CN1868039A - 在光刻胶去除过程中最小化阻障材料损失的方法 - Google Patents

在光刻胶去除过程中最小化阻障材料损失的方法 Download PDF

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Publication number
CN1868039A
CN1868039A CNA200480029601XA CN200480029601A CN1868039A CN 1868039 A CN1868039 A CN 1868039A CN A200480029601X A CNA200480029601X A CN A200480029601XA CN 200480029601 A CN200480029601 A CN 200480029601A CN 1868039 A CN1868039 A CN 1868039A
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CN
China
Prior art keywords
layer
silicon
nitrogen
dielectric layer
reactor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200480029601XA
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English (en)
Chinese (zh)
Inventor
拉奥·安纳普勒格德
朱海伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
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Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN1868039A publication Critical patent/CN1868039A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/084—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts for dual-damascene structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
    • H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/73—Etching of wafers, substrates or parts of devices using masks for insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00—Climate change mitigation technologies for sector-wide applications
    • Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CNA200480029601XA 2003-11-12 2004-11-09 在光刻胶去除过程中最小化阻障材料损失的方法 Pending CN1868039A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/712,326 2003-11-12
US10/712,326 US20050101135A1 (en) 2003-11-12 2003-11-12 Minimizing the loss of barrier materials during photoresist stripping

Publications (1)

Publication Number Publication Date
CN1868039A true CN1868039A (zh) 2006-11-22

Family

ID=34552671

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200480029601XA Pending CN1868039A (zh) 2003-11-12 2004-11-09 在光刻胶去除过程中最小化阻障材料损失的方法

Country Status (8)

Country Link
US (1) US20050101135A1 (https=)
EP (1) EP1683192A1 (https=)
JP (1) JP2007511099A (https=)
KR (1) KR20060123144A (https=)
CN (1) CN1868039A (https=)
IL (1) IL174648A0 (https=)
TW (1) TW200524051A (https=)
WO (1) WO2005048335A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7517801B1 (en) * 2003-12-23 2009-04-14 Lam Research Corporation Method for selectivity control in a plasma processing system
US8222155B2 (en) * 2004-06-29 2012-07-17 Lam Research Corporation Selectivity control in a plasma processing system
US7396769B2 (en) * 2004-08-02 2008-07-08 Lam Research Corporation Method for stripping photoresist from etched wafer
US7479457B2 (en) * 2005-09-08 2009-01-20 Lam Research Corporation Gas mixture for removing photoresist and post etch residue from low-k dielectric material and method of use thereof
JP2007180420A (ja) * 2005-12-28 2007-07-12 Fujitsu Ltd 半導体装置の製造方法及び磁気ヘッドの製造方法
US7244313B1 (en) * 2006-03-24 2007-07-17 Applied Materials, Inc. Plasma etch and photoresist strip process with intervening chamber de-fluorination and wafer de-fluorination steps
US7932181B2 (en) * 2006-06-20 2011-04-26 Lam Research Corporation Edge gas injection for critical dimension uniformity improvement
WO2009039551A1 (en) * 2007-09-26 2009-04-02 Silverbrook Research Pty Ltd Method of removing photoresist
US20090078675A1 (en) * 2007-09-26 2009-03-26 Silverbrook Research Pty Ltd Method of removing photoresist
JP5532826B2 (ja) * 2009-11-04 2014-06-25 富士通セミコンダクター株式会社 半導体素子の製造方法
CN102877041B (zh) * 2011-07-14 2014-11-19 中国科学院微电子研究所 薄膜沉积方法以及半导体器件制造方法
CN102610511A (zh) * 2012-03-21 2012-07-25 中微半导体设备(上海)有限公司 光刻胶的去除方法
US8901007B2 (en) * 2013-01-03 2014-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Addition of carboxyl groups plasma during etching for interconnect reliability enhancement
US10354860B2 (en) * 2015-01-29 2019-07-16 Versum Materials Us, Llc Method and precursors for manufacturing 3D devices
JP6523091B2 (ja) 2015-07-24 2019-05-29 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置およびプログラム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09330911A (ja) * 1996-06-11 1997-12-22 Toshiba Corp 半導体装置の製造方法
US6455232B1 (en) * 1998-04-14 2002-09-24 Applied Materials, Inc. Method of reducing stop layer loss in a photoresist stripping process using a fluorine scavenger
JP3803523B2 (ja) * 1999-12-28 2006-08-02 株式会社東芝 ドライエッチング方法及び半導体装置の製造方法
US6372636B1 (en) * 2000-06-05 2002-04-16 Chartered Semiconductor Manufacturing Ltd. Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damascene
US6352921B1 (en) * 2000-07-19 2002-03-05 Chartered Semiconductor Manufacturing Ltd. Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization
US6479391B2 (en) * 2000-12-22 2002-11-12 Intel Corporation Method for making a dual damascene interconnect using a multilayer hard mask
US6647994B1 (en) * 2002-01-02 2003-11-18 Taiwan Semiconductor Manufacturing Company Method of resist stripping over low-k dielectric material
JP4326746B2 (ja) * 2002-01-07 2009-09-09 東京エレクトロン株式会社 プラズマ処理方法

Also Published As

Publication number Publication date
JP2007511099A (ja) 2007-04-26
IL174648A0 (en) 2006-08-20
EP1683192A1 (en) 2006-07-26
KR20060123144A (ko) 2006-12-01
WO2005048335A1 (en) 2005-05-26
TW200524051A (en) 2005-07-16
US20050101135A1 (en) 2005-05-12

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WD01 Invention patent application deemed withdrawn after publication