CN1901153A - 晶片移送装置及其移送方法 - Google Patents

晶片移送装置及其移送方法 Download PDF

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Publication number
CN1901153A
CN1901153A CNA2005101279249A CN200510127924A CN1901153A CN 1901153 A CN1901153 A CN 1901153A CN A2005101279249 A CNA2005101279249 A CN A2005101279249A CN 200510127924 A CN200510127924 A CN 200510127924A CN 1901153 A CN1901153 A CN 1901153A
Authority
CN
China
Prior art keywords
wafer
arm
transducer
detection position
reactor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005101279249A
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English (en)
Chinese (zh)
Inventor
朴英敏
朴鲁正
朴休林
金东哲
南宫同训
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CN1901153A publication Critical patent/CN1901153A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNA2005101279249A 2005-07-23 2005-12-07 晶片移送装置及其移送方法 Pending CN1901153A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050067050 2005-07-23
KR1020050067050A KR100676823B1 (ko) 2005-07-23 2005-07-23 웨이퍼이송장치 및 그 이송방법

Publications (1)

Publication Number Publication Date
CN1901153A true CN1901153A (zh) 2007-01-24

Family

ID=37656980

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005101279249A Pending CN1901153A (zh) 2005-07-23 2005-12-07 晶片移送装置及其移送方法

Country Status (2)

Country Link
KR (1) KR100676823B1 (ko)
CN (1) CN1901153A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102138209A (zh) * 2008-08-28 2011-07-27 细美事有限公司 调节传送构件的速度的方法、使用该方法传送基板的方法以及基板处理设备
CN101855719B (zh) * 2008-02-27 2012-06-06 东京毅力科创株式会社 负载锁定装置和基板冷却方法
CN102138207B (zh) * 2008-08-28 2014-06-11 细美事有限公司 衬底处理装置和在该衬底处理装置中传输衬底的方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9002514B2 (en) * 2007-11-30 2015-04-07 Novellus Systems, Inc. Wafer position correction with a dual, side-by-side wafer transfer robot
KR100980706B1 (ko) * 2008-09-19 2010-09-08 세메스 주식회사 기판 이송 장치, 이를 갖는 기판 처리 장치 및 이의 기판 이송 방법
JP6710518B2 (ja) * 2015-12-03 2020-06-17 東京エレクトロン株式会社 搬送装置及び補正方法
KR102099115B1 (ko) * 2018-06-08 2020-04-10 세메스 주식회사 기판 이송 장치, 이를 포함하는 기판 처리 장치 및 기판 틀어짐 보정 방법
US10796940B2 (en) 2018-11-05 2020-10-06 Lam Research Corporation Enhanced automatic wafer centering system and techniques for same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10326819A (ja) * 1997-05-27 1998-12-08 Toshiba Corp 位置ずれ検出装置と検出方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101855719B (zh) * 2008-02-27 2012-06-06 东京毅力科创株式会社 负载锁定装置和基板冷却方法
CN102138209A (zh) * 2008-08-28 2011-07-27 细美事有限公司 调节传送构件的速度的方法、使用该方法传送基板的方法以及基板处理设备
CN102138209B (zh) * 2008-08-28 2014-01-15 细美事有限公司 调节传送构件的速度的方法、使用该方法传送基板的方法以及基板处理设备
CN102138207B (zh) * 2008-08-28 2014-06-11 细美事有限公司 衬底处理装置和在该衬底处理装置中传输衬底的方法

Also Published As

Publication number Publication date
KR100676823B1 (ko) 2007-02-01
KR20070012577A (ko) 2007-01-26

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