WO2017204386A1 - Method and device for cutting substrate by using laser tilting emission - Google Patents

Abstract

The present invention relates to a method and a device for cutting a substrate by using laser tilting emission, and to a method and a device for cutting a substrate by using laser tilting emission, the method and the device allowing a damage layer to be formed, in an inclined direction with respect to the surface of a substrate, in a cut region of the substrate, thereby enabling the substrate to be quickly cut by means of a continuous process.

Description

Substrate cutting method and apparatus using tilting irradiation of laser

The present invention relates to a method and apparatus for cutting a substrate using a tilting irradiation of a laser, and more particularly, to a substrate cutting method and apparatus using a tilting irradiation of a laser capable of quickly cutting a moving substrate using a laser in a continuous process. It is about.

In line with recent trends in the information and telecommunications industry, which are generally represented by high speed, integration, and light weight, the development of information processing apparatuses with very fast information processing capability is accelerated, and the interface that displays information processed at high speed can be recognized by workers. Technology development of information display devices (hereinafter referred to as "display devices"), which play a role, is taking an important part in the industry.

Conventional CRT (Cathode Ray Tube) is a display device that has been used steadily throughout the 20th century, but there is a limit in meeting the demand for portability, high resolution, and light weight, which are increasingly important in recent years. Therefore, LCD (Liquid Crystal Display), Plasma Display Panel (PDP), Thin Film Transistor (TFT), Organic Light Emitting Device (OLED), Organic Electroluminescence Panel (OEP), etc. Various display apparatuses are used, and in recent years, flexible display apparatuses have also been used.

Substrates used in such display devices are subjected to a cutting process in the process of manufacturing a mother substrate by cutting an edge portion or a substrate having a desired size from the mother substrate, and one of the technologies widely used in the cutting process is Diamond cutter technology.

According to the method of using diamond, the cutting blade is cut into the substrate by a dicing method or a scribing wheel made of diamond. It can be divided into a scribing method of making grooves and forming cracks in the thickness direction of the substrate.

However, in the case of such diamond cutter technology, there is a known problem that unwanted cracking, cracking or damage occurs during cutting. There can be many causes of such unwanted damage, but it can be said that the stress is concentrated on roughly cut portions when the cutting surface is not smooth when cutting by mechanical force such as diamond cutter.

In other words, when cutting the cutting line by applying a mechanical force with a sharp blade, a very irregular groove is dug without being formed in the x axis direction as well as the y axis direction, and when the pressure is applied to the groove, The cutting direction is shifted differently from the intended direction, as well as partial damage to fine pieces or debris.

Since the occurrence of such undesired damage increases as the thickness of the substrate becomes thinner, there is a disadvantage in that it is difficult to use in a manufacturing process of a display apparatus using a thin substrate, such as a flexible display apparatus.

Recently, a method of cutting by irradiating a laser has been developed and used to compensate for these disadvantages. The laser used varies slightly depending on the characteristics of the material to be processed, for example, a carbon dioxide laser, an Nd: YAG laser, but the principle of operation is basically as follows.

1 is a view for explaining a substrate cutting method using a known laser beam.

Referring to FIG. 1, a substrate cutting method using a known laser beam uses a method of forming damage in the substrate g by irradiating the laser beam to form a focal point inside the substrate g. .

That is, by irradiating the laser beam generated from the laser generating module with the laser beam irradiation module and focusing the inside of the substrate g along the cutting area, damage inside the substrate g, that is, internal defects having a constant depth, is detected. To form.

The laser beam is partially absorbed while passing through the substrate g to transfer energy to the constituent molecules. Plasma is instantaneously formed inside the substrate g due to the high energy density absorbed due to the characteristic of the laser pulse having a high energy density. The plasma is extinguished after a certain life time, which may deform into a structure different from the surrounding materials, but forms a narrow and long internal defect in the thickness direction of the irradiation part of the laser beam depending on the cutting processing conditions. . As described above, internal defects formed by the laser beam are generally called damage, and the substrate is cut using a process of continuously forming damage by the laser beam. Such a damage forming process may also be referred to as a filamentation process or a time-shift process, and there may be some differences in the damage forming method and the type of damage formed, but the technical principles are similar. .

Referring to FIG. 1, a substrate cutting process using a known laser beam continuously irradiates a laser beam along a cutting region of the substrate to continuously form a continuous damage d in a line inside the substrate g. In this specification, a portion in which damage d is continuously formed in a line direction is defined as a damage layer.

However, in general, since the thickness of the substrate g is greater than the height of the damage d, that is, the thickness of the damage layer, in order to cut the substrate, a plurality of damage layers should be formed in the thickness direction of the substrate in the cutting region.

When the focal point of the laser beam is continuously formed at a predetermined interval in the interior of the substrate g while the focal point is moved in a line direction, the movement of the laser beam is generally defined as a scan. In the case of the illustrated substrate, the damage layer of the laser beam is moved in a line direction to form a single damage layer, and then the additional damage layer is formed while adjusting the focus height by adjusting the laser beam in the Z-axis direction. That is, in the case of the example illustrated in FIG. 1, damage layers may be formed in the cutting area only by performing a total of three scans while adjusting the laser beam in the Z-axis direction.

By the way, in the continuous manufacturing process of the board | substrate g, since a board | substrate moves continuously, another damage layer cannot be repeatedly formed on the damage layer formed in the lower side of a board | substrate in the cut | disconnected area in the board | substrate g. Therefore, there is a problem that a substrate cutting process using a known laser beam cannot be used in the continuous manufacturing process in which the substrate g moves in one direction.

That is, since the cutting process must be performed in the state where the movement of the substrate g is stopped, the work process is increased, thereby reducing the efficiency of the work and reducing the productivity.

[Preceding technical literature]

[Patent Documents]

(Patent Document 1) Republic of Korea Registered Patent Publication No. 0876502 (2008.12.22)

Accordingly, the present invention has been made to solve the above problems, an object of the present invention is to continuously form the damage layer in the direction inclined to the substrate surface in the cutting region of the substrate through the tilting irradiation of the laser beam It is an object of the present invention to provide a method and apparatus for cutting a substrate using tilting irradiation of a laser that enables the substrate to be cut quickly in a process.

In order to achieve the above object, the substrate cutting method using the tilting irradiation of the laser according to the present invention, the laser beam is irradiated into the substrate along the cutting region on the substrate to form a damage layer continuous damage layer A method of cutting a substrate using tilting irradiation, characterized in that the damage layers are formed to be inclined with respect to the substrate surface.

According to the present invention, the substrate moves in one direction, and the damage layers are continuously formed in the cutting region in the opposite direction in which the substrate moves.

According to the present invention, the damage layers are at least partially overlapped with an upper end of one damage layer located forward of the substrate in the movement direction and a lower end of another damage layer located behind the substrate movement direction of the one damage layer.

According to the present invention, when the damage layers are formed, the laser beam travels at the time of forming the damage layer located forward in the movement direction of the substrate, and the other damage layer located behind the substrate movement direction of the damage layer. The advancing directions of the laser beams during formation are opposite to each other.

According to the present invention, in the cutting region, a damage layer inclined in one direction and a damage layer inclined in another direction intersecting with the damage layer inclined in one direction are formed together.

In the substrate cutting apparatus using a tilting irradiation of the laser according to the present invention, the substrate cutting apparatus is disposed in front of the substrate moving direction, and forms a damage layer by irradiating a laser beam along a set cutting region of the substrate, wherein the damage layer is formed in the direction of movement of the substrate. A laser beam irradiation module for irradiating a laser beam to the cutting region so as to extend in an obliquely crossing direction; And a controller configured to control a transfer speed of the substrate such that the inclinedly extended damage layer is continuously formed in the cutting region in a direction opposite to the movement of the substrate.

According to the present invention, a plurality of the laser beam irradiation module is installed so as to face each other with respect to the substrate to form a damage layer by irradiating a laser beam to the cutting area, respectively, to any one of the laser beam irradiation module The damage layer formed by intersects the damage layer formed by another laser beam irradiation module.

According to the present invention, the laser beam irradiation module is a scanner module that repeatedly irradiates a laser beam while moving a focal point of the supplied laser beam within a specified section.

According to the present invention, the scanner module irradiates the laser beam in a zigzag form while repeatedly reciprocating in a designated section.

According to the present invention, the control unit controls the traveling speed of the laser beam and the moving speed of the substrate by the laser irradiation module so that the damage layers formed to be inclined in the cutting region overlap each other.

According to the substrate cutting method and the substrate cutting device using the tilting irradiation of the laser according to the present invention having the above-described configuration, in the state of moving the substrate, the substrate moving by irradiating the laser beam to the cutting region of the substrate in a continuous process Since cutting can be performed precisely, there is an effect that can contribute to productivity improvement as well as simplification of the process.

In particular, since the laser beam is irradiated while repeatedly moving the focus of the laser beam within the designated irradiation area, adjustment of the Z axis with respect to the laser beam is unnecessary.

The present invention can be used not only for cutting substrates for displays, in particular for display glass substrates, but also for cutting construction materials, automotive glass substrates, and can also be used for cutting reinforced glass and non-reinforced glass substrates.

1 is a conceptual diagram for explaining a substrate cutting method using a known laser beam.

2 is a view for explaining the principle of the substrate cutting method using a tilting irradiation of the laser according to an embodiment of the present invention.

3 is a view showing a state in which the laser beam of the substrate cutting apparatus according to the embodiment of the present invention moves along the scan area.

4 is a view for explaining a scanner module used in the substrate cutting method and apparatus according to an embodiment of the present invention.

5 to 7 are views for explaining a substrate cutting method using a laser beam according to an embodiment of the present invention.

8 is a view showing a substrate cutting apparatus according to another embodiment of the present invention.

9 is a view for explaining a substrate continuous cutting device using a substrate cutting device according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 2 to 9.

2 is a view for explaining the principle of the substrate cutting method using a tilting irradiation of the laser according to an embodiment of the present invention.

In the substrate cutting apparatus using the tilting irradiation of the laser according to an embodiment of the present invention, the laser beam is irradiated into the substrate 200 along the cutting region 250 of the substrate 200 so that the damage d is continuously arranged in a row. And a laser beam irradiation module for continuously forming the damage layers L1, L2, L3, and L4 inclined with respect to the surface of the substrate 200.

The cutting region 250 refers to a cutting surface designed for the substrate 200. In the present invention, the damage layers L1, L2, L3, and L4 extending inclined with respect to the surface of the substrate 200 along the cutting region 250 may be formed. The substrate 200 may be cut through a process of sequentially forming the substrate.

The laser beam irradiation module irradiates a laser beam to the inside of the substrate 200 in the cutting region 250 of the substrate 200 so that the width is narrow and long, and the damage d, which is an internal defect, is continuously spaced at a predetermined interval in the moving direction of the laser beam. In this specification, the damages d are continuous in a row in the direction of movement of the laser beam, and are defined as damage layers L1, L2, L3, and L4.

According to the present invention, the damage layers L1, L2, L3, and L4 extending in a direction inclined with respect to the extending direction of the cutting region 250 of the substrate 200, that is, inclined to the surface of the substrate 200 may be formed. The substrate 200 may be cut in the cutting region 250 of the substrate 200 by being sequentially and continuously formed along the cutting region 250 of the 200.

Preferably, the substrate cutting method using the laser beam according to the present invention, the damage layer (L1, L2, L3, L4) extending inclined with respect to the surface of the substrate 200 while moving the substrate 200 in one direction By sequentially forming the substrate 200, the substrate 200 can be cut while continuously transporting the substrate 200 in one direction.

When the substrate 200 is manufactured through a series of manufacturing processes and continuously supplied through a substrate supply unit (not shown), the laser beam irradiation module is inclined with respect to the surface of the substrate 200 within a designated section. When the damage layer L1, L2, L3, and L4 are formed by continuously forming the damages d in a row while moving the focal point of the laser beam, the damage layers L1, L2, L3, and L4 are formed on the substrate ( It extends obliquely to the surface of the substrate 200 as well as to the direction of movement of the substrate 200.

In addition, since the substrate 200 is in motion, when the laser beam is repeatedly irradiated while moving in the laser beam irradiation area by the laser beam irradiation module, the inclined damage layers L1, L2, L3, and L4 are applied to the substrate 200. It is possible to be formed while continuing to the cutting region 250 of the ().

That is, when the laser beam is moved to one side in the designated irradiation area to form a damage layer, and the laser beam is moved to one side in the designated irradiation area to form a damage layer, the movement direction of the substrate 200 As a result, the other damage layer extending inclined again is formed on the upper part of the damage layer extending obliquely forward. In this process, the damage layers L1, L2, L3, and L4 are sequentially formed in the cutting region 250 of the substrate 200 in the direction opposite to the moving direction of the substrate 200.

According to the embodiment of the present invention, the laser beam irradiation by the laser beam irradiation module in the set irradiation area is made of a form of repeated reciprocating movement while moving from one side to the other side, and then from the other side to one side.

Therefore, the laser beam is irradiated in a zigzag form while repeating the reciprocating movement in the designated irradiation area, and damage layers L1, L2, L3, and L4 are continuously formed in the cutting area 250.

As shown in Fig. 3, according to the present invention, the laser beam irradiation module preferably includes a scanner module 100 for irradiating the laser beam while repeatedly moving the focus of the laser beam within a designated irradiation area. Such a scanner module 100 is known as a galvanometer scanner module.

3 is a view for explaining an embodiment of the scanner module 100 as an example of the laser beam irradiation module used in the cutting device using the tilting irradiation of the laser according to the present invention.

The scanner module 100 includes a beam irradiator 20, a beam scanner 30, and a condenser lens 40 for concentrating a laser beam emitted from the beam scanner 30 to a desired focal position.

In addition, the beam scanner 30 may be connected to a driver 310, one or two motors 320 and 330 driven by the driver 310, and a rotation shaft of the motors 320 and 330, respectively. First and second mirrors 340 and 350 to repeat the rotation according to the angle and direction.

A laser beam having a diameter of about 10 μm that is incident from the laser light source 10 to the second mirror 350 through the beam irradiator 20 is reflected to the first mirror 340 of the beam scanner 30. The wavelength of the laser beam may be various.

Subsequently, the laser beam reflected from the first mirror 340 is irradiated to the condenser lens 40, and the condenser lens 40 maintains a focal length of the irradiated laser beam at a constant distance. By allowing the focal point to be formed, the damage layer is formed along the scan area, that is, the irradiation area of the set laser beam. Here, the number of the first and second mirrors 340 and 350 may be used varying depending on the processing purpose.

In this case, since the first and second mirrors 340 and 350 can reciprocately rotate at the angles and directions specified by the motors 320 and 330, the first and second mirrors 340 and 350 can reciprocate the laser beam along the scan area. In addition, it is also possible to adjust the depth of focus of the irradiated laser beam by adjusting the heights of the first and second mirrors 340 and 350.

According to an embodiment of the present invention, it is preferable to use the scanner module 100 having the above configuration as the laser beam irradiation module. Accordingly, the laser beam is irradiated while moving along the cutting area 250 of the substrate 200 while its axis is tilted at a predetermined angle with respect to the surface of the substrate 200 to damage layers L1, L2, L3, and L4. Will form.

4 is a diagram illustrating a laser beam irradiation module according to another embodiment of the present invention.

The laser beam irradiation module 100 ′ according to another embodiment of the present invention includes a scanner module illustrated in FIG. 3 that repeatedly irradiates a laser beam while moving the focal point of the laser beam within a specified section while the scanner module is stopped. Unlike the method 100, the laser beam irradiation module 100 'is set to irradiate a laser beam at a predetermined position, and the laser beam irradiation module 100' is reciprocated in a predetermined section by using a cam mechanism, a servomotor, or the like. As a result, the laser beam is repeatedly irradiated within a specified section.

As such, the laser beam irradiation module is not limited to the scanner module shown in FIG. 3 and may be configured as various implementations.

2, 5 to 7, the substrate cutting method using the tilting irradiation of the laser according to the present invention will be described.

In the substrate cutting method using the tilting irradiation of the laser according to the present invention, by using the scanner module 100 as the laser beam irradiation module, as described above, the irradiation area to which the laser beam is assigned to the moving substrate 200 more easily. It is possible to form the damage layers (L1, L2, L3, L4) by being repeatedly irradiated at.

First, referring to FIG. 5, the scanner module 100 irradiates a laser beam to the cutting region 250 of the moving substrate 200 to form a damage layer L1 extending in an inclined direction with respect to the surface.

The scanner module 100 continuously forms the damage d at predetermined intervals while moving the focal point of the laser beam within a designated irradiation area, that is, the scan area. The scanner module 100 is disposed to be tilted with respect to the surface of the 200, and thus the damage layer L1 is also formed while the damages d extend in a direction inclined with respect to the surface of the substrate 200. The extending direction of the damage layer L1 also forms a predetermined inclination angle with respect to the moving direction of the substrate 200.

6 shows a process in which an L2 damage layer is formed on an L1 damage layer.

The scanner module 100 forms a damage layer while moving the laser beam within the scan area, and repeatedly forms a damage layer while moving the laser beam again within the scan area. The L2 damage layer is formed while extending in an inclined direction on top of the L1 damage layer extending in an oblique direction toward the moving direction of the substrate 200. That is, the L2 damage layer is formed to be inclined continuously on the upper portion of the L1 damage layer along the cutting region of the substrate 200.

In this case, it is preferable that the formation direction of the L1 damage layer and the formation direction of the L2 damage layer are opposite to each other. That is, the L1 damage layer is formed while the laser beam moves in the a direction in the scan area, and the L2 damage layer formed thereon may be formed while the laser beam moves in the b direction in the scan area. In this case, after forming the L1 damage layer, it is possible to form the L2 damage layer while moving in the b direction without returning the laser beam to the start position in the a direction, thereby making it possible to form the damage layer more quickly. . Therefore, the cutting process of the board | substrate 200 can also be made more quickly.

FIG. 7 is a diagram illustrating a process of forming an L3 damage layer on an upper portion of an L2 damage layer, and forms an L3 damage layer while the laser beam moves again in a direction within the scan area.

That is, while repeating the process of FIGS. 5 and 6, as shown in FIG. 2, the damage layers L1, L2, L3, and L4 are continuously in a direction inclined to the cutting region 250 of the substrate 200. It is possible to be formed. In this process, the moving speed of the substrate 200 is coordinated with the moving speed of the laser beam in the scan area of the scanner module 100, that is, the scanning speed, so that the damage layers in the cutting area 250 move in the direction of the substrate 200. Are formed continuously inclined in opposite directions. 4, which is not described in FIG. 4, is a moving stage that guides the transfer of the substrate 200.

Referring back to FIG. 2, the damage layers L1, L2, L3, and L4 are formed such that the upper end of the lower damage layer and the lower end of the upper damage layer are in contact with each other.

However, according to the present invention, without being limited thereto, the damage layers L1, L2, L3, and L4 may be formed to overlap or partially overlap each other in the thickness direction, and the top of the lower damage layer and the bottom of the upper damage layer. It is possible to improve the cutting accuracy by making this part overlap. This overlap length can be adjusted by adjusting the moving speed and the scanning speed of the substrate 200. The controller 400 (see FIG. 8) may be provided to adjust the moving speed and the scan speed of the substrate 200 to correspond to each other.

As shown in FIG. 2, through the process of continuously irradiating the laser beam to the cutting area 250 by the scanner module 100 to the moving substrate 200 in a zigzag direction to form a damage d. Unlike the conventional process in which the damage layers L1, L2, L3, and L4 extend in the same direction as the surface of the substrate 200, the damage layers L1, L2, L3, and L4 move in the direction of movement of the substrate 200. Continuous. Therefore, it is possible to cut continuously while moving the substrate 200 without interrupting the movement of the substrate 200.

8 is a view showing a substrate cutting apparatus according to another embodiment of the present invention, in which the first scanner module 100a installed on the substrate 200 is tilted at a predetermined angle with respect to the surface of the substrate 200. The laser beam is irradiated along the cutting area 250 of the furnace substrate 200 to form damage layers L1, L2, L3, and L4, and the second scanner module 100b installed below the substrate 200 The damage layer formed by irradiating the first scanner module 100a along the cutting area 250 of the substrate 200 by being installed in a direction opposite to the first scanner module 100a based on the substrate 200. Form a damage layer in the direction that intersects with. That is, the first scanner module 100a and the second scanner module 100b are respectively disposed on the upper and lower surfaces of the substrate 200 in a direction facing each other with respect to the substrate 200 and are disposed in the laser cutting area 250. Tilting irradiation, the damage layer formed by each scanner module (100a, 100b) is formed while overlapping each other.

As described above, when the damage layers overlapping each other in a row in a direction crossing each other are formed on the substrate 200, the substrate 200 may be more easily cut, thereby improving substrate cutting performance.

9 is a view for explaining a continuous cutting device of the substrate using a substrate cutting device using a tilting irradiation of the laser according to an embodiment of the present invention.

Referring to FIG. 9, a substrate continuous cutting apparatus using a substrate cutting apparatus using a tilting irradiation of a laser according to an embodiment of the present invention includes a laser beam irradiation module and a controller 400. The laser beam irradiation module is preferably a scanner module 100 which repeatedly irradiates a laser beam while moving the focus of the supplied laser beam within a designated irradiation area.

However, the present invention is not necessarily limited thereto. As described with reference to FIG. 4, the cam, piezo, and servomotor may be mechanically configured, and the laser beam may be moved while moving the focus of the laser beam within a designated irradiation area. Various laser beam irradiation modules that can be repeatedly irradiated can be adopted.

According to the present invention, the substrate 200 is not particularly limited as long as it is applied to a liquid crystal display device, a touch screen panel, and the like so as to be sufficiently durable to protect them from external forces and to allow the user to see the display well. The substrate 200 used may be used without particular limitation. For example, the material of the substrate 200 may be glass, polyethersulphone (PES), polyacrylate (PAR, polyacrylate), polyetherimide (PEI), polyethylene naphthalate (PEN, polyethyelenen napthalate), polyethylene Terephthalate (PET, polyethyelene terepthalate), polyphenylene sulfide (PPS), polyallylate, polyimide, polycarbonate (PC, polycarbonate), cellulose triacetate (TAC), cellulose acetate Propionate (cellulose acetate propionate, CAP) and the like can be used. The substrate cutting device according to the invention is particularly advantageous for cutting class substrates and can be applied to both tempered and non-reinforced glass.

In the substrate continuous cutting device using the substrate cutting device using the tilting irradiation of the laser according to an embodiment of the present invention, the substrate 200 in the form of a plate ( 200).

The substrate continuous cutting device using the substrate cutting device using the tilting irradiation of the laser according to the embodiment of the present invention includes a scanner module 100 disposed in the moving direction front side of the substrate 200 supplied from the substrate supply unit.

The scanner module 100 is preferably disposed to be spaced apart in the width direction of the substrate 200, the substrate so that the both ends of the width direction of the substrate 200 to proceed continuously in the longitudinal direction of the substrate 200 The laser beam is irradiated to continuously form the damage layer in the inclined direction in the cut region 250 of the 200.

That is, the scanner module 100 irradiates a laser beam to the cutting area 250 of the substrate 200 to form a damage layer in which the damage d is continuously arranged in a line, and the substrate 200 The damage layer is formed to be inclined with the movement direction of the substrate 200 while moving the focal point of the laser beam in the direction inclined to the movement direction of the substrate 200. In this case, the damage layer is continuously formed while overlapping or partially overlapping in the thickness direction of the damage layer along the opposite direction of movement of the substrate 200.

The controller 400 adjusts the thickness direction interval between the damage layers by adjusting the moving speed of the substrate 200 supplied from the substrate supply unit and the scanning speed in the scanner module 100. As described above, the damage layer is in the thickness direction. Adjust to overlap adjacent or partially.

Therefore, the damage layers are continuously formed along the cutting area 250 of the substrate 200 which is supplied and transferred from the substrate supply unit, thereby enabling the cutting of the substrate 200.

In addition, as described with reference to FIG. 8, an additional scanner module may be installed on the bottom surface of the substrate 200 to form a damage layer such that the damage layers overlap each other in the cutting area.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the description of the embodiments described above, and does not depart from the description of the claims of the present invention. Various modifications by the person should also be construed as being within the protection scope of the present invention.

Claims (10)

1. In the method of cutting a substrate using a tilting irradiation of the laser to irradiate the laser beam inside the substrate along the cutting area on the substrate to form a continuous damage layer in a line,

   And the damage layers are formed to be inclined with respect to the surface of the substrate.
2. The method of claim 1,

   The substrate is moved in one direction, the damage layer is a cutting method of a substrate using a tilting irradiation of the laser, characterized in that formed continuously in the cutting area in the opposite direction to move the substrate.
3. The method of claim 2,

   The damage layers are at least partially overlapped with the upper end of one damage layer located forward of the movement direction of the substrate and the lower end of another damage layer located behind the substrate movement direction of the one damage layer. Cutting method of the substrate.
4. The method according to claim 2 or 3,

   At the time of forming the damage layers, the laser beam at the time of forming the damage layer positioned forward in the direction of movement of the substrate and at the time of forming the other damage layer located behind the substrate moving direction of the damage layer. The advancing direction of the substrate cutting method using a tilting irradiation of the laser, characterized in that the opposite.
5. The method of claim 1,

   And a damage layer inclined in one direction and a damage layer inclined in another direction intersecting with the damage layer inclined in one direction in the cutting region.
6. The laser beam is disposed at the front side of the substrate moving direction, and forms a damage layer by irradiating a laser beam along a set cutting area of the substrate, and extends the laser beam in the cutting area so that the damage layer extends in a direction crossing the moving direction of the substrate. A laser beam irradiation module for irradiating; And

   And a controller for controlling a feed rate of the substrate such that the inclinedly extended damage layer is continuously formed in the cutting region in a direction opposite to the movement of the substrate.
7. The method of claim 6,

   The laser beam irradiation module is provided in plurality so as to face each other with respect to the substrate to form a damage layer by irradiating a laser beam to the cutting area, respectively,

   And a damage layer formed by any one of the laser beam irradiation modules intersects with a damage layer formed by another laser beam irradiation module.
8. The method of claim 6,

   And the laser beam irradiation module is a scanner module that repeatedly irradiates a laser beam while moving a focal point of the supplied laser beam within a specified section.
9. The method of claim 8,

   And the scanner module irradiates the laser beam in a zigzag form while repeatedly reciprocating within a designated section.
10. The method of claim 6,

    The control unit is a cutting device for a substrate using a tilting irradiation of the laser to control the moving speed and the moving speed of the laser beam by the laser irradiation module so that the damage layers are formed obliquely in the cutting area.

Images