TW200715928A - Method for manufacturing a printed wiring board - Google Patents

Method for manufacturing a printed wiring board

Info

Publication number
TW200715928A
TW200715928A TW095135488A TW95135488A TW200715928A TW 200715928 A TW200715928 A TW 200715928A TW 095135488 A TW095135488 A TW 095135488A TW 95135488 A TW95135488 A TW 95135488A TW 200715928 A TW200715928 A TW 200715928A
Authority
TW
Taiwan
Prior art keywords
printed wiring
wiring board
layer
manufacturing
copper foil
Prior art date
Application number
TW095135488A
Other languages
English (en)
Inventor
Tomoko Ichihashi
Keiichi Nakajima
Yoshihiro Kurii
Sachiko Nakamura
Shigehiro Ikejiri
Original Assignee
Mec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mec Co Ltd filed Critical Mec Co Ltd
Publication of TW200715928A publication Critical patent/TW200715928A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • ing And Chemical Polishing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW095135488A 2005-10-06 2006-09-26 Method for manufacturing a printed wiring board TW200715928A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005293960 2005-10-06

Publications (1)

Publication Number Publication Date
TW200715928A true TW200715928A (en) 2007-04-16

Family

ID=38045413

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095135488A TW200715928A (en) 2005-10-06 2006-09-26 Method for manufacturing a printed wiring board

Country Status (3)

Country Link
KR (1) KR20070038882A (zh)
CN (1) CN1946266B (zh)
TW (1) TW200715928A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI562690B (zh) * 2011-08-11 2016-12-11 Furukawa Electric Co Ltd

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101829850A (zh) * 2010-04-01 2010-09-15 深圳市大族激光科技股份有限公司 盲孔加工方法
KR101519314B1 (ko) * 2013-10-18 2015-05-11 미쓰비시덴키 가부시키가이샤 가공 테이블용 지그, 가공 테이블용 지그의 제조 방법 및 레이저 가공 방법
CN105263266A (zh) * 2015-10-30 2016-01-20 江苏博敏电子有限公司 一种镭射盲钻加工方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000056129A1 (de) * 1999-03-16 2000-09-21 Siemens Aktiengesellschaft Verfahren zum einbringen von durchkontaktierungslöchern in ein beidseitig mit metallschichten versehenes, elektrisch isolierendes basismaterial
CN1674766A (zh) * 2004-03-24 2005-09-28 深圳市大族激光科技股份有限公司 二氧化碳激光钻孔方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI562690B (zh) * 2011-08-11 2016-12-11 Furukawa Electric Co Ltd

Also Published As

Publication number Publication date
CN1946266B (zh) 2010-05-12
CN1946266A (zh) 2007-04-11
KR20070038882A (ko) 2007-04-11

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