (1)

Country Link
CN (1) CN201117649Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102159056A (en) * 2010-12-31 2011-08-17 航天时代电子技术股份有限公司 High-power DC solid-state power controller with integrated radiation structure
CN102186277A (en) * 2011-03-10 2011-09-14 国网电力科学研究院武汉南瑞有限责任公司 Photovoltaic street light controller

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102159056A (en) * 2010-12-31 2011-08-17 航天时代电子技术股份有限公司 High-power DC solid-state power controller with integrated radiation structure
CN102159056B (en) * 2010-12-31 2013-01-30 航天时代电子技术股份有限公司 High-power DC solid-state power controller with integrated radiation structure
CN102186277A (en) * 2011-03-10 2011-09-14 国网电力科学研究院武汉南瑞有限责任公司 Photovoltaic street light controller

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GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080917

Termination date: 20111128