CN1990124A - Two-fluid jet module for cleaning substrate and cleaning device using thereof - Google Patents
Two-fluid jet module for cleaning substrate and cleaning device using thereof Download PDFInfo
- Publication number
- CN1990124A CN1990124A CNA2006101106899A CN200610110689A CN1990124A CN 1990124 A CN1990124 A CN 1990124A CN A2006101106899 A CNA2006101106899 A CN A2006101106899A CN 200610110689 A CN200610110689 A CN 200610110689A CN 1990124 A CN1990124 A CN 1990124A
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- cleaning
- jet module
- fluid jet
- fluid
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Nozzles (AREA)
Abstract
The invention relates to a two-fluid jet module for cleaning substrate and cleaning device using thereof, the provided two-fluid jet module for cleaning substrate includes a first receiving part for receiving drying air inside of the body; a second receiving part for receiving cleaning liquid inside of the body; a jet channel, one end of the jet channel communicating to the first receiving part, the other end exposing outside the body, and the side has a interfusion port of the cleaning liquid inflowing into the second receiving part. According to the invention, even two-fluid body is formed by jetting and mixing to the substrate surface, so the cleaning efficiency of the substrate is greatly improved, and due to making with the simplest construction for the invention by various forms, so the invention is easy to be made and maintained.
Description
Technical field
The present invention relates to two-fluid jet module for cleaning substrate and utilize its Weft cleaner, relate in particular to and two kinds of fluids are mixed and spread and be ejected into the two-fluid jet module for cleaning substrate of substrate surface and utilize its Weft cleaner.
Background technology
Usually, semiconductor device or display unit be by using semiconductor wafer or flat-panel monitor (FPD:flat panel display), makes through multiple manufacturing process such as evaporation process, etch process, photoetching process, ion implantation technology.
Process of surface treatment is to utilize treatment fluid treatment substrate surfaces such as cleaning fluid, etching solution or developer solution in these manufacturing process, substrate is cleaned the technology of (cleaning), etching (etching), development (developing) or striping (stripping).
That is, described process of surface treatment by described treatment fluid handle the substrate of transferring with the certain speed along continuous straight runs by conveyer belt method for transporting such as (conveyor) upper surface, lower surface or upper and lower surface and to substrate clean, etching, development or striping.
In addition, substrate through the process of various manufacturing process that comprises described process of surface treatment in, its surface can be needed to remove by particle and contaminants, carries out described cleaning in part manufacturing process front/rear for this reason.
So, cleaning is the technology that is used for the cleaning substrate surface.
As an example, cleaning is made up of soup treatment process, developing technique and drying process, especially particle and the pollutant of soup treatment process in order to remove substrate surface uses deionized water (deionized water) or chemicals cleaning fluids such as (chemical) on substrate surface.
And, once disclosed in the cleaning to have and cleaned the Weft cleaner of substrate with two-fluid jet module (following abbreviation two-fluid jet module), this two-fluid jet module utilizes the cleaning fluid treatment substrate for eliminating particle and pollutant, and, then the two fluids diffusion that is generated is impacted substrate surface with foam (bubble) form in order to improve cleansing power combination drying air (Clean Dry Air) formation two fluids in cleaning fluid.
Fig. 1 is the schematic diagram of existing two-fluid jet module, and Fig. 2 is with the profile of the two-fluid jet module shown in Fig. 1 along the intercepting of A-A ' line.
As shown in Figures 1 and 2, the blending space 11 of existing two-fluid jet module in main body 10 inside is respectively equipped with the supply pipe 30,40 of supply dry air and deionized water, and dry air and deionized water are fed to described blending space 11 respectively to be mixed and generate two fluids.
So, two fluids that the blending space 11 in main body 10 inside generates will along at an end of main body 10 towards a plurality of nozzle tips 20 diffusions that the width of substrate is provided with, be ejected into substrate surface with the foam form.
For this two-fluid jet module, it is highly important that to generate the efficient that trickle and uniform two fluids clean substrate with raising, and two fluids that generated evenly are ejected into substrate surface.
But existing two-fluid jet module adopts supplies the mode of simply mixing in body interior after cleaning fluid and the dry air respectively, and therefore the drop size of each two fluid is inhomogeneous mutually, causes cleaning efficiency to reduce.
Especially, therefore existing two-fluid jet module is difficult to use in meticulous cleaning because each two fluid size of dripping fails fully to become particulate.
Summary of the invention
The present invention proposes in order to solve aforesaid problem, and its purpose is to provide a kind of and generates two fluids and the two-fluid jet module for cleaning substrate that sprays equably and utilize its Weft cleaner with the ultra micron state.
According to two-fluid jet module for cleaning substrate provided by the present invention, comprise: first acceptance division that is used to receive dry air of body interior to achieve these goals; Second acceptance division that is used to receive cleaning fluid of described body interior; Injection channel, this injection channel one end is communicated with described first acceptance division, and the other end is exposed at described main body outside, and the side has the mouth of sneaking into of the cleaning fluid that flows into described second acceptance division.
Wherein, described injection channel forms mutual off-centre in its both sides and the described mouth of sneaking into that is provided with, and flow in the described injection channel when making cleaning fluid form eddy current with dry air.
And,, comprise: the handover portion that is used to transfer substrate according to Weft cleaner provided by the present invention; Be arranged on the upside, downside of the substrate of being transferred or the described two-fluid jet module of both sides up and down; Cleaning fluid supply department to described two-fluid jet module supply cleaning fluid; Gas supply department to described two-fluid jet module supply dry air.
Description of drawings
Fig. 1 is the schematic diagram of existing two-fluid jet module for cleaning substrate;
Fig. 2 is with the profile of the two-fluid jet module shown in Fig. 1 along the intercepting of A-A ' line;
Fig. 3 is the schematic diagram of first embodiment of two-fluid jet module for cleaning substrate provided by the present invention;
Fig. 4 is with the profile of the two-fluid jet module for cleaning substrate shown in Fig. 3 along the intercepting of B-B ' line;
Fig. 5 is the schematic diagram of second embodiment of two-fluid jet module for cleaning substrate provided by the present invention;
Fig. 6 is with the profile of the two-fluid jet module for cleaning substrate shown in Fig. 5 along the intercepting of C-C ' line;
Fig. 7 is with the profile of the two-fluid jet module for cleaning substrate shown in Fig. 5 along the intercepting of D-D ' line;
Fig. 8 is the schematic diagram of the 3rd embodiment of two-fluid jet module for cleaning substrate provided by the present invention;
Fig. 9 is with the profile of the two-fluid jet module for cleaning substrate shown in Fig. 8 along the intercepting of E-E ' line;
Figure 10 is with the profile of the two-fluid jet module for cleaning substrate shown in Fig. 8 along the intercepting of F-F ' line;
Figure 11 is the profile that utilizes Weft cleaner one embodiment of two-fluid jet module for cleaning substrate provided by the present invention.
Main symbol description: 100 is main body, and 110,210 is first acceptance division, and 120,310 is second acceptance division, 130,330 is injection channel, and 131,132,331,332 for sneaking into mouth, and 140,340 is nozzle tip, 150,220 is first supply pipe, 160,320 is second supply pipe, and 200 is first main body, and 300 is second main body, 400 are handover portion, 500 is two-fluid jet module, and 600 is cleaning fluid supply department, and 700 is gas supply department.
The specific embodiment
Below, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
＜embodiment 1 〉
Fig. 3 is the schematic diagram of first embodiment of two-fluid jet module for cleaning substrate provided by the present invention, and Fig. 4 is with the profile of the two-fluid jet module for cleaning substrate shown in Fig. 3 along the intercepting of B-B ' line.
As shown in Figures 3 and 4, according among first embodiment of two-fluid jet module for cleaning substrate provided by the present invention, two-fluid jet module comprises: first acceptance division 110 that receives dry air; Receive second acceptance division 120 of cleaning fluid; Injection channel 130, these injection channel 130 1 ends are communicated with described first acceptance division 110, the other end combines with nozzle tip 140, and the side have be communicated with described second acceptance division 120 sneak into mouthfuls 131.
Especially, described first acceptance division 110, described second acceptance division 120, described injection channel 130 and describedly sneak into mouthfuls 131 and form by in same main body 100, carrying out hole processing.
Specifically, first acceptance division 110 carries out hole processing towards the bottom surface by desired depth by the upper surface from main body 100 and forms, injection channel 130 forms by carry out hole processing towards the bottom surface of described main body 100 from the bottom of first acceptance division 110, second acceptance division 120 carries out hole processing by the side from main body 100 lateral surfaces towards injection channel 130 by desired depth and forms, sneak into mouth 131 and form, to connect injection channel 130 by carry out hole processing from the end of second acceptance division 120.
That is,, therefore be easy to carry out hole processing because the diameter of first acceptance division 110 and injection channel 130 diminishes along machine direction; Equally, second acceptance division 120 also diminishes along machine direction with the diameter of sneaking into mouth 131, therefore is easy to carry out hole processing.
Among first embodiment of aforesaid foundation two-fluid jet module for cleaning substrate provided by the present invention, first supply pipe 150 of supply dry air is connected in first acceptance division 110, and second supply pipe 160 of supply cleaning fluid is connected in described second acceptance division 120.
Therefore, the dry air that is fed to first acceptance division 110 flows along injection channel 130 towards vertical lower, and the cleaning fluid that is fed to second acceptance division 120 flow in the injection channel 130 at a high speed by sneaking into mouthfuls 131 according to venturi (venturi) effect.
The cleaning fluid that flow at a high speed injection channel 130 conflicts at a high speed with the dry air of injection channel 130 inside and mixes, so compares the trickleer and uniform two fluid mists of generation with existing simple hybrid mode.
Generated trickleer mist by diffusion when two fluids that so mix and generate move along injection channel 130, the nozzle tip 140 by injection channel 130 ends is ejected on the substrate at last.
And, in injection channel 130, mix and generate and two fluids that spread are ejected into substrate surface according to the shape of the nozzle tip 140 of injection channel 130 ends with specific droplet morphology.
In sum, first embodiment according to two-fluid jet module provided by the present invention, make dry air and cleaning fluid form uniform two fluid mists according to Venturi effect, and by being machined in same main body 100 is inner to be formed each acceptance division 110,120 and injection channels 130 and sneaks into mouthfuls 131, thereby improve the simplicity of making.
＜embodiment 2 〉
Fig. 5 is the schematic diagram of second embodiment of two-fluid jet module for cleaning substrate provided by the present invention, Fig. 6 is with the profile of the two-fluid jet module for cleaning substrate shown in Fig. 5 along the intercepting of C-C ' line, and Fig. 7 is with the profile of the two-fluid jet module for cleaning substrate shown in Fig. 5 along the intercepting of D-D ' line.At this, the Reference numeral identical with previous accompanying drawing represents to have the parts of identical function.
To shown in Figure 7, according among second embodiment of two-fluid jet module for cleaning substrate provided by the present invention, two-fluid jet module comprises: first acceptance division 110 that receives dry air as Fig. 5; Receive second acceptance division 120 of cleaning fluid; Injection channel 130, these injection channel 130 1 ends are communicated with described first acceptance division 110, the other end combines with nozzle tip 140, and the side have be communicated with described second acceptance division 120 sneak into mouthfuls 131; Especially, described second acceptance division 120 forms symmetrical a pair of at the lateral surface of main body 100, and describedly sneaks into mouthfuls 131,132 as shown in Figure 7, is formed on the both sides of injection channel 130 and eccentric mutually and be provided with.
Therefore, the dry air that is fed to first acceptance division 110 flows along injection channel 130 towards vertical lower, and the cleaning fluid that is fed to second acceptance division 120 flow in the injection channel 130 at a high speed by sneaking into mouthfuls 131,132 according to Venturi effect.
The cleaning fluid that flow at a high speed injection channel 130 and the dry air of injection channel 130 inside form the eddy current of cycle shape, and conflict at a high speed with dry air, therefore not only can more fine spread, and the more uniform two fluid mists of generation.
When two fluids that so mix and generate flow along injection channel 130 once more the nozzle tip 140 by diffusion and by injection channel 130 ends be ejected on the substrate.
As mentioned above, according to second embodiment of two-fluid jet module provided by the present invention since have Venturi tube structure and eccentric be provided with sneak into mouthfuls 131,132, thereby dry air and the flowability of cleaning fluid in injection channel 130 are significantly increased.
Therefore, second embodiment according to two-fluid jet module provided by the present invention, owing to make cleaning fluid flow into injection channel 130, so dry air and cleaning fluid form eddy current, and cleaning fluid conflicts at a high speed with dry air and forms two fluid mists of uniform ultra micron state simultaneously.
＜embodiment 3 〉
Fig. 8 is the schematic diagram of the 3rd embodiment of two-fluid jet module for cleaning substrate provided by the present invention, Fig. 9 is with the profile of the two-fluid jet module for cleaning substrate shown in Fig. 8 along the intercepting of E-E ' line, and Figure 10 is with the profile of the two-fluid jet module for cleaning substrate shown in Fig. 8 along the intercepting of F-F ' line.At this, the Reference numeral identical with previous accompanying drawing represents to have the parts of identical function.
To shown in Figure 10, according among the 3rd embodiment of two-fluid jet module for cleaning substrate provided by the present invention, two-fluid jet module comprises: first acceptance division 210 that receives dry air as Fig. 8; Receive second acceptance division 310 of cleaning fluid; Injection channel 330, these injection channel 330 1 ends are communicated with described first acceptance division 210, the other end combines with nozzle tip 340, and the side have be communicated with described second acceptance division 310 sneak into mouthfuls 331,332.
Especially, described first acceptance division 210 and described second acceptance division 310 are respectively formed at mutually different main body 200,300 inside, are set to up-down structure.
Among the 3rd embodiment of aforesaid foundation two-fluid jet module for cleaning substrate provided by the present invention, form on second main body 300 that connects first supply pipe 220 that is used to supply dry air on first main body 200 of first acceptance division 210, forms second acceptance division 310 and connect second supply pipe 320 that is used to supply cleaning fluid.
In addition, described＜embodiment 2〉in second acceptance division 120 be formed on main body 100 both sides is set and to second supply pipe 160 of each second acceptance division, 120 supply cleaning fluid respectively, and a side in second main body 300 connects second supply pipe 320 among the 3rd embodiment, but also can supply cleaning fluid respectively to the described mouth 331,332 of sneaking into.
Therefore, the dry air that is fed to first acceptance division 210 flows along injection channel 330 towards vertical lower, and the cleaning fluid that is fed to second acceptance division 320 flow in the injection channel 330 at a high speed by sneaking into mouthfuls 331,332 according to Venturi effect.
The cleaning fluid that flow at a high speed injection channel 330 and the dry air of injection channel 330 inside form the eddy current of cycle shape, and conflict at a high speed with dry air, therefore not only can more fine spread, and the more uniform two fluid mists of generation.
When two fluids that so mix and generate flow along injection channel 330 once more the nozzle tip 340 by diffusion and by injection channel 330 ends be ejected on the substrate.
As mentioned above, the 3rd embodiment according to two-fluid jet module provided by the present invention, not only generate two fluid mists of uniform ultra micron state, and owing to have second main body 300 that forms second acceptance division 320, even thereby only connect second supply pipe 320 in a side of second main body 300, also can supply cleaning fluid respectively, therefore make equipment become simple to the mouth 331,332 of sneaking into that is used to form eddy current.
＜embodiment 4 〉
Figure 11 is the profile that utilizes Weft cleaner one embodiment of two-fluid jet module for cleaning substrate provided by the present invention.At this, the Reference numeral identical with previous accompanying drawing represents to have the parts of identical function.
As shown in figure 11, utilize an embodiment of the Weft cleaner of foundation two-fluid jet module for cleaning substrate provided by the present invention to comprise: the handover portion 400 that is used to transfer substrate S; Be arranged on the upside, downside of the substrate S that is transferred or the described＜embodiment 1 of both sides up and down〉to＜embodiment 3 in any one two-fluid jet module 500; Cleaning fluid supply department 600 to described two-fluid jet module 500 supply cleaning fluids; Gas supply department 700 to described two-fluid jet module 500 supply dry airs.
At this, though for described two-fluid jet module 500 adopt described＜embodiment 2 the example of two-fluid jet module 500, can also adopt described＜embodiment 1〉or described＜embodiment 3 two-fluid jet module for cleaning substrate.
In sum, though by accompanying drawing is that example has illustrated the present invention with the specific preferred embodiment, but the present invention is not limited to the foregoing description, can carry out various changes and modification the worker with common knowledge who does not break away from the technical field of the invention in the scope of the inventive concept.
As mentioned above, because the present invention sprays evenly and form two fluid mists of ultra micron state to substrate surface, so not only increases substantially the cleaning efficiency of substrate, and can carry out meticulous cleaning process.
And,, therefore be easy to make and safeguard because the present invention makes with the simplest structure by variety of way.
Claims (5)
1, a kind of two-fluid jet module for cleaning substrate is characterized in that comprising:
Be formed on first acceptance division of body interior, to be used to receive dry air;
Be formed on second acceptance division of described body interior, be used to receive cleaning fluid;
Injection channel, this injection channel one end is communicated with described first acceptance division, and the other end is exposed at described main body outside, and the side has the mouth of sneaking into of the cleaning fluid that flows into described second acceptance division.
2, two-fluid jet module for cleaning substrate according to claim 1, the described mouth of sneaking into that it is characterized in that described injection channel to form mutual off-centre in its both sides and be provided with flow in the described injection channel when making cleaning fluid and dry air form eddy current.
3, two-fluid jet module for cleaning substrate according to claim 2 is characterized in that described main body comprises first main body that forms described first acceptance division and second main body that forms described second acceptance division and described injection channel.
4, according to any described two-fluid jet module for cleaning substrate in the claim 1 to 3, it is characterized in that the other end of described injection channel is provided with nozzle tip.
5, a kind of Weft cleaner is characterized in that comprising:
Be used to transfer the handover portion of substrate;
Be arranged on the upside, downside of the substrate of being transferred or any described two-fluid jet module in the claim 1 to 3 of both sides up and down;
Cleaning fluid supply department to described two-fluid jet module supply cleaning fluid;
Gas supply department to described two-fluid jet module supply dry air.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050133727A KR100728882B1 (en) | 2005-12-29 | 2005-12-29 | Two-fluid jet module for cleaning substrate and cleaning device using thereof |
| KR1020050133727 | 2005-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1990124A true CN1990124A (en) | 2007-07-04 |
Family
ID=38212791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101106899A Pending CN1990124A (en) | 2005-12-29 | 2006-08-08 | Two-fluid jet module for cleaning substrate and cleaning device using thereof |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100728882B1 (en) |
| CN (1) | CN1990124A (en) |
| TW (1) | TWI323913B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107209143A (en) * | 2015-01-12 | 2017-09-26 | 艺康美国股份有限公司 | Equipment for maintaining sensor accuracy |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101617347B1 (en) * | 2014-12-16 | 2016-05-02 | 주식회사 케이씨텍 | Block type bubble jet nozzle |
| CN112775096B (en) * | 2019-11-11 | 2022-04-05 | 安徽汇久管业有限公司 | Ultrasonic cleaning equipment for stainless steel pipe fitting |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003145064A (en) * | 2001-11-12 | 2003-05-20 | Tokyo Electron Ltd | Two-fluid jet nozzle and substrate cleaning device |
| JP2004344689A (en) * | 2003-05-19 | 2004-12-09 | Ikeuchi:Kk | Two-fluid nozzle |
| JP4464850B2 (en) * | 2004-03-09 | 2010-05-19 | 株式会社ルネサステクノロジ | Substrate cleaning two-fluid nozzle and substrate cleaning device |
-
2005
- 2005-12-29 KR KR1020050133727A patent/KR100728882B1/en not_active IP Right Cessation
-
2006
- 2006-08-08 CN CNA2006101106899A patent/CN1990124A/en active Pending
- 2006-09-07 TW TW095133094A patent/TWI323913B/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107209143A (en) * | 2015-01-12 | 2017-09-26 | 艺康美国股份有限公司 | Equipment for maintaining sensor accuracy |
| CN107209143B (en) * | 2015-01-12 | 2020-10-16 | 艺康美国股份有限公司 | Apparatus for maintaining sensor accuracy |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI323913B (en) | 2010-04-21 |
| TW200729310A (en) | 2007-08-01 |
| KR100728882B1 (en) | 2007-06-15 |
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Open date: 20070704 |