CN1928605A - 数码相机模组 - Google Patents

数码相机模组 Download PDF

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CN1928605A
CN1928605A CNA2005100372274A CN200510037227A CN1928605A CN 1928605 A CN1928605 A CN 1928605A CN A2005100372274 A CNA2005100372274 A CN A2005100372274A CN 200510037227 A CN200510037227 A CN 200510037227A CN 1928605 A CN1928605 A CN 1928605A
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camera mould
numerical camera
image sensing
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lens barrel
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CN100561282C (zh
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魏史文
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Yangxin Technology Co ltd
Hongfujin Precision Industry Shenzhen Co Ltd
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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Abstract

本发明是关于一种数码相机模组，包括：一镜筒，一影像感测模组，一连接部及一电路板，该镜筒一侧设有卡合部；该影像感测模组与镜筒相对固定；该影像感测模组包括：一载具及一影像感测芯片，该载具内设有导电线路，导电线路在载具外侧形成内焊垫区及外焊垫区；该影像感测芯片的中心具一感测区及周边具有芯片焊垫区，该影像感测芯片置于载具内；该若干引线连接载具的内焊垫区及影像感测芯片的芯片焊垫区；该连接部配合于镜筒的卡合部内，其一端与影像感测模组的外焊垫区电连接，另一端与该电路板电连接。

Description

数码相机模组
【技术领域】
本发明是关于一种数码相机模组。
【背景技术】
目前，携带式电子装置向着多功能的趋势发展，具有照相功能的携带式电子装置一经推出即倍受欢迎。应用在携带式电子装置的数码相机模组需要将影像传感器的信号传递给携带式电子装置的印刷电路板，以便于实现系统控制与处理。
现有应用在携带式电子装置的数码相机模组，是通过表面焊接技术(SMT，Surface Mounted Technology)或热压粘着技术，直接固定在携带式电子装置的印刷电路板，然而携带式电子装置厂商购买该数码相机模组后，需自己采用上述工艺安装数码相机模组在携带式电子装置内，不利于快速安装，此外，制程的增加，也增加了制造成本，不能满足客户的需要。另一现有应用在携带式电子装置的数码相机模组是将该数码相机模组电性粘接于软性电路板后，再通过软性电路板与携带式电子装置相连，其结构请参见图1。该数码相机模组50包括镜座51，镜座51内设有镜筒52，该镜筒52内设置有若干镜片。该镜座51底部与影像感测模组60相连。该影像感测模组60底部的焊垫区62与软性电路板70一端电连接，该软性电路板70上布设电路，以传递影像信号给该软性电路板70另一端上的电连接器80，该电连接器80可与携带式电子装置的印刷电路板上的对应电连接器插接，以便将影像感测模组50的影像信号进一步传输至外界。
该数码相机模组50的软性电路板70因具有柔性，可满足旋转及缠绕的要求，从而不受携带式电子装置内部的空间限制，然而，该数码相机模组封装后，其与软性电路板固定连接，在数码相机模组良率降低时，软性电路板也相应被淘汰，极大增加生产成本。
【发明内容】
鉴于以上缺点，有必要提供一种有效降低成本的数码相机模组。
一种数码相机模组，包括：一镜筒，一影像感测模组，一连接部及一电路板，该镜筒一侧设有卡合部；该影像感测模组，与镜筒相对固定；该影像感测模组包括：一载具及一影像感测芯片，该载具内设有导电线路，导电线路在载具外侧形成内焊垫区及外焊垫区，该外焊垫区相邻于该卡合部；该影像感测芯片的中心具一感测区及周边具有芯片焊垫区，该影像感测芯片置于载具内；该若干引线连接载具的内焊垫区及影像感测芯片的芯片焊垫区；该连接部配合于镜筒的卡合部内，其一端与影像感测模组的外焊垫区电连接，另一端与该电路板电连接。
相较现有技术，所述数码相机模组，通过卡合结构，将软性电路板卡于数码相机模组上，避免了因数码相机模组的良率而影响软性电路板，降低了制造成本。
【附图说明】
图1是现有的数码相机模组示意图；
图2是本发明数码相机模组较佳实施例示意图。
【具体实施方式】
请参阅图2，本发明数码相机模组较佳实施例包括：一镜筒10、一镜座20、一影像感测模组30及一电路板40。该影像感测模组30包括一载具32、一影像感测芯片34、若干引线36及透光板38。
镜筒10为中空圆筒状，其内设置有若干镜片12，其外圆周设置外螺纹102。镜筒10一端设有盖板14，该盖板14为一平板玻璃，即可使光线通过，也可阻挡灰尘等杂质进入而污染镜片12。
镜座20为中空圆台状，该镜座20包括一容置部202及一凸缘部204。该容置部202为一圆柱体，该凸缘部204为一长方体，一开孔2020贯穿于容置部202且其部分延伸至凸缘部204。该凸缘部204包括一底部2040，在该底部2040侧的凸缘部204上一端开有一矩形开槽2042，其与开孔2020相贯通。容置部202的外径小于凸缘部204的边长，而在两者相接处形成台阶，而镜座20的凸缘部204的矩形开槽2042边长大于开孔2020的直径。容置部202的开孔2020周壁上设有内螺纹203，其与镜筒10的外螺纹102配合。该镜座20的凸缘部204侧边开有二平行凹槽22，该二凹槽22间隔一定距离，其中邻近镜座20底部2040的凹槽22与镜座20底部2040相贯通。
该凹槽22内埋设有若干弹簧夹24，该弹簧夹24具有弹性，大致呈C型，其两端均埋嵌在凸缘部204内，而其中间部分分别突伸入二凹槽22内。该弹簧夹24是在镜座20模造成型时，与其一体嵌入成型。位于镜座20底部2040的凹槽22内的弹簧夹24一端与影像感测模组30电性连接。
影像感测模组30的载具32位于镜座20的下面，是主要用于承载影像感测芯片34。该载具32包括一本体324及设置在其内的导电线路322。
该本体324为一长方体，其中部具一矩形空腔3240，该本体324外缘具一顶面3241，该顶面3241与镜座20的凸缘部204的底部2040相贴合。该本体324内部包覆导电线路322，该导电线路322由间隔排列的若干导线组成，其两端均留有未被本体324覆盖的部分，其中一端位于空腔3240内，形成对应的内焊垫区326；导电线路322另一端从本体324的顶面3241一侧露出，从而形成对应的外焊垫区328。该外焊垫区328同时位于镜座20的凹槽22内，并与弹簧夹24抵接以形成导电回路。
该影像感测芯片34通过粘胶固定在载具32的空腔3240底部，且其顶面具有一感测区344，该感测区344周边布设有芯片焊垫区342。
该若干引线36是由金等导电性佳的材料制成，其一端与影像感测芯片34的芯片焊垫区342电连接，另一端则与载具32的内焊垫区326电连接。内焊垫区326通过导电线路322将影像感测芯片34的信号传递给外焊垫区328。
透光板38为一透光玻璃，其盖覆在载具32的上面。
该电路板40为一软性电路板，其上布设有若干导线，该导线一端与其上的电连接器42相连，另一端设有导电端子。电路板40可插于该凹槽22内，而使该电路板40上的导电端子与凹槽22内的弹簧夹24对应电性连接。
封装时，先将布线好的导电线路322通过塑料注塑于一体，塑料凝固后，塑料体324包覆于导电线路322上，形成载具32。该载具32上对应显露有内焊区326及外焊垫区328。将影像感测芯片34通过粘胶粘覆于载具32内，再通过引线36连接影像感测芯片34的芯片焊垫区342及载具32上的内焊垫区326，以便将影像感测芯片34的电信号通过载具32的导电线路322传递到外焊垫区328。
将若干弹簧夹24设于模腔内，通过注塑成型形成具有二平行凹槽22的镜座20，其中若干弹簧夹24间隔平行排列且二端置于凹槽22内；之后镜座20通过粘胶固定在影像感测模组30上，同时使弹簧夹24与载具32的外焊垫区328电性连接。将镜筒10与镜座20螺纹配合，对焦时，微调镜筒10与影像感测芯片34之间距使所述数码相机模组处于一最佳影像摄取状态，最后通过点胶将镜筒10固定在镜座20上，由此形成一数码相机模组。
最后，将软性电路板40插入远离底部2040的凹槽22内，使该软性电路板40与弹簧夹24电连接，因弹簧夹24的弹性作用，从而可使软性电路板40卡于镜筒10上，防止软性电路板40在外力作用下，与镜筒10相脱离。
可以理解，弹簧夹可直接卡在凹槽内，而形成可拆分连接。
可以理解，可不限于弹簧夹结构，可不限于任何形状，只要可形成电连接的连接部即可。
可以理解，可不限于凹槽形式的卡合部结构，如可于镜座20上设置卡钩，该卡钩可固定该软性电路板40上。
可以理解，该电路板40可不限于软性电路板，其也可为一般的电路板。
可以理解，其可省掉弹簧夹，而将软性电路板直接插于凹槽内，使软性电路板与载具的外焊垫区直接电连接，同时软性电路板与凹槽内具有较大的摩擦，避免软性电路板与镜筒相脱离。
进一步可以理解，该软性电路板上的一端也可设有弹性卡钩，在软性电路板卡于镜筒的凹槽内时，通过该弹性卡钩卡在该数码相机模组的镜筒内。

Claims (14)

1.一种数码相机模组，其包括：一镜筒及一影像感测模组，该影像感测模组与该镜筒相对固定；该影像感测模组包括：一载具、一影像感测芯片及若干引线，该载具内设有导电线路，该导电线路在载具外侧形成内焊垫区，该影像感测芯片具一感测区及其周围具有芯片焊垫区，该影像感测芯片置于载具内；该若干引线连接载具的内焊垫区及影像感测芯片的芯片焊垫区，其特征在于：该数码相机模组进一步包括一连接部及一电路板，该镜筒一侧设有卡合部；该导电线路在载具外侧形成外焊垫区，该外焊垫区相邻于该卡合部；该连接部设在该卡合部内，其一端与载具的外焊垫区电性连接，另一端与该电路板电性连接。
2.如权利要求1所述的数码相机模组，其特征在于：该连接部为若干弹簧夹，该卡合部为二凹槽，该弹簧夹两端卡于镜筒之凹槽内。
3.如权利要求1所述的数码相机模组，其特征在于：该载具进一步包括塑料本体，其将导电通路部分包覆于塑料本体内。
4.如权利要求1所述的数码相机模组，其特征在于：该导电线路由若干导线组成。
5.如权利要求1所述的数码相机模组，其特征在于：该影像感测模组进一步包括一透光板，该透光板盖在该载具上，该透光板为一透光玻璃。
6.如权利要求1所述的数码相机模组，其特征在于：该数码相机模组的镜筒内设有若干镜片，该数码相机模组的镜筒一端设有盖板。
7.如权利要求1所述的数码相机模组，其特征在于：该数码相机模组进一步包括一镜座，该镜筒与该镜座螺纹连接。
8.如权利要求7所述的数码相机模组，其特征在于：该镜座包括一容置部及一凸缘部，该容置部容置该镜筒，该凸缘部与该影像感测模组相对固定。
9.如权利要求8所述的数码相机模组，其特征在于：该镜座的容置部为中空圆柱体，该凸缘部为一长方体。
10.如权利要求9所述的数码相机模组，其特征在于：该镜座的凸缘部侧边开有该卡合部，该卡合部为二平行凹槽。
11.如权利要求10所述的数码相机模组，其特征在于：该二凹槽之一与镜座的底部相贯通。
12.如权利要求11所述的数码相机模组，其特征在于：该连接部为一弹簧夹，该弹簧夹埋设在凹槽内。
13.如权利要求12所述的数码相机模组，其特征在于：该弹簧夹具有弹性，大致呈C型。
14.如权利要求1所述的数码相机模组，其特征在于：该电路板为一软性电路板，该软性电路板上布设有若干导线。
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100545689C (zh) * 2007-04-10 2009-09-30 鸿富锦精密工业（深圳）有限公司 相机模组
CN101814480A (zh) * 2010-04-16 2010-08-25 杭州矽力杰半导体技术有限公司 一种芯片封装结构及其封装方法
CN101465344B (zh) * 2007-12-18 2011-02-02 鸿富锦精密工业（深圳）有限公司 影像模组封装结构
CN112600993A (zh) * 2020-05-13 2021-04-02 立景创新有限公司 影像采集模块及其组装方法
WO2021258302A1 (zh) * 2020-06-23 2021-12-30 宏启胜精密电子(秦皇岛)有限公司 镜头模组及其制作方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7498646B2 (en) * 2006-07-19 2009-03-03 Advanced Chip Engineering Technology Inc. Structure of image sensor module and a method for manufacturing of wafer level package
CN101261347A (zh) * 2007-03-09 2008-09-10 鸿富锦精密工业（深圳）有限公司 相机模组及其制造方法
CN101359080B (zh) * 2007-08-01 2011-02-02 鸿富锦精密工业（深圳）有限公司 相机模组
JP4413956B2 (ja) * 2007-08-21 2010-02-10 新光電気工業株式会社 カメラモジュール及び携帯端末機
US7966041B2 (en) * 2008-01-30 2011-06-21 Sony Ericsson Mobile Communications Ab Pin mounting of camera module in a radio communication terminal
CN101770059B (zh) * 2008-12-27 2012-06-20 鸿富锦精密工业（深圳）有限公司 相机模组
CN101998035B (zh) * 2009-08-24 2013-07-03 鸿富锦精密工业（深圳）有限公司 相机模组及其组装方法
JP2012015995A (ja) * 2010-05-31 2012-01-19 Fujitsu Component Ltd カメラモジュール及びその製造方法
CN102572229A (zh) * 2010-12-29 2012-07-11 鸿富锦精密工业（深圳）有限公司 摄像模组
TWI429279B (zh) * 2011-08-09 2014-03-01 Hon Hai Prec Ind Co Ltd 鏡頭模組
CN102809797B (zh) * 2011-12-08 2015-01-14 苏州科达科技股份有限公司 一种精确调整监控产品镜头后焦距的机构
US20150103238A1 (en) * 2013-10-11 2015-04-16 Microsoft Corporation Interface Geometry for Camera Mounting
TWI762093B (zh) * 2020-12-18 2022-04-21 海華科技股份有限公司 可攜式電子裝置及其客製化影像擷取模組

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5178362U (zh) * 1974-12-18 1976-06-21
JP2001203913A (ja) * 2000-01-21 2001-07-27 Sony Corp 撮像装置、カメラモジュール及びカメラシステム
US6649834B1 (en) * 2002-12-16 2003-11-18 Kingpak Technology Inc. Injection molded image sensor and a method for manufacturing the same
US6680525B1 (en) * 2003-01-09 2004-01-20 Kingpak Technology Inc. Stacked structure of an image sensor
US20040251510A1 (en) * 2003-06-10 2004-12-16 Irving You Package structure of an image sensor module
US6870208B1 (en) * 2003-09-24 2005-03-22 Kingpak Technology Inc. Image sensor module
CN100561281C (zh) * 2004-03-05 2009-11-18 鸿富锦精密工业（深圳）有限公司 数码相机模块
JP4606063B2 (ja) * 2004-05-14 2011-01-05 パナソニック株式会社 光学デバイスおよびその製造方法
US20050258518A1 (en) * 2004-05-24 2005-11-24 Advanced Semiconductor Engineering Inc. Image sensor package module with a leadless leadframe between chips

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100545689C (zh) * 2007-04-10 2009-09-30 鸿富锦精密工业（深圳）有限公司 相机模组
CN101465344B (zh) * 2007-12-18 2011-02-02 鸿富锦精密工业（深圳）有限公司 影像模组封装结构
CN101814480A (zh) * 2010-04-16 2010-08-25 杭州矽力杰半导体技术有限公司 一种芯片封装结构及其封装方法
CN101814480B (zh) * 2010-04-16 2011-08-31 杭州矽力杰半导体技术有限公司 一种芯片封装结构及其封装方法
CN112600993A (zh) * 2020-05-13 2021-04-02 立景创新有限公司 影像采集模块及其组装方法
WO2021258302A1 (zh) * 2020-06-23 2021-12-30 宏启胜精密电子(秦皇岛)有限公司 镜头模组及其制作方法

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