CN1946266B - 印刷电路板的制造方法 - Google Patents

印刷电路板的制造方法 Download PDF

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Publication number
CN1946266B
CN1946266B CN2006101421338A CN200610142133A CN1946266B CN 1946266 B CN1946266 B CN 1946266B CN 2006101421338 A CN2006101421338 A CN 2006101421338A CN 200610142133 A CN200610142133 A CN 200610142133A CN 1946266 B CN1946266 B CN 1946266B
Authority
CN
China
Prior art keywords
copper
circuit board
printed circuit
pcb
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006101421338A
Other languages
English (en)
Chinese (zh)
Other versions
CN1946266A (zh
Inventor
市桥知子
中岛庆一
栗井良浩
中村幸子
池尻笃泰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEC CORP
MEC Co Ltd
Original Assignee
MEC CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEC CORP filed Critical MEC CORP
Publication of CN1946266A publication Critical patent/CN1946266A/zh
Application granted granted Critical
Publication of CN1946266B publication Critical patent/CN1946266B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • ing And Chemical Polishing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN2006101421338A 2005-10-06 2006-10-08 印刷电路板的制造方法 Expired - Fee Related CN1946266B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005293960 2005-10-06
JP293960/2005 2005-10-06

Publications (2)

Publication Number Publication Date
CN1946266A CN1946266A (zh) 2007-04-11
CN1946266B true CN1946266B (zh) 2010-05-12

Family

ID=38045413

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006101421338A Expired - Fee Related CN1946266B (zh) 2005-10-06 2006-10-08 印刷电路板的制造方法

Country Status (3)

Country Link
KR (1) KR20070038882A (ko)
CN (1) CN1946266B (ko)
TW (1) TW200715928A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101829850A (zh) * 2010-04-01 2010-09-15 深圳市大族激光科技股份有限公司 盲孔加工方法
EP2744310A4 (en) * 2011-08-11 2015-06-17 Furukawa Electric Co Ltd WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE
KR101519314B1 (ko) * 2013-10-18 2015-05-11 미쓰비시덴키 가부시키가이샤 가공 테이블용 지그, 가공 테이블용 지그의 제조 방법 및 레이저 가공 방법
CN105263266A (zh) * 2015-10-30 2016-01-20 江苏博敏电子有限公司 一种镭射盲钻加工方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1344483A (zh) * 1999-03-16 2002-04-10 西门子公司 在双侧设有金属层的电绝缘基板材料上引入接触孔的方法
CN1674766A (zh) * 2004-03-24 2005-09-28 深圳市大族激光科技股份有限公司 二氧化碳激光钻孔方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1344483A (zh) * 1999-03-16 2002-04-10 西门子公司 在双侧设有金属层的电绝缘基板材料上引入接触孔的方法
CN1674766A (zh) * 2004-03-24 2005-09-28 深圳市大族激光科技股份有限公司 二氧化碳激光钻孔方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2004-339531A 2004.12.02

Also Published As

Publication number Publication date
TW200715928A (en) 2007-04-16
KR20070038882A (ko) 2007-04-11
CN1946266A (zh) 2007-04-11

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100512

Termination date: 20121008