CN1977574B - Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device and electronic device using multilayer wiring board - Google Patents

Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device and electronic device using multilayer wiring board Download PDF

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Publication number
CN1977574B
CN1977574B CN2006800003696A CN200680000369A CN1977574B CN 1977574 B CN1977574 B CN 1977574B CN 2006800003696 A CN2006800003696 A CN 2006800003696A CN 200680000369 A CN200680000369 A CN 200680000369A CN 1977574 B CN1977574 B CN 1977574B
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Prior art keywords
layer
solid electrolytic
electrolytic capacitor
wiring
substrate
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CN1977574A (en
Inventor
菅谷康博
山本义之
朝日俊行
三木胜政
胜又雅昭
齐滕义行
中山武司
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48235—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a via metallisation of the item
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A multilayer wiring board is provided with a plurality of wiring boards which include a plurality of wiring layers including a grounding layer and a power supply layer; a solid electrolytic capacitor wherein an insulating oxide film layer, an electrolyte layer and a conductive layer are successively formed on one plane or both planes of a foil-like metal base body; and a conductive member penetrating in a thickness direction of the wiring boards. The solid electrolytic capacitor is arranged to be sandwiched between the wiring boards, the conductive layer is connected to a grounding electrode formed on the grounding layer, and the foil-like metal base body is connected to a power supply electrode formed on the power supply layer.

Description

Multi-layer wire substrate and manufacture method thereof, and the semiconductor device and the electronic equipment that use multi-layer wire substrate
Technical field
The present invention relates to multi-layer wire substrate, comprise the semiconductor device of multi-layer wire substrate and the electronic equipment that uses multi-layer wire substrate.
Background technology
Follow miniaturization, the multifunction of electronic equipment in recent years, constitute many PIN (stitch) change, high speed, the transmissionization constantly development at a high speed of the semiconductor element of electronic equipment.Be used for the printed circuit board (PCB) of described equipment, assembly and a plurality of passive part that semiconductor element has been installed are being installed.These passive parts mostly are capacitor element.Major part is used to make the noise smoothings such as switch interference that are superimposed on service voltage in these capacitors.And, also can be used as decoupling capacitor, described decoupling capacitor prevents that the high-frequency noise that processor produces from flowing through whole printed circuit board (PCB).And, be used in the short time of the mode of operation of handoff processor, supply with a large amount of electric currents and the voltage landing that prevents to cause.In order to realize these effects effectively, necessary condition is the value that these capacitors reduce equivalent series inductance (ESL).Usually, in order to reduce ESL, connect up, install most capacitors in parallel.The chip-type laminated ceramic capacitor of many uses is as these capacitor elements.But during bias voltage or when using operating ambient temperature to uprise, the ceramic capacitor capacity reduces significantly in stack.
As the method that reduces the power supply interference that is produced by the semiconductor element that is installed in described electronic equipment, well-known is as far as possible capacitor element to be installed near the semiconductor element.Therefore, built-in capacitor element in the insert layer substrate that constitutes semiconductor packages is proposed.For example, the built-in substrate of chip capacitor is disclosed in Japanese Patent Application Laid-Open 2001-185460 communique and the flat 11-220262 communique of Japanese Patent Application Laid-Open.In addition, disclosed as No. 2738590 communique of Japan Patent, another kind of multilager base plate as decoupling capacitor is proposed, described multilager base plate will be effective as the capacitor layers utilization by the dielectric layer of conductor foil clamping.On the other hand, the board-like capacitor-embedded example in printed circuit board (PCB) that will have jumbo aluminium electrolytic capacitor etc. is disclosed in flat 10-97952 communique of Japanese Patent Application Laid-Open and the Japanese Patent Application Laid-Open 2002-359160 communique.
As the multi-layer wire substrate that is used to encapsulate, be extensive use of glass-epoxy multilager base plate as shown in figure 10.Described glass-epoxy multilager base plate 55 comprises: insulating barrier 50 makes epoxy resin impregnated and is hardened in the glass woven fabric as reinforcement material; And the wiring pattern 51 that is formed on the two sides of insulating barrier 50.Wiring pattern 51 is made of Copper Foil, also is formed with insulating barrier 50 on wiring pattern 51.In glass-epoxy multilager base plate 55, be formed with through hole (through-hole) 52, at the inwall of through hole 52, utilize the plating technology to form copper layer 53.And, in the superiors of glass-epoxy multilager base plate 55, be formed with the wiring pattern 54 that constitutes by Copper Foil.Described glass-epoxy multilager base plate 55 is also referred to as the multi-layer wire substrate that utilizes the through hole plating technology and obtain.The multi-layer wire substrate that obtains because utilizing the through hole plating technology can be produced in a large number with low cost, so also be adopted as the insert layer substrate of semiconductor packages very widely.And, when utilizing wire bonding technique that semiconductor element 56 is installed, the multilager base plates that utilize described through hole plating technology and obtain that use more.
On the other hand, the flat tip electrode of utilizing wiring layer and solder projection or golden Au projection and the flip-chip method that is connected and when semiconductor element is installed, require more highdensity wiring, therefore developed use increase layer technology increase layer multi-layer printed circuit board (below, be called " increasing laminar substrate ").Increasing laminar substrate is such substrate: will be for example the glass-epoxy multilager base plate as main substrate, on main substrate, pile up the insulating barrier that forms wiring pattern, and, utilize through hole to connect the wiring pattern between levels and form.Because in increasing laminar substrate, the wiring pattern of lower floor can be connected by through hole with necessity place of the wiring pattern on upper strata, so the space of the through hole that is connected diminishes.As a result, can reduce the diameter of through hole and make live width, distance between centers of tracks become fine, thereby can realize highdensity wiring.The through hole that connects the interlayer increase laminar substrate utilizes plating usually and forms, and does not use plating and uses electrocondution slurry to form the laminar substrate that increases of through hole but also developed.For example, ALIVH (registered trade mark) and B 2It (registered trade mark) is to use the laminar substrate that increases of electrocondution slurry, its no main substrate, and all layers are all as increasing layer by layer.
For the electrical characteristic that makes the electronic equipment that comprises described semiconductor device improves, must be installed on the printed circuit board (PCB) with a plurality of capacitor elements headed by the decoupling capacitor, many thereby the part number becomes, be difficult to realize miniaturization, cost degradation.
As shown in figure 10, utilize the semiconductor packages of institute's widely used glass-epoxy resin multilager base plate at present and terminal conjunction method installation, if the purposes of semi-conductive operating rate below 100MHz used, then need not to consider very much to comprise the length of the wiring of lead.But, as the semiconductor of imaging system, need to transmit in some semiconductor packages of bulk information, in order to make its operate as normal, must install and a plurality ofly be used for the anti-interference capacitor device, thereby the change of part number is many.For example, be installed in the decoupling capacitor on the motherboard, utilize a plurality of capacitors that are connected in parallel to reduce equivalent series inductance (ESL), therefore, it is many that the part number becomes inevitably.Furthermore, when sintered ceramic and the chip capacitor that forms are used as decoupling capacitor, must further consider the temperature characterisitic of capacitance and install a plurality of.
On the other hand, as reducing the method for disturbing from the power supply of semiconductor element generation, having proposed to form capacity cell as far as possible near semiconductor element is target, the method for built-in capacitor element in the insert layer substrate that constitutes semiconductor packages.For example, as disclosed in No. 2738590 communique of Japan Patent, proposed the multilager base plate as decoupling capacitor, the dielectric layer that described multilager base plate will be made of the resin material of conductor foil clamping is effective as the capacitor layers utilization.But,, be tens these other jumbo capacitors of level so can't form the value of dielectric constant because described structure is the dielectric layer of resinae.Therefore, though have the function of decoupling, but can't store sufficient charge, to be achieved as follows effect: make noise smoothingization such as the switch interference that is superimposed on service voltage or in the short time of the mode of operation of handoff processor, supply with a large amount of electric currents and prevent to cause the voltage landing.That is, considering under the situation of reduction effect of jamproof part number, is limited.And during semi-conductive operating rate high speed, it becomes the capacitor-embedded insert layer of the stabilization problem that can't tackle supply voltage.Furthermore, when having a plurality of electrode in a basement membrane dielectric layer, it is good having only under the situation of a power-supply system, but when having a plurality of power-supply system, has just produced each power supply and disturbed the problem of propagating through dielectric layer.
Therefore, existing as built-in large value capacitor device and in Japanese patent laid-open 11-220262 communique the structure of disclosed built-in chip capacitor.The electrode of chip capacitor forms at grade usually, and the power-supply system electrode of built-in substrate and grounding system electrode must be formed on on the one side.Usually, because bus plane often is formed on the different separately layers with ground plane, so there is the problem that requires to change significantly design for built-in chip capacitor.
On the other hand, open in the 2001-185460 communique disclosedly as the Japan Patent spy, proposed chip capacitor to be installed, thereby utilize the interlayer of bus plane and ground plane and the technical scheme of built-in capacitor at longitudinal direction.But also can't avoid the design alteration around the chip element this moment, and described situation still is a problem.In addition, also there are the following problems: because be the structure of burying, installing chip element at longitudinal direction underground, (unit: mm) so little chip size also has the thickness of 0.6mm, thereby the thicker problem of thickness of insert layer substrate itself is arranged so even the thickness of bus plane, ground plane interlayer uses 0603 size.
On the other hand, as disclosed in the flat 10-97952 communique of Japanese Patent Application Laid-Open, the Japanese Patent Application Laid-Open 2002-359160 communique, proposed single aluminium electrolytic capacitor and be built in the substrate with this scheme as built-in thinner thickness and jumbo capacitor element.But its prerequisite that will consider is to follow the design alteration of built-in insert layer.
Summary of the invention
The present invention develops in view of described problem.
Multi-layer wire substrate of the present invention comprises: a plurality of wiring plates comprise a plurality of wiring layers with ground plane and bus plane; Solid electrolytic capacitor, it is constituted by rete, dielectric substrate and conductor layer by forming insulating oxide successively on the one side of paper tinsel shape metallic substrates or two sides; Electroconductive component runs through the thickness direction of wiring plate; And at the electroplated film that is difficult to oxidation of the surface portion setting of described metallic substrates.And solid electrolytic capacitor disposes to be clipped in the mode between a plurality of wiring plates, and conductor layer is connected with the grounding electrode that is formed on ground plane, and electroplated film is connected with the power electrode that is formed on bus plane via electroconductive component.
Fig. 1 is the profile of the multi-layer wire substrate of the embodiment in first execution mode of the present invention.
Fig. 2 A is the profile in order to the manufacture method of the multi-layer wire substrate of other embodiment that first execution mode of the present invention is described.
Fig. 2 B is the profile in order to the manufacture method of the multi-layer wire substrate of other embodiment that first execution mode of the present invention is described.
Fig. 3 A is the profile in order to the manufacture method of the multi-layer wire substrate of the other embodiment that first execution mode of the present invention is described.
Fig. 3 B is the profile in order to the manufacture method of the multi-layer wire substrate of the other embodiment that first execution mode of the present invention is described.
Fig. 4 is the profile of structure of multi-layer wire substrate of an embodiment of expression second execution mode of the present invention.
Fig. 5 is the profile of structure of multi-layer wire substrate of other embodiment of expression second execution mode of the present invention.
Fig. 6 A is the process profile in order to the manufacture method of the multi-layer wire substrate that second execution mode of the present invention is described.
Fig. 6 B is the process profile in order to the manufacture method of the multi-layer wire substrate that second execution mode of the present invention is described.
Fig. 7 A is the process profile in order to the manufacture method of the multi-layer wire substrate that second execution mode of the present invention is described.
Fig. 7 B is the process profile in order to the manufacture method of the multi-layer wire substrate that second execution mode of the present invention is described.
Fig. 8 A is the plane graph in order to the wiring pattern of explanation multi-layer wire substrate.
Fig. 8 B is the plane graph in order to the wiring pattern of explanation multi-layer wire substrate.
Fig. 8 C is the plane graph in order to the wiring pattern of explanation multi-layer wire substrate.
Fig. 8 D is the plane graph in order to the wiring pattern of explanation multi-layer wire substrate.
Fig. 9 A is used for plane graph as the wiring pattern of the multi-layer wire substrate of the semiconductor device of embodiments of the present invention in order to explanation.
Fig. 9 B is used for plane graph as the wiring pattern of the multi-layer wire substrate of the semiconductor device of embodiments of the present invention in order to explanation.
Fig. 9 C is used for plane graph as the wiring pattern of the multi-layer wire substrate of the semiconductor device of embodiments of the present invention in order to explanation.
Fig. 9 D is the plane graph of the configuration of expression same solid electrolytic capacitor.
Figure 10 is the profile of the structure of the conventional multi-layer wire substrate of expression.
The explanation of Reference numeral
155 glass-epoxy multilager base plates
100 composite plates
101 solid electrolytic capacitors
102 metallic substrates
103 conductor layers
104 glass-epoxy substrates
105 glass-epoxy substrates
106 bus plane electrodes
107 ground plane electrodes
108 through hole platings
109 semiconductor elements
110 leads
Embodiment
Accompanying drawing with reference to following illustrates embodiments of the present invention, but is simplified illustration, represents to have in fact the inscape of identical function with same reference numerals.In addition, the present invention is defined in following execution mode.
(first execution mode)
Below, with reference to Fig. 1, Fig. 2 A, Fig. 2 B, Fig. 3 A and Fig. 3 B first execution mode of the present invention is described.Fig. 1 is the profile of the multi-layer wire substrate of the embodiment 1 in first execution mode of the present invention.As shown in Figure 1, semiconductor element (semiconductor chip) 109 utilizes terminal conjunction method to be connected with glass-epoxy multilager base plate 155, and utilizes resin 180 to encapsulate.That is, multi-layer wire substrate shown in Figure 1 also can be the connection semiconductor in the semiconductor packages and Intermediate substrate, the insert layer (interposer) of motherboard.And glass-epoxy multilager base plate 155 is brought into play function as insert layer.As shown in Figure 1, glass-epoxy multilager base plate 155 is multilager base plates of 4 layers of wiring.Multilager base plate 155 comprises glass-epoxy substrate 104 and glass-epoxy substrate 105.Form the wiring layer of ground floor at the upper surface of glass-epoxy substrate 104, form the wiring layer of the second layer at its lower surface.And, form the 3rd layer wiring layer at the upper surface of glass-epoxy substrate 105, form the 4th layer wiring layer at its lower surface.Between the wiring layer of the described second layer and the 3rd layer, form solid electrolytic capacitor 101.Solid electrolytic capacitor 101 inserts and is embedded between glass-epoxy substrate 104 and the glass-epoxy substrate 105.
Solid electrolytic capacitor 101 generates and forms insulating oxide successively by rete, dielectric substrate and conductor layer 103 on the two sides of paper tinsel shape metallic substrates 102, and be embedded in the combination layer 100 between the wiring layer of the second layer of multilager base plate 155 and the 3rd layer.Conductor layer 103 is connected in the grounding electrode 107 of multilager base plate 155, and paper tinsel shape metallic substrates 102 is connected with the power electrode 106 of multilager base plate 155.Grounding electrode 107 is formed on the second layer of multilager base plate 155, and power electrode is formed on the 3rd layer of multilager base plate 155.
Described method of attachment also can be used electroconductive resin adhesive etc., but in the present embodiment, uses the through hole plating 108 of the thickness direction that runs through multilager base plate 155, connects paper tinsel shape metallic substrates 102 and power electrode 106.The through hole plating that runs through thickness direction 108 shown in the present embodiment is perforation structures, but also can interlayer is connected and paper tinsel shape metallic substrates 102 is connected with power electrode 106 by filled conductive hole slurry.
In the semiconductor packages of recent using system LSI,, therefore must form capacitor corresponding to power-supply system how with a plurality of power-supply system construction systems.At this moment, can utilize to form and carry out correspondence corresponding to the power electrode of power-supply system at the wiring layer of multilager base plate 155.At this moment, preferably make the wiring layer that forms power electrode be divided into zone, make the electrode of same power supplies system be formed on identical zone corresponding to power-supply system.
Paper tinsel shape metallic substrates 102 is to form as follows: utilize etch processes to make a part of roughening and the porous of aluminium foil one side, thereby after making the area increase on surface, the oxidation processes surface forms the dielectric film as oxide layer.Usually, utilize etch processes to form a plurality of fine porous portions, in its surface, utilize oxidation processes and form thin dielectric film, described dielectric film is as luring electric body and bringing into play function.And then, in order also to realize being electrically connected, use functional high-polymer layers such as polypyrrole or polythiophene in the inside of fine porous portion, utilize chemical polymerization or electrolysis polymerization to form solid electrolyte layer.On described solid electrolyte layer, collector layer is set.The not etched part of paper tinsel shape metallic substrates 102 realizes effect as electrode with described collector layer, makes capacitor performance function.
In addition, in the present embodiment, use aluminium foil as paper tinsel shape metallic substrates 102, yet, similarly also can be to form material, the resin material of dielectric layer on the surface or utilize membrane processes such as sputtering method with the method for other approach formation etc. and form the material of dielectric layer, so long as sheet promptly can obtain same effect.
And, in the present embodiment, solid electrolytic capacitor 101 is embedded in the composite plate (compositesheet) 100, but can be embedded in any that from following composite plate, select: with the nonwoven fabrics of heatproof organic fiber as the reinforcement material and the composite plate of having flooded thermosetting resin; Perhaps by inorganic filler and thermosetting resin and the composite plate that constitutes; Perhaps with the yarn fabric of glass fibre as the reinforcement material and the composite plate of having flooded thermosetting resin.Thermosetting resin uses epoxy resin.
As the composite plate of using heatproof organic fiber, for example, be in aromatic polyamide resin (aramidresin) nonwoven fabrics, to use the composite plate of epoxy resin as thermosetting resin, it has the little feature of thermal coefficient of expansion.If in the aromatic polyamide resin nonwoven fabrics, use the prepreg of epoxy resin as thermosetting resin, then the pressure the during lamination under the state of having filled inner via hole slurry (inner via paste) is about 5MPa.Therefore, solid electrolytic capacitor 101 is buried underground and is injury-free.
And employed composite plate 100 is by inorganic filler and thermosetting resin and constitute in the present embodiment.Therefore, can utilize the characteristic of inorganic filler to improve thermal transmission coefficient, the heat energy that the semiconductor element 109 that makes the surface be installed produces discharges enough efficiently.The material of inorganic filler for example is, Al 2O 3, SiO 2, MgO, BN, AlN etc.The selection of the material by inorganic filler can be controlled various physical attributes.Furthermore, because composite plate does not have reinforcement materials such as glass fibre, so under the built-in operation softening, can realize built-in solid electrolytic capacitor 101 and it is not caused damage based on hot pressing fusion of following time.And, because composite plate is three-dimensional isotropic as the hot exapnsion coefficient of physical property values, so the damage that when thermal shock built-in element is caused is little.
Furthermore, can utilize the modulus of elasticity of the composite plate 100 of selecting the thermoset epoxy resin material and freely selecting solid electrolytic capacitor 101 built-in, but the following less modulus of elasticity of 10GPa preferably.
But the present invention is not that the material that will form capacitor-embedded layer is defined as composite board material, for example can use the glass-epoxy prepreg yet, and utilize the epoxy resin that pressurizes and ooze out to flood, and resin material is unrestricted.
In addition, also can use following processing method: insertion has been filled the composite plate with flexual inner via hole slurry and has been carried out lamination between glass-epoxy substrate 104 and glass-epoxy substrate 105.At this moment, need not form through hole plating hole 108.Connect as interlayer, use the through hole plating hole, also be to use the judgement of conductivity inner via hole slurry to take into account the wires design again of the number of plies and pitch-row etc. or take into account the processing cost that is connected in order to interlayer to determine.
And, in the situation of this first execution mode, glass-epoxy multilager base plate 155 is laminated sheets different with glass-epoxy substrate 104, glass-epoxy substrate 105 and composite plate 100, and described composite plate 100 is inequality with the material of glass-epoxy substrate 105 with glass-epoxy substrate 104.But,, produce crooked in fact hardly because be to utilize glass-epoxy two-ply clamping composite plate symmetrically and constituting up and down.
In addition, but the present invention is defined in to use 2 laminate insert layer substrates, can use in 2 laminates, 3 laminates, 4 laminates, 6 laminates any.
Secondly, use Fig. 2 A, Fig. 2 B, Fig. 3 A, Fig. 3 B illustrate the method for built-in solid electrolytic capacitor 101 and connect the power electrode 106 of glass-epoxy substrate, the syndeton that grounding electrode 107 arrives solid electrolytic capacitor 101.
Fig. 2 A, Fig. 2 B are the profiles in order to the manufacture method of the multilager base plate in the explanation present embodiment.And Fig. 2 A is the profile of the multilager base plate before the lamination, and Fig. 2 B is the profile of the multilager base plate under the state of lamination.
According to the manufacture method shown in Fig. 2 A, Fig. 2 B, use the conductive hole slurry 111 that is filled in composite plate 100 to connect the grounding electrode 107 of glass-epoxy substrate and the conductor layer 103 of solid electrolytic capacitor 101.Because utilize to have fusible composite plate 100, solid electrolytic capacitor 101 closely is contacted with between the glass-epoxy substrate 104,105, so situation such as can not peel off during the backflow after moisture absorption.And, as according to Fig. 2 A clear and definite, composite plate 100 is by the plate of clamping capacitor 101 and is configured in built-in around the capacitor 101 and constitutes with composite plate.As shown in the figure, under the state of clamping capacitor 101, lamination and heated substrates 104, substrate 105 and composite plate 100.That is, make composite plate fusion, softening, and in the mode of capacitor generation internal stress capacitor is not imbedded after-hardening.
What the structure aspect should be careful is, because solid electrolytic capacitor 101 is to generate insulating oxide successively by the structure of rete, dielectric substrate and conductor layer 103 on the two sides of aluminium foil shape metallic substrates 102, so when desiring the wiring pattern of the multilager base plate (insert layer substrate) that direct use only has the function that connects up again, be short-circuited as the conductor layer 103 and the power electrode 106 of grounding electrode.Therefore, be careful power line, ground connection GND line respectively and analyze wiring pattern and just can obtain following structure: on the 3rd layer (wiring layer of the upper surface of glass-epoxy substrate 105) as bus plane, the grounding electrode 107 of new setting and power electrode insulated separation, the conductor layer 103 of electric connection solid electrolytic capacitor 101 and the 3rd layer the grounding electrode that is arranged at multilager base plate.According to this structure,,, be good with regard to anti-interference so increased the ground connection effect because can both be connected with grounding electrode at upper and lower surface.
And, as the method for avoiding conductor layer 103 with the 3rd layer of short circuit of the multilager base plate of bus plane, can utilize insulation board or insulation paste and realize insulation between electrolytic capacitor 101 and multilager base plate the 3rd layer simply.At this moment, the wires design that does not change the insert layer (multilager base plate) that only has the function that connects up again just can realize built-in.
In addition, consider wiring distance, because directly influence the increment of its wiring distance, so what can make the ESL value increase that is caused by length of arrangement wire as the thickness of the composite plate 100 of adhesive plate from the flat tip electrode of semiconductor element to electrode for capacitors.Therefore, comparatively ideally be, composite plate 100 and conductive hole slurry 111 are thin as far as possible, and comparatively ideal is preferably to use the following composite plate of 50 μ m.
In addition, as the method for the aluminium foil shape metallic substrates 102 that connects anode, use through hole plating 108 with the power electrode 106 of glass-epoxy substrate.
Below, specify manufacture method.With glass-epoxy substrate 104, solid electrolytic capacitor 101 is embedded under the state in the composite plate, heat, pressurize with glass-epoxy substrate 105.When the thermosetting epoxy resin of the softening composite plate of fusion, pressurize with the pressure about 2MPa to 4MPa, bury solid electrolytic capacitor 101 underground, the heating-up temperature about utilizing from 180 degrees centigrade to 200 degrees centigrade is hardened composite plate fully.In addition, when this heat/pressure operation, because utilize the composite plate 100 of having filled inner via hole slurry 111 to bury solid electrolytic capacitor 101 underground, so also connect the electrode 107 of substrate and the electrode 103 of solid electrolytic capacitor 101 via inner via hole 111.Afterwards, use drill to form through hole, carry out the through hole plating operation.Because formed wiring pattern during the plating operation, so after this zone forms resist, just carry out the plating operation on the top layer of laminated body.The result is, utilizes through hole 108, and power electrode 106 (power line) is connected with aluminum electric pole foil (that is paper tinsel shape metallic substrates 102) as the anode portion of solid electrolytic capacitor 101.Because the thickness of aluminum electric pole foil is about 70 μ m, so can guarantee the reliability that fully is connected with through hole plating.
About holding wire, via through hole 114, the signal electrode 112 that is formed on the wiring layer of ground floor is connected with the signal electrode 113 that is formed on the 4th layer wiring layer.Because through hole 114 non-through solid electrolytic capacitors 101 as capacitor layers, only by having the dielectric layer of single and relatively little dielectric constant, so signal 114 ones of through holes hardly by deterioration.
Secondly, the multilager base plate of other embodiment is described with reference to Fig. 3 A, 3B.And Fig. 3 A is the profile of the multilager base plate before the lamination, and Fig. 3 B is the profile of the multilager base plate under the state of lamination.In the present embodiment, power electrode 106 (power line) and aluminum electric pole foil (being paper tinsel shape metallic substrates 102) as the anode portion of this solid electrolytic capacitor 101 utilize electroconductive resin slurry 115 to be connected.Be, then can not obtain enough low resistance connections in this item that should be careful owing to alumite if when the metallic substrates 102 that is made of aluminium foil is directly contacted with electroconductive resin slurry 115.Therefore, the surface portion in metallic substrates 102 forms the electroplated film 181 that is difficult to oxidation.For example, can utilize on the surface of metallic substrates 102 and implement Au plating, Ag plating, Ni plating, guarantee that enough low resistances connect.And, in the present embodiment, replace the composite plate 100 of the embodiment shown in Fig. 2 A, the 2B, utilize to have fusible electroconductive resin slurry 115 and imbed gap between the interface of solid electrolytic capacitor 101 and glass-epoxy substrate 104,105.According to described formation, can shorten the distance of 101 of the semiconductor element that is installed on the glass-epoxy substrate 104 and solid electrolytic capacitors more, the ESL value that is subjected to the length of arrangement wire influence is reduced.
Sum up above content, summarize the feature of this first execution mode, as described below.
Employed solid electrolytic capacitor element 101 can be utilized preceding form (B size: the L3.5 * W2.8mm D size: L7.3 * W4.3mm etc.) of the resin-encapsulated with jumbo solid aluminum electrolytic capacitors such as 10 μ F of volume production in the present embodiment.Therefore, can easily obtain to be in molded before the solid aluminum electrolytic capacitor of state of (before the resin-encapsulated), can be reduced to the worker ordinal number of solid electrolytic capacitor till built-in significantly.And, by the solid aluminum electrolytic capacitor of built-in molded preceding state, the thickness of capacitor-embedded layer can be reduced to the rank below the 300 μ m.
And then, according to this structure, because generate insulating oxide successively by rete, dielectric substrate and conductor layer 103 on the two sides of aluminium foil shape metallic substrates 102, thereby form solid electrolytic capacitor 101, so can obtain the capacitive effect that unit are has two layer laminate, thereby jumbo capacitor element that can obtain to expect with very little area.For example, in the power-supply system of the bigger electric current of the system LSI needs of imaging system, just need the above capacity of 1 μ F.According to described specification, the solid electrolytic capacitor 101 of this structure has enough big capacity, can guarantee the capacity expected with small size.
On the other hand, from aspect of performance, because form insulating oxide by rete, dielectric substrate and conductor layer 103 on the two sides of aluminium foil shape metallic substrates 102, thus can be created in the effect that the magnetic field that produces when electric charge is supplied with is cancelled, thus can realize the capacitor element of low ESL.Therefore, by built-in capacitor element in glass-epoxy multilager base plate 155, can connect capacitor and semiconductor flat tip electrode with the shortest wiring.The result is that the required loop area that connects up diminishes, and can reduce radiated interference etc.
And then, form the zone at capacitor and use solid electrolytic capacitor 101, can form big capacity in narrow and small zone thus.
And then, utilization is configured in solid electrolytic capacitor 101 between power/ground, utilize through hole or electroconductive resin material that paper tinsel shape metallic substrates is connected with the power electrode of multiwiring board, thus, the wiring that does not change the insert layer that only has the function that connects up again can design.
In other words,, can utilize the identical number of plies of the conventional insert layer that only has the function that connects up again, pin to arrange and built-in capacitor about semiconductor packages, and can be with the motherboard that routine is used general and carry out functional evaluation.This is very important for the capacitor-embedded insert layer of new introducing.
And then, because can be with other large value capacitor including components therein of μ F level in substrate, so compare with the insert layer substrate that only has the function that connects up again, can have both the effect and the anti-interference capacitor device function of the further interference reduction of the semiconductor element that is mounted fully.Therefore, can cut down the part number of electronic equipment.
(second execution mode)
Below, to Fig. 9 D second execution mode of the present invention is described with reference to Fig. 4.
In the present embodiment, for the purpose of simplifying the description, the content identical with the content that illustrated in described first execution mode omitted explanation.
Fig. 4, Fig. 5 are the profiles of the multilager base plate in second execution mode of the present invention.Fig. 6 A, Fig. 6 B, Fig. 7 A, Fig. 7 B are the figure of the joint construction of the method for the built-in solid electrolytic capacitor of explanation and power electrode, grounding electrode and the solid electrolytic capacitor that connects the glass/epoxy substrate.
Solid electrolytic capacitor 117 in the present embodiment is different with the solid electrolytic capacitor 101 in first execution mode.As Fig. 4, shown in Figure 5, solid electrolytic capacitor 117 only generates insulating oxide successively and is formed by rete, dielectric substrate and conductor layer on the one side of paper tinsel shape metallic substrates.
Shown in Fig. 6 A, Fig. 6 B, Fig. 7 A, Fig. 7 B, the structure that electrode separates up and down can directly effectively utilize and the conventional identical number of plies, electrode structure and the wiring pattern of the insert layer that only has the function that connects up again.That is, electrode part 120 is connected with the power electrode 106 of insert layer substrate, and described electrode part 120 is to carrying out Ni as the part of the aluminium foil of the anode-side of solid electrolytic capacitor 117 or aluminium or the Cu plating obtains.Conductor layer 122 as the grounding electrode side of capacitor 117 is connected with the grounding electrode 107 of insert layer substrate.The method of attachment of each electrode is identical with first execution mode, has two kinds, is respectively: utilize the composite plate 100 filled inner via hole slurry 111 and the method that connects or utilize electroconductive resin slurry 115 and the method that connects.
The feature of present embodiment is because use the solid electrolytic capacitor 117 that only forms dielectric layer 121 in one side, so compare with the solid electrolytic capacitor 101 that forms dielectric layer on the two sides, can form the thickness thinner than capacitor shown in Figure 1.According to this formation, the thickness that can make capacitor itself is below the 100 μ m, and also can make capacitor-embedded layer 123 thickness own is below the 200 μ m.
Structure shown in Figure 4 uses to be built-in with the originally semiconductor packages of the insert layer of the capacitor of second execution mode.Also shown in Fig. 6 A, 6B and Fig. 7 A, 7B, because holding wire 114 can easily avoid running through dielectric layer 121, so even use this structure also can keep the quality of holding wire and connect up.Therefore, capacitor 117 is configured near the semiconductor element 116, the required loop area of wiring is diminished, reduce interference such as radiated interference.
In addition, at the operating rate that in the future makes system LSI high speed more, as shown in Figure 5, semiconductor element 124 preferably carries out flip-chip and installs.Because projection 125 makes that distance can shorten the cloth line length significantly between semiconductor element and electrode of substrate below 50 μ m.Also can be corresponding to the clock more than the 500MHz.That is, can get rid of the ESL composition that causes by the lead in the terminal conjunction method installation.
The situation of described installation form, insertion substrate of the present invention (multilager base plate) is also effective, by at bus plane, the built-in solid electrolytic capacitor 117 of grounding electrode interlayer, can supply with the low little capacitor of ESL to high-speed semiconductor element 124.Utilize described structure, even, stable power voltage can be supplied to semiconductor element for more than the 1GHz and the semiconductor element that drives also can be supplied with electric charge sufficiently.
In a word, because with other large value capacitor including components therein of μ F level in substrate, so compare with the insert layer substrate that only has the function that connects up again, the supply voltage that can obtain the semiconductor element installed stable (this two aspect, outside of semi-conductive inside and motherboard etc. stable), disturb lower effect.Because can roughly have both all, can cut down the part number of electronic equipment as anti-interference capacitor device function.For example, under the situation of the picture system of Digital Television, usually, in order to make the system LSI operate as normal of image engine, dispose nearly 50 capacitors at mainboard, if but used capacitor-embedded semiconductor packages of the present invention, promptly semiconductor device then could be reduced to the capacitor that is installed on mainboard about 5 below 1/10 significantly.As the concrete purposes of capacitor-embedded semiconductor packages of the present invention, in various modules (for example, GPS module, camera module etc.), portable electric appts, be applicable to that erection space has the mobile phone of strict restriction.Certainly, also go for other portable electric appts (for example, PDA, digital camera etc.).
More than, utilize suitable execution mode that the present invention has been described, but described record and non-limiting item are certainly done various changes.For example, can be suitable for the formation and the Change Example of each execution mode mutually.
Secondly, each layer wiring pattern of 4 layers of insert layer substrate be described.
From Fig. 8 A to Fig. 8 D is conventional various each layer wiring diagram cases that only have the insert layer substrate of the function that connects up again.Fig. 8 A, Fig. 8 B, Fig. 8 C, Fig. 8 D correspond respectively to ground floor (top layer), the second layer, the 3rd layer, the 4th layer (orlop).About Fig. 8 A, Fig. 8 B, follow terminal conjunction method that many wirings are again arranged, the record of Bu Xian a part is omitted again.Ground floor shown in Fig. 8 A be with from the information of all flat tip electrodes of semiconductor element 109, semiconductor element 116 by the layer that lead connects, comprise all holding wires, power line and earth connection.Shown in Fig. 8 A, under semiconductor element, centralized configuration first power supply terminal 202, second source terminal 204 and grounding electrode 203.The electrode 201 of holding wire mainly is formed on peripheral part.And the second layer shown in Fig. 8 B is a ground electrode layer.This layer forms with grounding electrode 205 basically, avoids the mode of grounding electrode 205 and connects with power line, holding wire.And the 3rd layer shown in Fig. 8 C is bus plane.This layer, has an independent existence respectively in the separate areas utilizing border 209 with two power electrodes 208, power electrode 206 and form.In the described layer, avoid the mode of power electrode 208, power electrode 206 and connect with grounding electrode, holding wire.And the 4th layer shown in Fig. 8 D constitutes with the flat tip electrode that is installed on motherboard, comprises all holding wires, power line and earth connection.The configuration of each solder joint and ground floor roughly the same.
On the other hand, in the multi-layer wire substrate of the present invention, Fig. 9 A represents the wiring pattern of built-in solid electrolytic capacitor 101a, solid electrolytic capacitor 101b to Fig. 9 D., can change wiring pattern hardly and can design the insert layer substrate of built-in two large value capacitors to shown in Fig. 9 D as Fig. 9 A.Shown in Fig. 9 B, Fig. 9 C, solid electrolytic capacitor 101a, solid electrolytic capacitor 101b are configured on the electrode pattern.The 310a of anode electrode portion of each solid electrolytic capacitor, the 310b of anode electrode portion, negative pole part 313 form in the mode that is positioned at each power-supply system electrode zone 208.
Shown in Fig. 9 C, in the anode portion of aluminium electrolytic capacitor, in the zone that the part 310a that is connected with the power electrode of substrate, 310b are formed on each power electrode.
What should be careful is that part is not a power electrode under 311a, the 311b of the formation grounding electrode in forming solid electrolytic capacitor 101a, solid electrolytic capacitor 101b, and must be replaced into grounding electrode.
Because Fig. 9 D represents the shape configuration of built-in SPC element, so through hole electrode 312 is connected in anode by through hole.Negative pole part 313 is smeared silver paste and is formed.
So, the layout of the insert layer substrate of the solid aluminum electrolytic capacitor shown in built-in Fig. 2 A, Fig. 2 B,, can change the wiring pattern of glass-epoxy multilager base plate 155 hardly and be devised to shown in Fig. 9 D as Fig. 9 A with the function that connects up again.
In fact, the semiconductor packages of the insert layer of using this solid electrolytic capacitor 101a, solid electrolytic capacitor 101b built-in is installed to mainboard, after estimating power supply and disturbing, the power supply that affirmation can reduce significantly from the low frequency to the high frequency disturbs.The result is, confirms also to have reduced 10dB or more than the 10dB from the radiated interference that mainboard sends.And then, can confirm that the change of semi-conductive supply voltage also reduces.
According to the present invention, have low ESL function, and can avoid holding wire to connect the capacitor layers of solid electrolytic capacitor, and can be corresponding to multi-power system.And then, the paper tinsel shape metallic substrates of solid electrolytic capacitor has the structure that utilizes through hole or electroconductive resin material to be connected with the power electrode of multiwiring board, can change the wiring of the insert layer that only has the function that connects up again hardly thus and realizes the design of capacitor arrangements between power/ground.And then, because can be with other large value capacitor including components therein of μ F level in substrate, so, effect and anti-interference capacitor device function that the further interference of the semiconductor element that is mounted reduces can almost completely be had both, therefore, can significantly cut down the part number of electronic equipment.
[utilizability on the industry]
According to the present invention, can design easily, make and provide multilager base plate, described multilager base plate is at the bus plane of insert layer substrate, the built-in large value capacitor that is made of solid electrolytic capacitor of interlayer of ground plane.

Claims (12)

1. a multi-layer wire substrate is characterized in that, comprising:
A plurality of wiring plates comprise a plurality of wiring layers with ground plane and bus plane,
Solid electrolytic capacitor, it is constituted by rete, dielectric substrate and conductor layer by form insulating oxide successively on the one or both sides of paper tinsel shape metallic substrates;
Electroconductive component runs through the thickness direction of described wiring plate; And
At the electroplated film that is difficult to oxidation of the surface portion setting of described metallic substrates,
Described solid electrolytic capacitor disposes in the mode that is clipped between described a plurality of wiring plate,
Described conductor layer is connected with the grounding electrode that is formed on described ground plane,
Described electroplated film is connected with the power electrode that is formed on described bus plane via described electroconductive component.
2. multi-layer wire substrate according to claim 1 is characterized in that, forms described conductor layer thereby grounding pattern is set on the part of described bus plane.
3. multi-layer wire substrate according to claim 1 is characterized in that, a plurality of solid electrolytic capacitors are built between described a plurality of wiring plate.
4. multi-layer wire substrate according to claim 1 and 2 is characterized in that, in described a plurality of wiring layers, is to be formed by the composite material that the material that comprises resin and inorganic filler constitutes burying underground between the wiring layer of described solid electrolytic capacitor.
5. multi-layer wire substrate according to claim 1 is characterized in that,
Also possess the composite plate of having buried a plurality of described solid electrolytic capacitors underground,
Described composite plate has:
The conductive hole slurry that connects described grounding electrode and described solid electrolytic capacitor; And
Other conductive hole slurries that connect described power electrode and described solid electrolytic capacitor.
6. the manufacture method of a multi-layer wire substrate, described multi-layer wire substrate carries out lamination to a plurality of wiring plates that comprise wiring plate that forms ground plane and the wiring plate that forms bus plane and forms, it is characterized in that the manufacture method of described multi-layer wire substrate has following steps:
Interlayer at described a plurality of wiring plates, by on the one or both sides of paper tinsel shape metallic substrates, generating insulating oxide successively by rete, dielectric substrate and conductor layer, and the electroplated film in that the surface portion setting of described metallic substrates is difficult to oxidation forms solid electrolytic capacitor with this
Secondly, composite plate is configured in the upper surface and the lower surface of described solid electrolytic capacitor, described composite plate is by inorganic filler and thermosetting resin and constitute and filled the conductive hole slurry in the precalculated position, described solid electrolytic capacitor around dispose built-in with composite plate after, carry out heating and melting
Make the described composite plate of fusion and described built-in with after the composite plate sclerosis,
Carry out through hole plating, its perforation comprises described solid electrolytic capacitor and all layers of the described multi-layer wire substrate of lamination,
And described through hole plating is connected the described electroplated film of described solid electrolytic capacitor with the power electrode that is formed on described bus plane.
7. the manufacture method of a multi-layer wire substrate, described multi-layer wire substrate carries out lamination to a plurality of wiring plates that comprise wiring plate that forms ground plane and the wiring plate that forms bus plane and forms, it is characterized in that the manufacture method of described multi-layer wire substrate has following steps:
Interlayer at described a plurality of wiring plates, by on the one or both sides of paper tinsel shape metallic substrates, generating insulating oxide successively by rete, dielectric substrate and conductor layer, and the electroplated film in that the surface portion setting of described metallic substrates is difficult to oxidation forms solid electrolytic capacitor with this
On the described electroplated film of described solid electrolytic capacitor, smear the electroconductive resin slurry,
Described wiring plate relative with described solid electrolytic capacitor to the zone form insulating resin,
With built-in with composite plate be configured in described solid electrolytic capacitor around after, carry out heating and melting,
Make after the described composite plate sclerosis of fusion, carry out through hole plating, its perforation comprises described solid electrolytic capacitor and all layers of the described multi-layer wire substrate of lamination.
8. a semiconductor packages is characterized in that, comprising:
The described multi-layer wire substrate of claim 1; And
Be equipped on the semiconductor element on the described multi-layer wire substrate.
9. semiconductor packages according to claim 8 is characterized in that, also possesses grounding pattern, this grounding pattern on the part of described bus plane, be provided with and with described conductor layer conducting.
10. semiconductor packages according to claim 8 is characterized in that, also possesses the lead-in wire that described semiconductor element is connected in described multi-layer wire substrate.
11. semiconductor packages according to claim 8 is characterized in that, also possesses the holding wire of the thickness direction that runs through described multi-layer wire substrate, described holding wire is located at the outside in the zone that forms described solid electrolytic capacitor.
12. an electronic equipment is characterized in that, uses each described semiconductor packages of claim 8～11.
CN2006800003696A 2005-02-03 2006-02-01 Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device and electronic device using multilayer wiring board Expired - Fee Related CN1977574B (en)

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JP027569/2005 2005-02-03
JP2005027569A JP4736451B2 (en) 2005-02-03 2005-02-03 MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE USING MULTILAYER WIRING BOARD
PCT/JP2006/301640 WO2006082838A1 (en) 2005-02-03 2006-02-01 Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device and electronic device using multilayer wiring board

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JP4736451B2 (en) 2011-07-27
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GB2437465B (en) 2010-11-17

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