CN200981893Y - Substrate treating device - Google Patents
Substrate treating device Download PDFInfo
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- CN200981893Y CN200981893Y CN 200620017972 CN200620017972U CN200981893Y CN 200981893 Y CN200981893 Y CN 200981893Y CN 200620017972 CN200620017972 CN 200620017972 CN 200620017972 U CN200620017972 U CN 200620017972U CN 200981893 Y CN200981893 Y CN 200981893Y
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- Prior art keywords
- substrate
- processing device
- treater
- substrate processing
- described substrate
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Abstract
The utility model relates to a substrate process apparatus, comprising a substrate process room, a substrate support for supporting the substrate in the substrate process room, a substrate processor for processing the substrate held by the substrate support, wherein the substrate process apparatus further comprises a processor drive mechanism for actuating the substrate processor. With the application of the conformation, the still substrates could be processed by the substrate processor in the method of mobile scan, shorting the length of the substrate process room, saving the manufacture cost, improving the processing effect of the substrate in the method of mobile scan, thereby leading to simple and practical conformation and perfect controllability.
Description
[technical field]
The utility model relates to a kind of substrate processing device, and particularly a kind of treater is substrate processing device movably.
[background technology]
At present, vacuum coating technology is used widely.Along with the development of plated film industry, the diversity of product and the high quality of product require to increase, load negative bias etc. on magnetron sputtering plating, especially non-balance magnetically controlled sputter and ion plating and the substrate and can realize that the film coating method of certain assistant depositing function has been subjected to the extensive concern of industry and popularizes.But above-mentioned film coating method all is depositional coating limit, limit to be bombarded substrate, can not effectively handle substrate, may cause coating effects not ideal enough.And if the energy of bombardment can cause well damage to influence the quality of product to rete too by force.So substrate treaters such as the ion source of Chu Xianing, glow discharge are developed and use subsequently.These treaters can carry out pre-treatment and aftertreatment to substrate coating, effects of pretreatment is to make better smooth of substrate surface, and can activating surface, make that the sticking power of follow-up coating process film improves, rete compactness is improved, membrane uniformity is better; Aftertreatment mainly is to make the sedimentary rete of institute more smooth, and homogeneity is better.
At present, above the substrate mentioned to handle all be that treatment unit is fixed, realize by mobile substrate or little substrate fixed mode.Because the increase of large area substrates application now, the fixed treatment unit can only effectively be handled the small area substrate.If large-area substrate is carried out pre-treatment or aftertreatment just need realize by the mode that substrate moves.This mode is widely used on linear large-area coating film production line, but short and small owing to casing for the production line of " star " type structure, thereby adopts substrate immobilized plated film mode, thereby traditional fixed substrate processing device can't satisfy the demand of production.
[utility model content]
Be unsuitable for technical problem that the immobilized large area substrates is handled in order to solve existing fixed substrate processing device.The utility model proposes a kind of portable substrate processing device, so that static substrate is handled.
The technical scheme that technical problem adopted that the existing fixed substrate processing device of the utility model solution can't be handled static substrate is: a kind of substrate processing device is provided, this substrate processing device comprises: the substrate treatment chamber, be used for the substrate support bracket of support substrate in the substrate treatment chamber, to the substrate treater that the substrate of substrate support bracket institute support is handled, this substrate processing device further comprises the treater transmission mechanism that is used for transmission substrate treater.
According to the utility model one preferred embodiment, the treater transmission mechanism comprises: be used to support and guide rail, the drive-motor of the substrate treater that leads and be used to connect the rotating shaft of drive-motor and the transmission rig of substrate treater.
According to the utility model one preferred embodiment, transmission rig is a ball-screw.
According to the utility model one preferred embodiment, the substrate treatment chamber further is provided for the travel position of substrate treater is carried out the induced stop means.
According to the utility model one preferred embodiment, the treater transmission mechanism further comprises the motor control assembly that the induced signal that responds stop means is powered for drive-motor in a suitable manner.
According to the utility model one preferred embodiment, drive-motor is arranged on substrate treatment chamber outside, and the magnetic fluid dynamic sealing device that rotating shaft or transmission rig to drive-motor carry out magnetic current sealing further is set on the sidewall of substrate treatment chamber.
According to the utility model one preferred embodiment, substrate processing device further comprises the flexible cable that can move with the substrate treater.
According to the utility model one preferred embodiment, substrate processing device further comprises the flexible cooling tube that can move with the substrate treater.
According to the utility model one preferred embodiment, substrate processing device further comprises the flexible cloth tracheae that can move with the substrate treater.
According to the utility model one preferred embodiment, the substrate treater is ion source or glow discharge treater.
By adopting said structure, make the substrate treater to handle the immobilized substrate in the mode of motion scan, the length of substrate treatment chamber is reduced, save manufacturing cost, and improved the treatment effect of substrate by the shuttle-scanning mode, simple and practical, controllability is strong.
[description of drawings]
Fig. 1 is the synoptic diagram that substrate processing device of the present utility model is communicated with star-like production line;
Fig. 2 is the front view of substrate processing device of the present utility model;
Fig. 3 is the sectional view along the utility model substrate processing device of the A-A line among Fig. 2;
Fig. 4 is a substrate processing device perspective view of the present utility model.
[embodiment]
Below in conjunction with drawings and Examples the utility model is elaborated.
As Fig. 1-shown in Figure 4, mainly comprise in the substrate processing device 1 of the present utility model: substrate treatment chamber 11, be used for the substrate support bracket 3 of 11 support substrates 2 in the substrate treatment chamber, substrate treater 12 that the substrate 2 of substrate support bracket institute support is handled (for example, ion source or glow discharge treater), be used for the treater transmission mechanism of transmission substrate treater 12.In one embodiment, the treater transmission mechanism comprises: be used to support and guide rail 13, the drive-motor 14 of the substrate treater that leads and be used to connect the rotating shaft of drive-motor 14 and the transmission rig 15 of substrate treater 12.Wherein, transmission rig 15 can adopt any transmission rigs that rotating shaft can be changed into translation such as ball-screw.In addition, further be provided for the travel position of substrate treater 12 is carried out induced stop means 16 at substrate treatment chamber 11.The treater transmission mechanism further comprises the motor control assembly (not shown) that the induced signal that responds stop means 16 is powered for drive-motor 14 in a suitable manner.In addition, substrate processing device 1 further comprises flexible cable 17, flexible cooling tube 18 and/or the flexible cloth tracheae 19 that can move with substrate treater 12.In addition, because in the present embodiment, drive-motor 14 is arranged on substrate treatment chamber 12 outsides, and at this moment the magnetic fluid dynamic sealing device 20 that rotating shaft or transmission rig 15 to drive-motor 14 carry out magnetic current sealing further is set on the sidewall of substrate treatment chamber 11
During use, utilize the substrate support bracket that substrate is loaded into substrate treatment chamber 11, the family of power and influence 111 of substrate treatment chamber 11 is closed form the sealing space of independently dealing with the work, to carry out effective isolation of outside atmosphere.This is because the working vacuum degree of the working vacuum degree of substrate treatment chamber 11 and coating chamber and inequality is necessary to carry out spatial separation and handles.Drive-motor 14 drives transmission rig (ball-screw) 15 rotations, and then the rotating shaft of drive-motor 14 changed into translation, and then driving the translation on guide rail 13 of substrate treater 12, substrate treater 12 scans bombardment to substrate 2 in the translation process handles.In this process since cable 17, cooling tube 18 and/or gas distribution pipe 19 be synchronized with the movement with the substrate treater, so can guarantee the steady operation of substrate treater.Guide rail 13 has also further guaranteed stability of transmission.
In addition, can trigger stop means 16 when substrate treater 12 moves near end position, stop means 16 feeds back to motor control assembly with induced signal, is that drive-motor 14 is oppositely powered by motor control assembly, realizes the function of shuttle-scanning.The cycle and the number of times of scanning bombardment can be set flexibly according to the characteristic and the process requirements of substrate 2.
By adopting said structure, make the substrate treater to handle the immobilized substrate in the mode of motion scan, the length of substrate treatment chamber is reduced, save manufacturing cost, and improved the treatment effect of substrate by the shuttle-scanning mode, simple and practical, controllability is strong.
In the above-described embodiments, only the utility model has been carried out exemplary description, but those skilled in the art can design various embodiments according to different actual needs under the situation that does not break away from the scope and spirit that the utility model protects.
Claims (10)
1. substrate processing device, described substrate processing device comprises: the substrate treatment chamber, be used for the substrate support bracket of support substrate in described substrate treatment chamber, to the substrate treater that the substrate of described substrate support bracket institute support is handled, it is characterized in that: described substrate processing device further comprises the treater transmission mechanism that is used for the described substrate treater of transmission.
2. substrate processing device according to claim 1 is characterized in that: described treater transmission mechanism comprises: be used to support and guide rail, the drive-motor of the described substrate treater that leads and be used to connect the rotating shaft of described drive-motor and the transmission rig of described substrate treater.
3. substrate processing device according to claim 2 is characterized in that: described transmission rig is a ball-screw.
4. substrate processing device according to claim 2 is characterized in that: described substrate treatment chamber further is provided for the travel position of described substrate treater is carried out the induced stop means.
5. substrate processing device according to claim 4 is characterized in that: described treater transmission mechanism further comprises the motor control assembly that the induced signal that responds described stop means is powered for described drive-motor in a suitable manner.
6. substrate processing device according to claim 2, it is characterized in that: described drive-motor is arranged on described substrate treatment chamber outside, and the magnetic fluid dynamic sealing device that rotating shaft or described transmission rig to described drive-motor carry out magnetic current sealing further is set on the sidewall of described substrate treatment chamber.
7. substrate processing device according to claim 1 is characterized in that: described substrate processing device further comprises the flexible cable that can move with described substrate treater.
8. substrate processing device according to claim 1 is characterized in that: described substrate processing device further comprises the flexible cooling tube that can move with described substrate treater.
9. substrate processing device according to claim 1 is characterized in that: described substrate processing device further comprises the flexible cloth tracheae that can move with described substrate treater.
10. substrate processing device according to claim 1 is characterized in that: described substrate treater is ion source or glow discharge treater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620017972 CN200981893Y (en) | 2006-08-28 | 2006-08-28 | Substrate treating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620017972 CN200981893Y (en) | 2006-08-28 | 2006-08-28 | Substrate treating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200981893Y true CN200981893Y (en) | 2007-11-28 |
Family
ID=38909054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620017972 Expired - Fee Related CN200981893Y (en) | 2006-08-28 | 2006-08-28 | Substrate treating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200981893Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103866249A (en) * | 2012-12-13 | 2014-06-18 | 中国科学院大连化学物理研究所 | Magnetron sputtering device and its application |
-
2006
- 2006-08-28 CN CN 200620017972 patent/CN200981893Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103866249A (en) * | 2012-12-13 | 2014-06-18 | 中国科学院大连化学物理研究所 | Magnetron sputtering device and its application |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Shenzhen Haowei Vacuum Photoelectron Holding Co., Ltd. Document name: Notification to Pay the Fees |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071128 Termination date: 20150828 |
|
| EXPY | Termination of patent right or utility model |