CN1959948A - Chip capsulation structure, and fabricating method - Google Patents
Chip capsulation structure, and fabricating method Download PDFInfo
- Publication number
- CN1959948A CN1959948A CN 200510118870 CN200510118870A CN1959948A CN 1959948 A CN1959948 A CN 1959948A CN 200510118870 CN200510118870 CN 200510118870 CN 200510118870 A CN200510118870 A CN 200510118870A CN 1959948 A CN1959948 A CN 1959948A
- Authority
- CN
- China
- Prior art keywords
- chip
- packaging structure
- insulating barrier
- manufacture method
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (30)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200510118870XA CN100437958C (en) | 2005-11-03 | 2005-11-03 | Chip capsulation structure, and fabricating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200510118870XA CN100437958C (en) | 2005-11-03 | 2005-11-03 | Chip capsulation structure, and fabricating method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1959948A true CN1959948A (en) | 2007-05-09 |
CN100437958C CN100437958C (en) | 2008-11-26 |
Family
ID=38071551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200510118870XA Expired - Fee Related CN100437958C (en) | 2005-11-03 | 2005-11-03 | Chip capsulation structure, and fabricating method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100437958C (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103787258A (en) * | 2012-10-26 | 2014-05-14 | 罗伯特·博世有限公司 | Micromechanical component having a bond joint |
CN107342233A (en) * | 2017-06-29 | 2017-11-10 | 江苏长电科技股份有限公司 | Low loss component flush type antenna packages structure and its manufacture method |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5977640A (en) * | 1998-06-26 | 1999-11-02 | International Business Machines Corporation | Highly integrated chip-on-chip packaging |
US6281046B1 (en) * | 2000-04-25 | 2001-08-28 | Atmel Corporation | Method of forming an integrated circuit package at a wafer level |
TWI256719B (en) * | 2002-03-06 | 2006-06-11 | Via Tech Inc | Semiconductor device package module and manufacturing method thereof |
CN2613046Y (en) * | 2003-04-17 | 2004-04-21 | 威盛电子股份有限公司 | Chip packaging structure |
CN2672856Y (en) * | 2003-06-17 | 2005-01-19 | 威盛电子股份有限公司 | Chip package structure |
CN1641862A (en) * | 2004-01-17 | 2005-07-20 | 泰特科技股份有限公司 | Chip packaging structure |
-
2005
- 2005-11-03 CN CNB200510118870XA patent/CN100437958C/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103787258A (en) * | 2012-10-26 | 2014-05-14 | 罗伯特·博世有限公司 | Micromechanical component having a bond joint |
CN103787258B (en) * | 2012-10-26 | 2017-03-01 | 罗伯特·博世有限公司 | There is the micro mechanical device that bonding connects |
CN107342233A (en) * | 2017-06-29 | 2017-11-10 | 江苏长电科技股份有限公司 | Low loss component flush type antenna packages structure and its manufacture method |
Also Published As
Publication number | Publication date |
---|---|
CN100437958C (en) | 2008-11-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: GUANGHAI SCIENCE + TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: TAIWAN SOLUTIONS SYSTEMS CORP. Effective date: 20110506 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 1/F, NO. 15, LANE 6, JINSHAN 6TH STREET, HSINCHU CITY, TAIWAN, CHINA TO: 2/F, NO. 98, LANE 879, GUANGFU ROAD, BADE CITY, TAOYUAN COUNTY, TAIWAN, CHINA |
|
TR01 | Transfer of patent right |
Effective date of registration: 20110506 Address after: China Taiwan Taoyuan bade Guangfu Road 879 Lane 98 Building No. 2 Patentee after: Light Ocean Technology Corp. Address before: Chinese Taiwan Hsinchu Jinshan Street 6 Lane 15 Building No. 1 Patentee before: China Taiwan should understand the Limited by Share Ltd |
|
ASS | Succession or assignment of patent right |
Owner name: GUANGHAI SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20140815 Owner name: RONGRUIXIN OPTOELECTRONIC TECHNOLOGY (SHANGHAI) CO Free format text: FORMER OWNER: GUANGHAI SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20140815 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIWAN, CHINA TO: 201300 PUDONG NEW AREA, SHANGHAI |
|
TR01 | Transfer of patent right |
Effective date of registration: 20140815 Address after: 201300, Shanghai, Pudong New Area Huang Highway No. 2300, No. 1, building 1 Patentee after: Rong rockchips photoelectric technology (Shanghai) Co., Ltd. Patentee after: Light Ocean Technology Corp. Address before: China Taiwan Taoyuan bade Guangfu Road 879 Lane 98 Building No. 2 Patentee before: Light Ocean Technology Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081126 Termination date: 20141103 |
|
EXPY | Termination of patent right or utility model |