CN200976356Y - Surface adhibited device diode support structure having crystal fixing basement - Google Patents
Surface adhibited device diode support structure having crystal fixing basement Download PDFInfo
- Publication number
- CN200976356Y CN200976356Y CNU2006201571858U CN200620157185U CN200976356Y CN 200976356 Y CN200976356 Y CN 200976356Y CN U2006201571858 U CNU2006201571858 U CN U2006201571858U CN 200620157185 U CN200620157185 U CN 200620157185U CN 200976356 Y CN200976356 Y CN 200976356Y
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- CN
- China
- Prior art keywords
- colloid
- pedestal
- solid brilliant
- support structure
- brilliant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model relates to an SMD diode stand structure, comprising a colloid, a solid crystal base and a plurality of metal wirings, wherein a concave function area is arranged on the colloid, which is connected with the solid crystal base, with the top end relieved in the function area and the bottom end relieved out of the colloid; each of the metal wirings is fixedly connected to the colloid and extends out of the colloid from the function area. The utility model is characterized in that the solid crystal base is closely connected to the colloid due to a bulge, which stretches out from the side of solid crystal base for fixation, preventing components from exfoliating or loosing as well as improving production passing-rate.
Description
Technical field
The utility model relates to a kind of diode support structure that can be used for installing light-emitting diode chip for backlight unit, relates in particular to a kind of improved SMD (surface mount device) diode support structure with solid brilliant pedestal.
Background technology
Light-emitting diode (Light Emitting Diode, LED) be by the made luminescence component of semi-conducting material, it also is a kind of solid state light emitter, can convert electric energy to light, not only have good characteristics such as volume is little, the life-span is long, driving voltage is low, reaction rate is fast, vibration strength is good, can also adapt to the demand of light, the thin and miniaturization of various electronic products, become product very universal in the daily life, also belong to a kind of industry of maturation.
Generally speaking, light-emitting diode chip for backlight unit is fixed in a SMD (Surface Mount Device, the surface mount device) diode support, in order to constitute a light-emitting diode usually.As shown in Figures 1 and 2, described SMD diode support has colloid 10a, solid brilliant pedestal 20a and two metal pin 30a.Colloid 10a forms the functional areas 11a of an indent, Gu brilliant pedestal 20a is fixed in colloid 10a inside, and bottom face stretches out colloid 10a bottom, metal pin 30a is fixed in respectively among the colloid 10a, and it is adjacent at interval with solid brilliant pedestal 20a, and each metal pin 30a is by relative two lateral margins that extend out to colloid 10a outside in the 11a of functional areas, with as follow-up contact.Wherein, Gu can affixed light-emitting diode chip for backlight unit 40a on the brilliant pedestal 20a, and connecting on the light-emitting diode chip for backlight unit 40a on 41a to two metal pin of the two leads 30a, and cover one deck epoxy resin 50a, with encapsulation LED chip 40a and lead 41a, in order to constitute a light-emitting diode.By applying voltage, can make light-emitting diode chip for backlight unit 40a produce radiance at two metal pin 30a.
Above-mentioned colloid 10a is the material of insulating properties, Gu brilliant pedestal 20a mostly is metal material greatly, so that light-emitting diode chip for backlight unit 40a has the effect of heat radiation.Both be the element of unlike material for colloid 10a and solid brilliant pedestal 20a, are plane and combine with colloid 10a and consolidate brilliant pedestal 20a side edge, thereby make between the two conjugation and reliability deficiency.Under actual behaviour in service, Gu the possibility that produces the gap is arranged between brilliant pedestal 20a and colloid 10a, outside aqueous vapor is infiltrated to the 11a of functional areas, cause light-emitting diode chip for backlight unit 40a to damage; Perhaps, Gu brilliant pedestal 20a comes off from colloid 10a, cause the SMD diode support to produce situations such as fraction defective rising.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the utility model is proposed.
The purpose of this utility model, provide a kind of improved surface mount device diode support structure with solid brilliant pedestal, so that the light-emitting diode chip for backlight unit of subsequent technique has good heat radiation function, reaching increases conjugation and reliability between solid brilliant pedestal and the colloid, avoid from colloid, coming off, or and colloid between produce the gap, make qualification rate to promote product.
For achieving the above object, and the utility model provides a kind of improved table with solid brilliant pedestal to mount the device diode support structure, comprising: colloid, the functional areas with indent; One solid brilliant pedestal is fixed in this colloid, and top end face is revealed in this functional areas, and bottom face is revealed in outside this colloid, and this solid brilliant base side ora terminalis is extended with protuberance, is positioned at this colloid; And a plurality of metal pins, affixed with this colloid respectively, consolidate brilliant pedestal one side to lay respectively at this, and by extending out to this colloid outside in these functional areas respectively.
According to described surface mount device diode support structure with solid brilliant pedestal, wherein, this solid brilliant pedestal is a metal material spare.
According to described surface mount device diode support structure with solid brilliant pedestal, wherein, described metal pin respectively has a base portion, is arranged in this functional areas, and is extended to the pin portion of this colloid outside by this base portion.
According to described surface mount device diode support structure with solid brilliant pedestal, wherein, described metal pin reaches and should be formed with block at interval between the solid brilliant pedestal, to distinguish and to separate the polarity of described metal pin.
According to described surface mount device diode support structure with solid brilliant pedestal, wherein, this interval block is formed by this colloid.The beneficial effect that the utlity model has is as follows:
One, solid brilliant pedestal of the present utility model, bottom face manifests outside the colloid, can make the light-emitting diode chip for backlight unit in the subsequent technique have the effect of heat radiation.
Two, solid brilliant pedestal of the present utility model, its side edge has a protuberance with one-body molded, to increase conjugation and the reliability between solid brilliant pedestal and the colloid, avoid from colloid, coming off, or and colloid between produce the gap, make qualification rate to promote product.
In order further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet the accompanying drawing that is provided only for reference with the explanation, be not to be used for the utility model is limited.
Description of drawings
Fig. 1 is the stereogram of existing SMD diode support;
Fig. 2 is the cutaway view of existing SMD diode support;
Fig. 3 is a vertical view of the present utility model;
Fig. 4 is the front cross sectional view of the utility model first embodiment;
Fig. 5 is the front cross sectional view of the utility model second embodiment;
Fig. 6 is the front cross sectional view of the utility model the 3rd embodiment;
Fig. 7 is the front cross sectional view of the utility model the 4th embodiment;
Fig. 8 is the front cross sectional view of the affixed light-emitting diode chip for backlight unit of the utility model first embodiment.
Description of reference numerals:
The 10a colloid
The 11a functional areas
The solid brilliant pedestal of 20a
30a metal pin
The 40a light-emitting diode chip for backlight unit
The 41a lead
50a epoxy resin
10 colloids
11 functional areas
12 interval blocks
20 solid brilliant pedestals
21 top end faces
22 bottom faces
23 protuberances
231 basal plane ends
232 lateral ends
30 metal pins
31 base portions
32 pin portions
40 light-emitting diode chip for backlight unit
41 leads
50 adhesive layers
Embodiment
See also Fig. 3 and shown in Figure 4, the utility model provides a kind of improved SMD (surface attachment device) the solid brilliant base construction of diode support, includes colloid 10, a solid brilliant pedestal 20 and an a plurality of metal pin 30.
This colloid 10 roughly is cubic type body, also can be exterior design such as elongated body or polygonal body, and the utility model is not limited.This colloid 10 1 ends are inner to form functional areas that concave 11, and the external form of functional areas 11 is rounded, also can be cubic type or exterior design such as polygonal.Wherein, the material of colloid 10 can be polyphthalamide (Polyphthalamide, PPA), or any other known thermoplastic resin.
Should roughly slightly be the elongated body by solid brilliant pedestal 20, and also can be designs such as round body, its material is made by metal material spare.Should be fixed in this colloid 10 centre by solid brilliant pedestal 20, Gu and the top end face 21 of brilliant pedestal 20 is revealed in the functional areas 11, and the bottom face 22 of solid brilliant pedestal 20 manifests outside the colloid 10, can stretch out the bottom of colloid 10, or can be same plane with the bottom of colloid 10.Should solid brilliant pedestal 20 side edge with the one-body molded protuberance 23 that is outward extended with, it is stretched in this colloid 10, and the quantity of protuberance 23 do not limit, and can be provided with according to actual demand.
This metal pin 30 is made by metal material spare, as any known metal materials with conductivity such as copper, iron, and in accompanying drawing of the present utility model, is to be example with four metal pins 30.Each metal pin 30 is affixed with this colloid 10 respectively, and adjacent at interval with this solid brilliant pedestal 20 respectively, laying respectively at a side of this solid brilliant pedestal 20, and by extending out to colloid 10 outsides in the functional areas 11 respectively.Wherein, each metal pin 30 respectively has a base portion 31 and is arranged in functional areas 11, and one extend to the pin portion 32 of colloid 10 outsides by base portion 31, with as follow-up contact.Between each base portion 31, and and between the brilliant pedestal 20 be admittedly and the spaced block 12 of colloid 10 formation, in order to distinguish and to separate the polarity (positive and negative electrode) of each metal pin 30.Wherein, this colloid 10 is technical approach such as utilization ejection formation, and further affixed solid brilliant pedestal 20 and metal pin 30 are beneficial to a large amount of productions.
Seeing also Fig. 4 to Fig. 7, is the exterior design embodiment of the utility model protuberance 23.Each protuberance 23 respectively has a basal plane end 231, and two lateral ends 232 that are formed at two lateral margins of basal plane end 231, is connected in the side edge of solid brilliant pedestal 20.Wherein, can there be following design implementation example, promptly, two lateral ends 232 can be horizontal or camber shape (as Fig. 4 and Fig. 5), a lateral ends 232 horizontal, another side end 232 is camber shape (as Fig. 6), or one lateral ends 232 take the form of inclined plane, another side end 232 is camber shape (as Fig. 7) etc.By above-mentioned composition, to constitute improved SMD diode support structure of the present utility model with solid brilliant pedestal.
See also Fig. 8, further specify the forming process of light-emitting diode.Admittedly the top end face 21 of brilliant pedestal 20 can be connected with light-emitting diode chip for backlight unit 40, and its quantity can be provided with according to the quantity of metal pin 30, as four metal pins 30, can be provided with plural light-emitting diode chip for backlight unit 40.Be connected with two leads 41 on each light-emitting diode chip for backlight unit 40 respectively, it respectively is connected on the base portion 31 of corresponding metal pin 30, and in the functional areas 11 of colloid 10, cover adhesive layer 50 in conjunction with one deck light-permeable, as thermoplastic resins such as epoxy resin or silica gel, to avoid factor such as aqueous vapor, damage light-emitting diode chip for backlight unit 40.
According to above-mentioned, apply voltage respectively by pin portion 32 and conduct to base portion 31 at each metal pin 30, by the effect of lead 41, can make light-emitting diode chip for backlight unit 40 discharge its radiance.When voltage circulates, to make light-emitting diode chip for backlight unit 40 produce heat, Gu the bottom face 22 of brilliant pedestal 20 manifests outside this colloid 10, can utilize the thermal conduction characteristic of the metal that solid brilliant pedestal 20 had, make heat effectively export to colloid 10 outside heat radiations by solid brilliant pedestal 20.Thus, avoid because of the too high damage light-emitting diode chip for backlight unit 40 of heat, and shorten its useful life; Perhaps, because of heat has too high phenomenon, and make light-emitting diode chip for backlight unit 40 produce the situation of optical attenuation, promptly the radiance of Shi Fanging weaken, and make the brightness deepening.Simultaneously, the utility model is formed with protuberance 23 in solid brilliant pedestal 20 side edge, to be located in the colloid 10, further increases conjugation and reliability between solid brilliant pedestal 20 and the colloid 10, avoid that further the situation that comes off and produce the gap is arranged as is well known, make qualification rate and can promote product.
Therefore, the characteristics and the function that can produce by the utility model is as follows through putting in order:
One, solid brilliant pedestal of the present utility model, its bottom face manifests outside the colloid, so that the light-emitting diode chip for backlight unit of subsequent technique has the effect of heat radiation.
Two, solid brilliant pedestal of the present utility model, its side edge has a protuberance with one-body molded, with increase solid brilliant pedestal and colloid between conjugation and reliability, avoid in colloid, coming off, or and colloid between produce the gap, with the manufacturing qualification rate of lifting product.
The above only is preferred embodiment of the present utility model, non-so and limit claim of the present utility model, therefore, the equivalent structure that all utilization the utility model specifications and accompanying drawing content are done changes, and all in like manner all is included in the scope of the present utility model.
Claims (5)
1, a kind of surface mount device diode support structure with solid brilliant pedestal is characterized in that, comprising:
Colloid, it has the functional areas of indent;
One solid brilliant pedestal is fixed in this colloid, and top end face is revealed in this functional areas, and bottom face is revealed in outside this colloid, and this solid brilliant base side ora terminalis is extended with protuberance, is positioned at this colloid; And
A plurality of metal pins, affixed with this colloid respectively, consolidate brilliant pedestal one side to lay respectively at this, and by extending out to this colloid outside in these functional areas respectively.
2, the surface mount device diode support structure with solid brilliant pedestal as claimed in claim 1 is characterized in that, this solid brilliant pedestal is a metal material spare.
3, the surface mount device diode support structure with solid brilliant pedestal as claimed in claim 1 is characterized in that, described metal pin respectively has a base portion, is arranged in this functional areas, and is extended to the pin portion of this colloid outside by this base portion.
4, the surface mount device diode support structure with solid brilliant pedestal as claimed in claim 1 is characterized in that, described metal pin reaches and should be formed with block at interval between the solid brilliant pedestal, to distinguish and to separate the polarity of described metal pin.
5, the surface mount device diode support structure with solid brilliant pedestal as claimed in claim 4 is characterized in that, this interval block is formed by this colloid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201571858U CN200976356Y (en) | 2006-11-20 | 2006-11-20 | Surface adhibited device diode support structure having crystal fixing basement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201571858U CN200976356Y (en) | 2006-11-20 | 2006-11-20 | Surface adhibited device diode support structure having crystal fixing basement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200976356Y true CN200976356Y (en) | 2007-11-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2006201571858U Expired - Fee Related CN200976356Y (en) | 2006-11-20 | 2006-11-20 | Surface adhibited device diode support structure having crystal fixing basement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200976356Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113359345A (en) * | 2020-03-04 | 2021-09-07 | 华为技术有限公司 | Electronic device |
-
2006
- 2006-11-20 CN CNU2006201571858U patent/CN200976356Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113359345A (en) * | 2020-03-04 | 2021-09-07 | 华为技术有限公司 | Electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |