WO2017204386A1 - Procédé et dispositif pour découper un substrat au moyen d'une émission laser inclinée - Google Patents

Procédé et dispositif pour découper un substrat au moyen d'une émission laser inclinée Download PDF

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Publication number
WO2017204386A1
WO2017204386A1 PCT/KR2016/005603 KR2016005603W WO2017204386A1 WO 2017204386 A1 WO2017204386 A1 WO 2017204386A1 KR 2016005603 W KR2016005603 W KR 2016005603W WO 2017204386 A1 WO2017204386 A1 WO 2017204386A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
laser beam
damage layer
cutting
damage
Prior art date
Application number
PCT/KR2016/005603
Other languages
English (en)
Korean (ko)
Inventor
강형식
김대진
엄승환
고건섭
김한규
이성한
Original Assignee
디앤에이 주식회사
강형식
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디앤에이 주식회사, 강형식 filed Critical 디앤에이 주식회사
Publication of WO2017204386A1 publication Critical patent/WO2017204386A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/08—Construction or shape of optical resonators or components thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Definitions

  • CRT Cathode Ray Tube
  • LCD Liquid Crystal Display
  • PDP Plasma Display Panel
  • TFT Thin Film Transistor
  • OLED Organic Light Emitting Device
  • OEP Organic Electroluminescence Panel
  • a damage layer inclined in one direction and a damage layer inclined in another direction intersecting with the damage layer inclined in one direction are formed together.
  • the laser beam is irradiated into the substrate 200 along the cutting region 250 of the substrate 200 so that the damage d is continuously arranged in a row.
  • a laser beam irradiation module for continuously forming the damage layers L1, L2, L3, and L4 inclined with respect to the surface of the substrate 200.
  • the laser beam irradiation module preferably includes a scanner module 100 for irradiating the laser beam while repeatedly moving the focus of the laser beam within a designated irradiation area.
  • a scanner module 100 is known as a galvanometer scanner module.
  • the laser beam reflected from the first mirror 340 is irradiated to the condenser lens 40, and the condenser lens 40 maintains a focal length of the irradiated laser beam at a constant distance.
  • the damage layer is formed along the scan area, that is, the irradiation area of the set laser beam.
  • the number of the first and second mirrors 340 and 350 may be used varying depending on the processing purpose.
  • the formation direction of the L1 damage layer and the formation direction of the L2 damage layer are opposite to each other. That is, the L1 damage layer is formed while the laser beam moves in the a direction in the scan area, and the L2 damage layer formed thereon may be formed while the laser beam moves in the b direction in the scan area. In this case, after forming the L1 damage layer, it is possible to form the L2 damage layer while moving in the b direction without returning the laser beam to the start position in the a direction, thereby making it possible to form the damage layer more quickly. . Therefore, the cutting process of the board

Abstract

La présente invention porte sur un procédé et un dispositif pour découper un substrat au moyen d'une émission laser inclinée, et sur un procédé et un dispositif pour découper un substrat au moyen d'une émission laser inclinée, le procédé et le dispositif permettant de former une couche endommagée, dans une direction inclinée par rapport à la surface d'un substrat, dans une région de coupe du substrat, permettant ainsi de découper rapidement le substrat au moyen d'un processus continu.
PCT/KR2016/005603 2016-05-25 2016-05-27 Procédé et dispositif pour découper un substrat au moyen d'une émission laser inclinée WO2017204386A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160064176A KR20170133131A (ko) 2016-05-25 2016-05-25 레이저의 틸팅 조사를 이용한 기판 절단 방법 및 장치
KR10-2016-0064176 2016-05-25

Publications (1)

Publication Number Publication Date
WO2017204386A1 true WO2017204386A1 (fr) 2017-11-30

Family

ID=60411418

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2016/005603 WO2017204386A1 (fr) 2016-05-25 2016-05-27 Procédé et dispositif pour découper un substrat au moyen d'une émission laser inclinée

Country Status (2)

Country Link
KR (1) KR20170133131A (fr)
WO (1) WO2017204386A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020123147B4 (de) 2019-09-06 2022-01-27 Cericom GmbH Verfahren, Vorrichtung, Steuereinrichtung sowie Computerprogrammprodukt zum Einbringen eines Schnitts in ein Glaswerkstück
DE102021214310A1 (de) 2021-12-14 2023-06-15 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Erzeugen mindestens einer Hohlstruktur, EUVSpiegel und EUV-Lithographiesystem

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006110587A (ja) * 2004-10-14 2006-04-27 Canon Inc レーザー干渉加工方法および装置
KR20100007955A (ko) * 2007-06-06 2010-01-22 닛토덴코 가부시키가이샤 레이저 가공 방법 및 레이저 가공품
KR20100107252A (ko) * 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
KR20110047131A (ko) * 2009-10-29 2011-05-06 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저 가공 방법, 피가공물의 분할 방법 및 레이저 가공 장치
KR20130133800A (ko) * 2010-11-30 2013-12-09 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 스크라이브의 테이퍼 감소 방법 및 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006110587A (ja) * 2004-10-14 2006-04-27 Canon Inc レーザー干渉加工方法および装置
KR20100007955A (ko) * 2007-06-06 2010-01-22 닛토덴코 가부시키가이샤 레이저 가공 방법 및 레이저 가공품
KR20100107252A (ko) * 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
KR20110047131A (ko) * 2009-10-29 2011-05-06 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저 가공 방법, 피가공물의 분할 방법 및 레이저 가공 장치
KR20130133800A (ko) * 2010-11-30 2013-12-09 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 스크라이브의 테이퍼 감소 방법 및 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020123147B4 (de) 2019-09-06 2022-01-27 Cericom GmbH Verfahren, Vorrichtung, Steuereinrichtung sowie Computerprogrammprodukt zum Einbringen eines Schnitts in ein Glaswerkstück
DE102021214310A1 (de) 2021-12-14 2023-06-15 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Erzeugen mindestens einer Hohlstruktur, EUVSpiegel und EUV-Lithographiesystem

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Publication number Publication date
KR20170133131A (ko) 2017-12-05

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