CN1854658A - Movable-beam transportation device - Google Patents

Movable-beam transportation device Download PDF

Info

Publication number
CN1854658A
CN1854658A CNA2006100669641A CN200610066964A CN1854658A CN 1854658 A CN1854658 A CN 1854658A CN A2006100669641 A CNA2006100669641 A CN A2006100669641A CN 200610066964 A CN200610066964 A CN 200610066964A CN 1854658 A CN1854658 A CN 1854658A
Authority
CN
China
Prior art keywords
movable
substrate
mentioned
transportation device
transported material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2006100669641A
Other languages
Chinese (zh)
Other versions
CN100575221C (en
Inventor
森洋行
田中健一
石榑智之
大川直树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Co Ltd
Original Assignee
Noritake Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritake Co Ltd filed Critical Noritake Co Ltd
Publication of CN1854658A publication Critical patent/CN1854658A/en
Application granted granted Critical
Publication of CN100575221C publication Critical patent/CN100575221C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736Loading to or unloading from a conveyor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Tunnel Furnaces (AREA)
  • Reciprocating Conveyors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a mobile beam-typed transmitting device, which is characterized by the following: the front end of level support shaft 52 on the fixed beam 30 and mobile beam 34 is overlapped along transmitting direction A; the support scale of base bottom and mobile beam 30 and 34 is overlapped too; multiple bases 16 can be transmitted under this condition.

Description

Movable-beam transportation device
Technical field
The present invention relates to a kind of movable-beam transportation device that is used to carry the laminal substrate of semiconductor substrate, glass substrate etc.
Background technology
Known movable-beam transportation device, it has the 1st beam and the mat woven of fine bamboo strips 2 beams of strip, be used for implementing predetermined process for the laminal substrate of double conductor substrate, glass substrate etc., and relatively moving of the length direction that hockets and relatively moving of above-below direction, by the handing-over between the 1st beam and the 2nd beam, carry transported material.For example, the annealing device with the movable-beam transportation device that is used in the heat-treatment furnace that substrate is heat-treated adopting walking beam and carries is wherein a kind of.
But, according to above-mentioned movable-beam transportation device, Yi Bian Yi Bian in the way of on alternately being supported on the 1st beam and the 2nd beam, carrying,, have on substrate, to produce and break and split into a plurality of situations sometimes owing to certain reasons such as thermal shock, vibrations.Will have following problem like this: if substrate is broken into polylith, just can not be supported by above-mentioned the 1st beam and the 2nd beam and come off, and the substrate that is continued to transport successively collides and pile up, therefore produce defective products.
To this, following movable-beam transportation device has been proposed, that is, except a plurality of supporting pins of special supporting substrate, also on beam, be provided with a plurality of secondary supporting pin that is lower than these a plurality of supporting pins, if substrate breakage also can support by above-mentioned secondary supporting pin.For example, patent documentation 1 described movable-beam transportation device is wherein a kind of.Thus,, also can continue to carry the substrate that breaks even substrate breaks, so, can alleviate that the bump substrate that transports thereafter crashes through the substrate after splitting and the situation of piling up.
Patent documentation 1: TOHKEMY 2004-18122 communique
But, according to above-mentioned movable-beam transportation device in the past, with the back side of substrate adjoin each other by the area of the 1st beam support and different mutually by the area of the 2nd beam support, so particularly from the 1st beam when the 2nd beam joins, substrate after the division comes off sometimes, is difficult to obtain effect of sufficient.
Summary of the invention
The present invention carries out above situation as a setting, breaks even its purpose is to provide a kind of transported material to produce, and it also is difficult to come off the movable-beam transportation device that can keep original state ground to carry from beam.
The inventor etc. carry out various researchs as a setting and constantly with above situation, found that the following fact, if make promptly that bottom surface with transported material adjoins each other by the scope of the 1st beam support and overlapped by the scope of the 2nd beam support, even then under the situation of the transported material that splits into polylith owing to breaking etc., also can keep original state ground suitably to carry.The present invention carries out according to such discovery.
Promptly, invention main idea as the 1st aspect of the present invention that is used to realize above-mentioned purpose, (a): it is to have relatively moving and the 1st beam and the 2nd beam of the strip that hockets of relatively moving of above-below direction of throughput direction, and is used for carrying by the handing-over between the 1st beam and the 2nd beam the movable-beam transportation device of transported material; It is characterized in that (b): comprise the horizontal support member of many strips of the bottom surface that is used to support above-mentioned transported material, it is separately positioned on above-mentioned the 1st beam and the 2nd beam, and on the horizontal direction of intersecting with throughput direction, be parallel to each other; (c): the leading section and the leading section that is arranged on the horizontal support member of the strip on above-mentioned the 2nd beam that are arranged on the horizontal support member of the strip on above-mentioned the 1st beam, size on the direction of intersecting with above-mentioned throughput direction, overlapped on this throughput direction.
In addition,, wherein, make it, carry this transported material by in the duct-like heating furnace with the calandria that is used for the above-mentioned transported material of radiation heating according to the invention main idea of the 2nd aspect of the present invention.
Movable-beam transportation device according to the 1st aspect of the present invention, the horizontal support member that comprises many strips of the bottom surface that is used to support above-mentioned transported material, they are separately positioned on above-mentioned the 1st beam and the 2nd beam and are parallel to each other on the horizontal direction of intersecting with throughput direction; Be arranged on the leading section and the leading section that is arranged on the horizontal support member of the strip on above-mentioned the 2nd beam of the horizontal support member of the strip on above-mentioned the 1st beam, overlapped on above-mentioned throughput direction, so scope that is supported by the 1st beam that adjoins each other with the bottom surface of transported material and the scope that is supported by the 2nd beam are overlapped on throughput direction; So, also can be transferred even split into the transported material of polylith owing to breaking etc. with suitably keeping state of rupture.Therefore, break and split into polylith even produce on transported material, the transported material after follow-up transported material can not collide this yet and breaks and piling up can improve the mobility of the treatment facility of transported material when reducing bad ratio defective product.
In addition, movable-beam transportation device according to the 2nd aspect of the present invention, make it by carrying this transported material in the duct-like heating furnace with the calandria that is used for the above-mentioned transported material of radiation heating, so, in this heating furnace, split into polylith even transported material breaks, follow-up transported material can not collide this transported material of cutting yet and pile up, and can improve when reducing bad ratio defective product that to be used for the equipment that transported material is heat-treated be the mobility of heating furnace.
Description of drawings
Fig. 1 is the main pseudosection of annealing device that expression has the movable-beam transportation device of one embodiment of the present of invention.
Fig. 2 is the top plan view of annealing device of movable-beam transportation device that is used for the embodiment of presentation graphs 1.
Fig. 3 is explanation comes the state of supporting substrate by the movable-beam transportation device of the embodiment of Fig. 1 figure.
Fig. 4 illustrates the figure that comes the state of supporting substrate by the movable-beam transportation device of other embodiments of the invention, is the figure corresponding with Fig. 3.
Fig. 5 illustrates the figure that comes the state of supporting substrate by the movable-beam transportation device of other embodiments of the invention, is the figure corresponding with Fig. 3.
Fig. 6 is the top plan view of annealing device that is used to represent the movable-beam transportation device of other embodiments of the invention, is the figure corresponding with Fig. 2.
Label declaration
10: annealing device
14: heating furnace
16: substrate (transported material)
18,58: movable-beam transportation device
30: built-in beam (the 1st beam)
34: movable beam (the 2nd beam)
52: horizontal supporting shaft (horizontal support member)
60: built-in beam
64: movable beam
66: horizontal support member
The specific embodiment
At this, above-mentioned transported material is preferably the laminal substrate of glass substrate that solar cell, used for solar batteries semiconductor wafer, LCD or PDP use etc.
In addition, above-mentioned horizontal support member is preferably the parts that are configured with 1/2 also short interval than the size of the throughput direction of above-mentioned transported material.So, on throughput direction, under the state and state that support by the 1st beam respectively, support by many horizontal support members by the support of the 2nd beam, so, even more crisp crackly substrate also can suitably be carried.For example, even producing to break, also can suitably carry transported material.
In addition, above-mentioned horizontal support member is preferably the bar of strip of the solid or hollow of section circle, section rectangle, and the material that preferably is lower than transported material by the pyroconductivity of porous ceramics etc. constitutes.Thus, the Temperature Distribution in the transported material is more even.
In addition, above-mentioned horizontal support member is preferably, needn't be necessarily vertical with throughput direction, and also needn't be bar-shaped, but more towards the more little parts of point diameter.
In addition, above-mentioned horizontal support member is preferably the parts that have outstanding upward a plurality of kicks and support above-mentioned transported material by this kick.Thus, the Temperature Distribution in the transported material is more even.
In addition, above-mentioned the 1st beam and/or the 2nd beam are preferably, and by giving prominence to the vertical support axle that is provided with from the 1st beam and the 2nd beam to vertical direction, support above-mentioned horizontal support member.So, when being used for heat treated furnace wall, vertical support axle support level support component is so the Temperature Distribution in the transported material is more even.
Above-mentioned the 1st beam and the 2nd beam can be arranged to that a side is fixed and the opposing party can relatively move on throughput direction and above-below direction, also can be arranged to two sides and can relatively move on throughput direction and above-below direction.
Embodiment
Below, with reference to accompanying drawing one embodiment of the present of invention are elaborated.And in following embodiment, in the purpose scope of the object lesson that explanation is invented, accompanying drawing has carried out suitable simplification or distortion, and it is accurate that the size and dimension of each several part etc. may not be described.
Fig. 1 is the profile of major part of the annealing device 10 of expression one embodiment of the present of invention, and Fig. 2 cuts the body of heater of heating furnace 14 and the vertical view of representing the major part that it is inner.In Fig. 1 and Fig. 2, annealing device 10 comprises: duct-like heating furnace 14, and it is fixed on the specified altitude position by frame 12; With movable-beam transportation device 18, it is used for by carrying successively to outlet side from the entrance side of heating furnace 14 as the substrate 16 of transported material in this heating furnace 14.Substrate 16 is the glass semiconductor's substrates that are used for for example large-scale liquid crystal indicator or large-scale plasma display system, is for example rectangle about 100cm * 120cm of rectangle.Substrate 16 to form electrode layer in order by heat treatment the membrane material that for example is printed on electrode material paste on its surface and the back side etc. being sintered to fix, and to heat-treat in above-mentioned annealing device 10.
Above-mentioned heating furnace 14 comprises: body of heater 20, and it is made of the duct-like furnace wall of carrying out opening at the entrance and exit place; Dividing plate 22, it is used for a plurality of heating clambers of having certain intervals with being divided in this heating furnace 14; With heating plate 26, it is arranged in this body of heater 20 and the radiation far infrared of 3 to 4 μ m or above wavelength for example, to by above-mentioned movable-beam transportation device 18 between each heating clamber by substrate conveying 16 successively, heat-treat with the predetermined heating curve.Aforementioned barriers 22 on one side be to be used in each heating clamber, will to remain the parts that even temperature heats in the substrate 16 on one side, and has through hole 24, it has that the movable beam 34 that makes substrate 16 and aftermentioned beam shape passes through necessary and sectional area fully.When in oxidizing atmosphere, heating, remove the combustion tail gas of the membrane material in the above-mentioned heating clamber by not shown air supply pipe and blast pipe, thereby keep the cleaning of atmosphere.If non-oxidizing atmosphere replaces above-mentioned air to adopt inert gases such as nitrogen; If reducing atmosphere then adopts hydrogen.
Above-mentioned body of heater 20 and dividing plate 22 are made of the ceramic beaverboard of heat-proof quality excellence and light weight, and applying the silicon type coating in the side of internal face at least on the surface of this ceramic beaverboard, above-mentioned ceramic beaverboard is to be configured as thicker bulk by ceramic fibre being immersed in for example in the silica gel and being fixed.Therefore, can not only obtain heat-proof quality, can also prevent to produce the dust that gets off from ceramic beaverboard, improve cleannes.
Above-mentioned movable-beam transportation device 18 comprises: many of thin beam shape (being to be parallel to each other and isometric 4 in the present embodiment) built-in beams 30, it is as the 1st beam, is fixed into parallel with throughput direction A respectively in each heating clamber in body of heater 20 and is parallel to each other; The strip longer than furnace superintendent many a movable beam 34, i.e. the 2nd beam, it is supported by the many pillars 32 that connect body of heater 20 downside furnace walls; And beam drive unit 36, its on this movable beam 34, make with respect to built-in beam 30 on the furnace superintendent direction relatively move and above-below direction on relatively move and hocket.In the present embodiment, be parallel to each other and the 3 piece movable beam 34 longer, be provided between 4 built-in beams 30 than body of heater 20.In addition, movable beam 34 is even be divided into many, so long as just no problem by driven in synchronism mutually on its length direction.
Beam drive unit 36 comprises: a plurality of travelling carriages 38, and it is arranged to by a pair of horizontal guide rail 37 removable on throughput direction A, and is disposed on a plurality of positions of furnace superintendent direction at the downside of body of heater 20; General reciprocating drive unit 40, it back and forth drives this travelling carriage 38; General camshaft 44, it has a plurality of cams 42 up and down, and is supported on rotationally on each travelling carriage 38; Rotating driving device 46, it is configured on one of travelling carriage 38, and rotation drives this camshaft 44; With upper and lower panel 50, its direction guiding up and down by being arranged on guiding device up and down 48 on the travelling carriage 38, and drive up and down by cam 42 up and down; On movable beam 34, carry out ascending motion, forward travel, descending motion, setback successively and repeatedly with respect to built-in beam 30 by means of uprightly being arranged on the pillar 32 on this upper and lower panel 50, carry out the handing-over between built-in beam 30 and movable beam 34 thus, thereby make substrate 16 to the outlet of heating furnace 14, carry successively with the delivery stroke of regulation.In addition, the chain-dotted line of Fig. 1 represents to be fixedly installed on the position that the horizontal supporting shaft 52 on the movable beam 34 descends.
On said fixing beam 30 and movable beam 34, with certain fixed interval a plurality of horizontal supporting shafts 52 are arranged respectively, it meets at right angles to intersect with throughput direction A and also is parallel to each other in the horizontal direction.The configuration space of this back shaft 52, set for substrate 16 throughput direction A size B 1/8, so in state that supports by built-in beam 30 and the state that supports by movable beam 34, supporting by 8 or 9 horizontal supporting shafts 52 respectively.As long as the configuration space of this back shaft 52 is set in 1/2 or the following effect that just can obtain roughly of above-mentioned size B.In addition, the configuration gap of this back shaft 52 also can not be set as necessarily.Above-mentioned horizontal supporting shaft 52 is the bar of the solid or hollow of section circle, section rectangle for example, and the material that is lower than substrate 16 by the pyroconductivity of porous ceramics etc. constitutes.
As depicted in figs. 1 and 2, in the present embodiment, be fixed on the back shaft 52 on a pair of built-in beam 30 that is positioned at the inboard in 4 built-in beams 30, compare with the back shaft 52 on being fixed on a pair of built-in beam 30 that is positioned at the outside, length dimension is bigger.In addition, be fixed on the horizontal supporting shaft 52 on 1 movable beam 34 that is positioned at the inboard in 3 movable beam 34, compare with the back shaft 52 on being fixed on the 1 pair of movable beam 34 that is positioned at the outside, length dimension is bigger.And, be arranged on the leading section of the horizontal supporting shaft 52 on the said fixing beam 30 and be arranged on the leading section of the horizontal supporting shaft 52 on the movable beam 34, in overlapped mode on above-mentioned throughput direction A, the length of horizontal supporting shaft 52 is set.The d1 of Fig. 2, d2, d3, d4, d5, d6, expression is arranged on the leading section and the overlapping dimension that is arranged on the leading section of the horizontal supporting shaft 52 on the movable beam 34 of the horizontal supporting shaft 52 on the built-in beam 30 respectively.For these overlapping dimension d1, d2, d3, d4, d5, d6 are amplified as much as possible, horizontal supporting shaft 52, protrudes in till the position, dead ahead that arrives the opposing party towards the opposing party from a side of built-in beam 30 and movable beam 34.These back shafts 52 work as being used for the support component of supporting substrate 16.
In the movable-beam transportation device 18 that constitutes like that as previously discussed, the state that substrate 16 supports by the horizontal supporting shaft 52 that is arranged on the built-in beam 30, the state that supports by the horizontal supporting shaft 52 that is arranged on the movable beam 34 of substrate 16 as shown in Figure 3, this two states hockets, thus conveying substrate 16.At this, be arranged on the leading section and the leading section that is arranged on the horizontal supporting shaft 52 on the movable beam 34 of the horizontal supporting shaft 52 on the built-in beam 30, these two ends constitute in overlapping mode, so substrate 16 for regulation, the Area of bearing (comprising area) that supports by the many horizontal supporting shafts 52 of said fixing beam 30 with horizontal supporting shaft 52 contacted a plurality of contact points, the Area of bearing that supports with many horizontal supporting shafts 52 by movable beam 34, two kinds of Area of bearing are overlapped, so, even substrate 16 is divided and separates in the process that is transferred, also can carry with the state that breaks as a whole.
As mentioned above, movable-beam transportation device according to the annealing device 10 of present embodiment, many horizontal supporting axles 52 that comprise the bottom surface that is used for supporting substrate (transported material) 16, they are separately positioned on built-in beam (the 1st beam) 30 and the movable beam (the 2nd beam) 34 and are parallel to each other on the horizontal direction vertical with throughput direction A; Be arranged on the leading section and the leading section that is arranged on the horizontal supporting shaft 52 on the above-mentioned movable beam 34 of the horizontal supporting shaft 52 on the said fixing beam 30, overlapped on above-mentioned throughput direction A, so scope that is supported by built-in beam 30 that adjoins each other with the bottom surface of substrate 16 and the scope that is supported by movable beam 34 are overlapped on throughput direction; So, also can be transferred even split into the substrate 16 of polylith owing to breaking etc. with suitably keeping state of rupture.Therefore, break and split into polylith even produce on substrate 16, the substrate after follow-up substrate 16 can not collide this yet and breaks and piling up can improve the mobility of the treatment facility of substrate 16 when reducing bad ratio defective product.
In addition, movable-beam transportation device 18 according to present embodiment, it is carried out in the duct-like heating furnace 14 of heating plate (calandria) 26 of radiation heating substrate 16 by having, carry this substrate 16, so, in this heating furnace 14, even generation is broken and is split into polylith on substrate 16, substrate after follow-up substrate 16 can not collide this yet and breaks and piling up, can when reducing bad ratio defective product, improve be used for to the equipment that substrate 16 is heat-treated be heating furnace 14 mobility.
In addition, in the present embodiment, because horizontal supporting shaft 52, be configured with 1/2 also short interval than the size of the throughput direction of substrate 16, so, on throughput direction A, under the state and state that support by built-in beam 30 by movable beam 34 supports, more crisp crackly substrate 16 supports by a plurality of horizontal supporting shafts 52 respectively, even therefore also can suitably be carried.
In addition, in the present embodiment, horizontal supporting shaft 52 is for example bar of the solid or hollow of section circle, section rectangle, and is made of the material that pyroconductivities such as porous ceramics are lower than substrate 16, so the Temperature Distribution of substrate 16 is more even.
Below, other embodiments of the invention are described.In addition, in the following description, be marked with identical label and omit explanation for the part identical with aforesaid embodiment.
In the embodiment of Fig. 4, in movable beam 34, vertical support axle 54 is installed on the movable beam 34 by means of horizontal supporting shaft 52.That is, movable beam 34 is by means of coming support level back shaft 52 from it to the outstanding vertical support axle 54 that is provided with of vertical direction.Vertical support axle 54 is made of the material identical with horizontal supporting shaft 52.According to present embodiment, by being used for heat treated body of heater (furnace wall) 20 o'clock, vertical support axle 54 support level back shafts 52 are so the Temperature Distribution of substrate 16 is more even.In addition, above-mentioned vertical support axle 54 also can be arranged on the built-in beam 30.
In the embodiment of Fig. 5, on the horizontal supporting shaft 52 that is arranged on built-in beam 30 and the movable beam 34, have outstanding upward a plurality of small embossments 56.These small embossments 56 are used for small area of contact supporting substrate 16 as much as possible, and are made of the material identical with horizontal supporting shaft 52.In the present embodiment, horizontal supporting shaft 52 has outstanding upward a plurality of small embossments 56, comes supporting substrate 16 by means of these small embossments 56, so the Temperature Distribution in the substrate 16 is more even.
Fig. 6 is the top plan view of annealing device that is used to represent the movable-beam transportation device 58 of other embodiments of the invention.In the movable-beam transportation device 58 of Fig. 6, built-in beam 60 is identical with movable beam 34 with said fixing beam 30 with movable beam 64, but it is different with above-mentioned horizontal supporting shaft 52 to be arranged on the shape of the horizontal support member 66 on these built-in beams 60 and the movable beam 64.Promptly, in the present embodiment, be fixed on the horizontal support member 66 on the movable beam 64, be the tabular of section rectangle, and form, from both ends to this movable beam 64, more and more towards the direction opposite, and with respect to movable beam 64 and left-right symmetry with throughput direction A, and intersect with movable beam 64 with the angle less than the right angle, and the horizontal support member 66 that is separately positioned on overlapped part on 3 movable beam 64, on throughput direction A is parallel to each other.In addition, be fixed on 4 horizontal support members 66 on the built-in beam 60, form, from its both ends to this built-in beam 60, more and more towards the direction of throughput direction A, and with respect to built-in beam 60 and left-right symmetry, and intersect with built-in beam 60, and be fixed between the horizontal support member 66 on the said fixing beam 60 and be parallel to each other with angle less than the right angle.In addition, horizontal support member 66 on a pair of built-in beam 60 that is arranged in the outside in being fixed on 4 built-in beams 60, on the part that a pair of built-in beam 60 is given prominence to laterally from this, be provided with respect to from the outstanding to the inside part of this built-in beam 60, be positioned at the projection 66b of branch on the straight line.According to present embodiment, compare with the back shaft 52 of the foregoing description, the length of horizontal support member 66 is longer, and, owing to be provided with the above-mentioned projection 66b of branch, so the bearing length with respect to the horizontal support member 66 of substrate 16 is longer,, also can more suitably keeps state of rupture and be transferred even therefore split into the substrate 16 of polylith owing to break etc.
Above, with reference to accompanying drawing the present invention is had been described in detail, but the present invention also can implement in other mode, in the scope that does not break away from its general idea, can carry out various changes.

Claims (2)

1. movable-beam transportation device, it is to have relatively moving and the 1st beam and the 2nd beam of the strip that hockets of relatively moving of above-below direction of throughput direction, and is used for carrying by the handing-over between the 1st beam and the 2nd beam the movable-beam transportation device of transported material; It is characterized in that,
Comprise the horizontal support member of many strips of the bottom surface that is used to support above-mentioned transported material, it is separately positioned on above-mentioned the 1st beam and the 2nd beam, and is parallel to each other on the horizontal direction of intersecting with throughput direction;
Be arranged on the strip on above-mentioned the 1st beam horizontal support member leading section and be arranged on the leading section of the horizontal support member of the strip on above-mentioned the 2nd beam, the size on the direction of intersecting with above-mentioned throughput direction, overlapped on this throughput direction.
2. movable-beam transportation device according to claim 1 is characterized in that, makes it by having in the duct-like heating furnace of the calandria that is used for the above-mentioned transported material of radiation heating, carries this transported material.
CN200610066964A 2005-03-30 2006-03-30 Movable-beam transportation device Expired - Fee Related CN100575221C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005099811A JP4283242B2 (en) 2005-03-30 2005-03-30 Walking beam type conveyor
JP099811/2005 2005-03-30

Publications (2)

Publication Number Publication Date
CN1854658A true CN1854658A (en) 2006-11-01
CN100575221C CN100575221C (en) 2009-12-30

Family

ID=37194986

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200610066964A Expired - Fee Related CN100575221C (en) 2005-03-30 2006-03-30 Movable-beam transportation device

Country Status (3)

Country Link
JP (1) JP4283242B2 (en)
KR (1) KR101162517B1 (en)
CN (1) CN100575221C (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105984693A (en) * 2015-02-13 2016-10-05 厦门威芯泰科技有限公司 Comb type stepping conveying mechanism, conveying device and detection mechanism
CN108438782A (en) * 2018-04-18 2018-08-24 东海县晶盛源硅微粉有限公司 A kind of quartz pushrod processing conveying device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4738372B2 (en) 2007-04-03 2011-08-03 株式会社ノリタケカンパニーリミテド Walking beam heat treatment equipment
JP4988530B2 (en) * 2007-12-06 2012-08-01 日本特殊陶業株式会社 Positioning table, wiring board manufacturing apparatus, and wiring board manufacturing method
JP5257632B2 (en) * 2011-01-25 2013-08-07 村田機械株式会社 Substrate transfer device
KR20190029525A (en) * 2016-07-28 2019-03-20 오토테크 엔지니어링 에이.아이.이. Transportation through furnaces
CN106697804B (en) * 2016-11-23 2019-02-12 重庆市大足区其林机械制造厂 Step-by-step movement transmission device
DE102019112627B3 (en) * 2019-05-14 2020-08-13 Wemhöner Surface Technologies GmbH & Co. KG Method and device for transporting stacks of workpieces
CN114506683B (en) * 2022-02-16 2023-12-01 广西腾智投资有限公司 Rail type mounting equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS622477Y2 (en) * 1981-04-30 1987-01-21

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105984693A (en) * 2015-02-13 2016-10-05 厦门威芯泰科技有限公司 Comb type stepping conveying mechanism, conveying device and detection mechanism
CN105984693B (en) * 2015-02-13 2019-12-24 翁建建 Comb type stepping conveying mechanism, conveying device and detection mechanism
CN108438782A (en) * 2018-04-18 2018-08-24 东海县晶盛源硅微粉有限公司 A kind of quartz pushrod processing conveying device

Also Published As

Publication number Publication date
JP2006273570A (en) 2006-10-12
CN100575221C (en) 2009-12-30
KR20060106712A (en) 2006-10-12
JP4283242B2 (en) 2009-06-24
KR101162517B1 (en) 2012-07-09

Similar Documents

Publication Publication Date Title
CN1854658A (en) Movable-beam transportation device
CN100519369C (en) Step forward heat treatment device
CN101889199B (en) Glass substrate inspecting apparatus and glass substrate inspecting method
CN1293615C (en) Semiconductor manufacturing system
JP2011225376A (en) Multi-gate conveyor
CN100347812C (en) Base plate processing device and method
CN1611430A (en) Carrying device, coating system and checking system
JP2010052995A (en) Method for scribing mother substrate
CN103786269A (en) Device and method for fracturing fragile-material substrate
WO2019097940A1 (en) Method for manufacturing glass plate and manufacturing apparatus therefor
CN103568073A (en) Breaking apparatus for brittle material substrate
JP2014210682A (en) Method of manufacturing glass substrate, and apparatus used therein
CN1821131A (en) Heating and drawing apparatus and method of manufacturing glass spacer using the same
JP2008153261A (en) Laser annealing apparatus
US8428448B2 (en) Walking beam type heat treatment apparatus
CN1591024A (en) Electric connector
CN101034665A (en) Laser anneal device and laser anneal method
KR20080018465A (en) Conveyor appratus of brittle material substrate
JP2010042437A (en) Laser machining apparatus
JP2010073796A (en) Device and method for conveying plate-like body
KR101772059B1 (en) Apparatus and method for manufacturing glass plate
WO2017204386A1 (en) Method and device for cutting substrate by using laser tilting emission
CN1569703A (en) Air-cooling and tempering apparatus and air-cooling and tempering method for a glass sheet
CN1281835C (en) Transport device
CN107316834A (en) Base plate transfer device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091230

Termination date: 20130330