CN1870310A - Method for low temp sintering, packaging and connecting high power LED by nano-silver soldering paste - Google Patents
Method for low temp sintering, packaging and connecting high power LED by nano-silver soldering paste Download PDFInfo
- Publication number
- CN1870310A CN1870310A CNA2006100141575A CN200610014157A CN1870310A CN 1870310 A CN1870310 A CN 1870310A CN A2006100141575 A CNA2006100141575 A CN A2006100141575A CN 200610014157 A CN200610014157 A CN 200610014157A CN 1870310 A CN1870310 A CN 1870310A
- Authority
- CN
- China
- Prior art keywords
- sintering
- nano
- packaging
- high power
- low temp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100141575A CN100435366C (en) | 2006-06-08 | 2006-06-08 | Method for low temp sintering, packaging and connecting high power LED by nano-silver soldering paste |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100141575A CN100435366C (en) | 2006-06-08 | 2006-06-08 | Method for low temp sintering, packaging and connecting high power LED by nano-silver soldering paste |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1870310A true CN1870310A (en) | 2006-11-29 |
CN100435366C CN100435366C (en) | 2008-11-19 |
Family
ID=37443902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100141575A Expired - Fee Related CN100435366C (en) | 2006-06-08 | 2006-06-08 | Method for low temp sintering, packaging and connecting high power LED by nano-silver soldering paste |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100435366C (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7682875B2 (en) | 2008-05-28 | 2010-03-23 | Infineon Technologies Ag | Method for fabricating a module including a sintered joint |
CN101593712B (en) * | 2009-06-26 | 2012-01-04 | 天津大学 | Low-temperature sintering method for high-power chip connection and nano silver paste thickness control device |
WO2012010501A1 (en) * | 2010-07-19 | 2012-01-26 | Universiteit Leiden | Process to prepare metal nanoparticles or metal oxide nanoparticles |
CN102510005A (en) * | 2011-12-16 | 2012-06-20 | 天津大学 | Laser diode packaging module and packaging method |
CN102522695A (en) * | 2011-12-23 | 2012-06-27 | 天津大学 | Nano silver soldering paste packaged 60-watt 808-nano high-power semiconductor laser module and packaging method thereof |
CN102554383A (en) * | 2012-03-19 | 2012-07-11 | 天津大学 | Method for realizing copper-copper bonding through current sintering technology and device thereof |
CN102708943A (en) * | 2012-06-04 | 2012-10-03 | 惠州市富济电子材料有限公司 | Low-temperature sintered highly-heat-conductive and highly-electric-conductive silver paste, preparation method and sintering method |
CN101888057B (en) * | 2009-05-11 | 2012-10-03 | 唐福云 | Preparation method of laser diode packaging case |
CN105118790A (en) * | 2015-07-23 | 2015-12-02 | 淄博美林电子有限公司 | Preparation method of high temperature resistant packaging framework of silicon carbide diode |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102637598A (en) * | 2012-04-18 | 2012-08-15 | 润奥电子(扬州)制造有限公司 | Method for manufacturing high-power semiconductor device die |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1202531C (en) * | 2003-01-14 | 2005-05-18 | 中山大学 | Low-content nanometer conducting silver paste and its prepn |
KR100581971B1 (en) * | 2003-02-11 | 2006-05-22 | 주식회사 동진쎄미켐 | An Ag paste composition for forming micro-electrode and the micro-electrode manufactured using the same |
CN1599084A (en) * | 2003-09-15 | 2005-03-23 | 光宝科技股份有限公司 | Crystal solidifying method of light-emitting diode |
JP4944359B2 (en) * | 2003-09-18 | 2012-05-30 | 日本ケミコン株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
EP1716578A4 (en) * | 2004-02-18 | 2009-11-11 | Virginia Tech Intell Prop | Nanoscale metal paste for interconnect and method of use |
JP4473620B2 (en) * | 2004-03-30 | 2010-06-02 | 三井金属鉱業株式会社 | Silver paste |
CN1307024C (en) * | 2004-05-09 | 2007-03-28 | 邓和升 | High adhesion leadless soldering tin grease |
-
2006
- 2006-06-08 CN CNB2006100141575A patent/CN100435366C/en not_active Expired - Fee Related
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7682875B2 (en) | 2008-05-28 | 2010-03-23 | Infineon Technologies Ag | Method for fabricating a module including a sintered joint |
CN101888057B (en) * | 2009-05-11 | 2012-10-03 | 唐福云 | Preparation method of laser diode packaging case |
CN101593712B (en) * | 2009-06-26 | 2012-01-04 | 天津大学 | Low-temperature sintering method for high-power chip connection and nano silver paste thickness control device |
WO2012010501A1 (en) * | 2010-07-19 | 2012-01-26 | Universiteit Leiden | Process to prepare metal nanoparticles or metal oxide nanoparticles |
US9695521B2 (en) | 2010-07-19 | 2017-07-04 | Universiteit Leiden | Process to prepare metal nanoparticles or metal oxide nanoparticles |
CN102510005A (en) * | 2011-12-16 | 2012-06-20 | 天津大学 | Laser diode packaging module and packaging method |
CN102522695A (en) * | 2011-12-23 | 2012-06-27 | 天津大学 | Nano silver soldering paste packaged 60-watt 808-nano high-power semiconductor laser module and packaging method thereof |
CN102554383A (en) * | 2012-03-19 | 2012-07-11 | 天津大学 | Method for realizing copper-copper bonding through current sintering technology and device thereof |
CN102708943A (en) * | 2012-06-04 | 2012-10-03 | 惠州市富济电子材料有限公司 | Low-temperature sintered highly-heat-conductive and highly-electric-conductive silver paste, preparation method and sintering method |
CN102708943B (en) * | 2012-06-04 | 2014-04-16 | 惠州市富济电子材料有限公司 | Low-temperature sintered highly-heat-conductive and highly-electric-conductive silver paste, preparation method and sintering method |
CN105118790A (en) * | 2015-07-23 | 2015-12-02 | 淄博美林电子有限公司 | Preparation method of high temperature resistant packaging framework of silicon carbide diode |
CN105118790B (en) * | 2015-07-23 | 2017-12-29 | 淄博美林电子有限公司 | A kind of high temperature packaging framework preparation method of silicon carbide diode |
Also Published As
Publication number | Publication date |
---|---|
CN100435366C (en) | 2008-11-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1870310A (en) | Method for low temp sintering, packaging and connecting high power LED by nano-silver soldering paste | |
CN104031600B (en) | A kind of heat-conducting metal glue of insulation and manufacture method thereof | |
CN201081170Y (en) | Bake-free encapsulated high-efficiency high-heat dissipation performance high-power LED light source | |
CN107887368A (en) | Using the method for the two-sided interconnection silicon substrate IGBT module of low-temperature sintering Nano Silver | |
CN211045465U (en) | High-power flip L ED packaging structure | |
CN102881806B (en) | Surface mounted device light emitting diode (SMD LED) unit and packaging method thereof | |
CN105932019A (en) | Large power LED structure adopting COB packaging | |
CN104022217A (en) | High-power curved surface LED (light-emitting diode) radiating base plate and encapsulating method thereof | |
CN202048545U (en) | LED light source heat conduction and heat dissipation structure | |
CN204680661U (en) | Module is surrounded in igbt chip heat radiation | |
CN203521463U (en) | High-thermal conductivity LED-COB packaging substrate | |
CN105609496A (en) | High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof | |
CN206221990U (en) | A kind of LED lamp | |
CN104103741A (en) | Integrally packaged LED (Light-Emitting Diode) light source device taking silicon carbide ceramic as radiator, and preparation method of LED light source device | |
CN109904294A (en) | A kind of heat radiating type electron luminescence device | |
CN202332951U (en) | Power type light emitting diode (LED) | |
CN106481997A (en) | The ultra high power density LED component that heat conduction with phase change is combined with fan cooling | |
CN102510005A (en) | Laser diode packaging module and packaging method | |
CN201812850U (en) | LED (light-emitting diode) packaging structure | |
CN202167537U (en) | Led light source module | |
CN205069686U (en) | LED punctiform formula COB module | |
CN203631605U (en) | Inverted LED packaging structure | |
CN104425683A (en) | LED packaging support with all-metal structure | |
CN104362134A (en) | Sintering process of low-hole sliver nanowires for use between circuit substrate and radiator | |
CN204651312U (en) | A kind of LED lamp panel |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Huizhou Trust Industrial Co., Ltd. Assignor: Tianjin University Contract record no.: 2011440000696 Denomination of invention: Method for low temp sintering, packaging and connecting high power LED by nano-silver soldering paste Granted publication date: 20081119 License type: Exclusive License Open date: 20061129 Record date: 20110720 |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081119 Termination date: 20130608 |