WO2017039169A1 - Dispositif de traitement au laser et procédé de traitement au laser utilisant celui-ci - Google Patents

Dispositif de traitement au laser et procédé de traitement au laser utilisant celui-ci Download PDF

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Publication number
WO2017039169A1
WO2017039169A1 PCT/KR2016/008775 KR2016008775W WO2017039169A1 WO 2017039169 A1 WO2017039169 A1 WO 2017039169A1 KR 2016008775 W KR2016008775 W KR 2016008775W WO 2017039169 A1 WO2017039169 A1 WO 2017039169A1
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WO
WIPO (PCT)
Prior art keywords
scanner
laser beam
driving
laser
processing
Prior art date
Application number
PCT/KR2016/008775
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English (en)
Korean (ko)
Inventor
이병학
소재혁
김석규
이태경
Original Assignee
(주)이오테크닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by (주)이오테크닉스 filed Critical (주)이오테크닉스
Publication of WO2017039169A1 publication Critical patent/WO2017039169A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/044—Seam tracking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring

Definitions

  • the present invention relates to laser processing, and more particularly, to a laser processing apparatus and a laser processing method using the same, which can reduce processing time.
  • the laser processing apparatus irradiates a laser beam emitted from a laser light source to an object to be processed using an optical system, and marking, exposure, etching, and punching (processing) of the object by the irradiation of the laser beam is performed. Machining operations such as punching, scribing, dicing and the like are performed.
  • the size of the area (that is, the processing field) in which the scanner can process the laser beam on the object to be processed is limited due to the optical configuration of the laser processing apparatus.
  • it is possible to process the entire region of the object by loading the object on the stage and then moving the stage in the direction parallel to the object (for example, in the x-axis and y-axis directions).
  • the processing time is delayed in that the machining operation cannot be performed while the object to be processed is moved by the stage.
  • the scanner may perform a machining operation on the object while the object is always moved by the stage, this laser processing method is called a 'flying' processing method.
  • the present embodiment provides a laser processing apparatus and a laser processing method using the same which can reduce the processing time.
  • a laser processing apparatus for processing the object to be loaded on the stage using a laser, the laser light source; A first scanner for rotating the laser beam emitted from the laser light source by driving; A second scanner for moving the laser beam emitted from the first scanner to a predetermined position of the object to be processed by driving; And a scanner controller configured to control driving of the first scanner and the second scanner.
  • the embodiment by controlling the linear motion and the rotational motion of the laser beam by the driving of different scanners, by reducing the time for converting the linear motion to the rotational motion or the time for converting the rotational motion to the linear motion, The time taken to process the material can be greatly reduced.
  • the position tracking unit transmits the position signal of the object to be processed by the stage to the scanner controller, and the scanner controller controls the scanner in consideration of the moving speed of the object and the scanning speed of the scanner. Machining can also be performed while the object is moving. Therefore, since the laser processing operation can be continuously performed without interruption, the processing object can greatly reduce the time required for processing.
  • Figure 1 schematically shows a laser processing apparatus according to an embodiment of the present invention.
  • FIG. 2 schematically illustrates the structure of a first scanner in a laser processing apparatus according to an embodiment of the present invention.
  • FIG. 3 is a view for explaining the function of the angle amplifier in the laser processing apparatus according to an embodiment of the present invention.
  • Figure 4 schematically shows a laser processing apparatus according to another embodiment of the present invention.
  • Figure 5 shows a process of forming a hole in the object to be processed using a laser processing apparatus according to an embodiment of the present invention.
  • Figure 6 shows a process of forming a line (line) on the object to be processed using a general laser processing apparatus.
  • Figure 7 shows a process of forming a line on the object to be processed using a laser processing apparatus according to an embodiment of the present invention.
  • a laser processing apparatus for processing the object to be loaded on the stage using a laser, the laser light source; A first scanner for rotating the laser beam emitted from the laser light source by driving; A second scanner for moving the laser beam emitted from the first scanner to a predetermined position of the object to be processed by driving; And a scanner controller configured to control driving of the first scanner and the second scanner.
  • the apparatus may further include a position tracking unit configured to track a machining position of the object to be processed and transmit the same to the scanner controller.
  • An angle amplifier provided between the first scanner and the second scanner and amplifying a rotation radius of the laser beam emitted from the first scanner may be further included.
  • the first scanner may include a pair of first and second mirrors driving with a predetermined phase difference.
  • a beam delivery system may be provided on the optical path of the laser beam.
  • Laser processing method is a laser light source; A first scanner for rotating the laser beam emitted from the laser light source by driving; A second scanner for moving the laser beam emitted from the first scanner by a driving to a predetermined position of the object to be processed; And a scanner controller configured to control driving of the first scanner and the second scanner; and forming a hole in the object to be loaded on a stage using a laser processing apparatus.
  • Driving of the first scanner and the second scanner may be controlled in synchronization with each other.
  • the position tracking unit is to track the position of the processing area of the object to be moved to the scanner control unit, the scanner control unit is It can be made by controlling the driving of the second scanner to move along the processing area of the processing object.
  • the scanner controller may control the second scanner to perform a machining operation at a predetermined position of the object in consideration of the moving speed of the stage and the driving speed of the second scanner.
  • Laser processing method is a laser light source; A first scanner for rotating the laser beam emitted from the laser light source by driving; A second scanner for moving the laser beam emitted from the first scanner by a driving to a predetermined position of the object to be processed; And a scanner control unit for controlling driving of the first scanner and the second scanner; and forming a line on the object to be loaded on a stage using a laser processing apparatus. 1 driving a scanner to rotate the laser beam emitted from the laser light source; And driving the second scanner to move the rotating laser beam along a line to be processed.
  • Driving of the first scanner and the second scanner may be controlled in synchronization with each other.
  • the moving of the rotating laser beam along a line to be processed may include transmitting a machining position of the workpiece to which the position tracking unit is moving to a scanner controller, wherein the scanner controller is configured to transmit the laser beam to the scanner controller. This can be done by controlling the drive of the second scanner to move along the machining position.
  • the scanner controller may control the second scanner to perform a machining operation at a predetermined position of the object in consideration of the moving speed of the stage and the driving speed of the second scanner.
  • a laser processing method comprising: generating a laser beam from a laser light source, the laser processing method of processing a processing object loaded on a stage using a laser; Rotating the laser beam emitted from the laser light source by driving; And moving the laser beam to a predetermined position of the object to be processed by driving.
  • FIG. 1 schematically shows a laser processing apparatus 100 according to an embodiment of the present invention.
  • 2 schematically shows the structure of the first scanner 120 in the laser processing apparatus 100 according to the embodiment of the present invention.
  • 3 is a view for explaining the function of the angle amplifier 130 in the laser processing apparatus 100 according to an embodiment of the present invention.
  • the laser processing apparatus 100 processes the object to be processed W mounted on the stage S by using a laser.
  • the laser processing apparatus 100 includes a laser light source 110, a first scanner 120, an angle amplifier 130, a second scanner 140, a scanner controller 150, and a focusing lens 160.
  • the laser light source 110 refers to a means for emitting the laser beam (L), the laser light source 110 is a gas, a liquid, a solid laser light source according to the type of material generating the laser beam (L) Can be classified. In addition, the laser light source 110 may emit, for example, a pulsed laser beam, but is not limited thereto, and may emit a continuous wave laser beam according to the type of processing operation.
  • the first scanner 120 may rotate the laser beam L emitted from the laser light source 110 by driving.
  • the first scanner 120 includes a first mirror 121 and a second mirror 122.
  • the first mirror 121 may control the x-axis (or y-axis) movement of the laser beam L
  • the second mirror 122 may control the y-axis (or x-axis) movement.
  • the x-axis and the y-axis may refer to two axes perpendicular to the same plane as the surface of the processing object W when the laser beam L is irradiated onto the processing object W.
  • FIG. In order to rotate the laser beam L, the first mirror 121 and the second mirror 122 may be driven with a predetermined phase difference.
  • the first mirror 121 and the second mirror 122 may be driven according to a sin function or a cos function, and may be driven with a phase difference of 90 ° to each other.
  • the displacements of the first mirror 121 and the second mirror 122 that are moved to the maximum, that is, the amplitude may be the same. Since the first mirror 121 and the second mirror 122 are driven by a sin function or a cos function having a phase difference of 90 ° to each other, and the amplitude is also the same, the laser beam L is driven by the driving of the first scanner 120. It can be rotated by
  • the angle amplifier 130 may be provided between the first scanner 120 and the second scanner 140, and the rotation radius of the laser beam L emitted from the first scanner 120 may be adjusted. It can act to amplify. Since the rotation radius of the laser beam L may be increased by the angle amplifier 130, the laser beam L may be driven even when the first scanner 120 drives a circle smaller than the size of the circle to be formed. Rotational movements can be made to form circles of the desired size. In this case, the displacement, that is, the amplitude, of the first mirror 121 and the second mirror 122 to form a circle of a desired size may be smaller than in the case where the angle amplifier 130 is not present. Therefore, the time required for processing the object to be processed W can be reduced. In addition, the displacement of the first mirror 121 and the second mirror 122 affects the mirror size of the second scanner, but if the amplitude of the first mirror 121 and the second mirror 122 is reduced In addition, the mirror size of the second scanner may also be reduced.
  • the second scanner 140 performs a predetermined machining operation on the object to be processed by scanning the laser beam L on the object to be processed.
  • a 2D galvanometer that scans the laser beam L in the x-axis and y-axis directions parallel to the plane of the object W and perpendicular to each other may be used.
  • the 2D galvanometer can improve the precision of the laser processing operation by finely controlling the scan point of the laser beam (L).
  • the second scanner 140 may position the laser beam L in the processing area and control the linear motion of the laser beam L.
  • a beam delivery system (not shown) may be provided on the optical path of the laser beam L.
  • a beam delivery system is for delivering the laser beam L emitted from the laser light source 110 along a predetermined path, and may include, for example, a plurality of mirrors or an optical cable.
  • the scanner controller 150 controls the driving of the first scanner 120 and the second scanner 140. In addition, the scanner controller 150 may synchronize and control driving of the first scanner 120 and the second scanner 140.
  • a focusing lens 160 may be provided between the second scanner 140 and the object to be processed (W).
  • the focusing lens 160 may serve to adjust the focus of the laser beam L so that the laser beam L passing through the second scanner 140 may be focused at a desired position of the processing object W.
  • the laser processing apparatus 100 controls the linear motion and the rotational motion of the laser beam L by different driving, that is, driving the first scanner 120 and the second scanner 140.
  • driving that is, driving the first scanner 120 and the second scanner 140.
  • Figure 4 schematically shows a laser processing apparatus 200 according to another embodiment of the present invention.
  • the laser processing apparatus 200 illustrated in FIG. 4 further includes a position tracking unit 270 connected to the scanner controller 150 and 250 and the stage S in the laser processing apparatus 100 illustrated in FIG. 1.
  • the position tracking unit 270 serves to track the position of the stage S. That is, the position tracking unit 270 tracks the position of the stage S when the processing object W moves by the stage S during the laser processing operation, so that the position tracking unit 270 of the processing object W loaded on the stage S
  • the position signal is transmitted to the scanner controller 250.
  • the position tracking unit 270 may be provided to track the moving stage (S).
  • the present invention is not limited thereto, and the position tracking unit 270 may be provided to directly track the position of the moving object to be processed.
  • the scanner controller 250 may perform the machining operation on the moving object to be processed W by controlling the first scanner 220 and the second scanner 240.
  • the laser processing apparatus 200 can be continuously made without interrupting the laser processing operation even while the processing object W is moving, the time required for processing the processing object W can be greatly reduced. .
  • FIG. 5 illustrates a process of forming holes h1, h2, h3, and h4 in the object to be processed W by using the laser processing apparatuses 100 and 200 according to the exemplary embodiment of the present invention.
  • the first scanner 120 is driven to rotate the laser beam L emitted from the laser light source 110 to a size corresponding to a hole h1 to be processed.
  • the first and second mirrors 121 and 122 of FIG. 2 may move to rotate the laser beam L to correspond to the size of the hole h1.
  • the laser beam L that rotates to correspond to the size of the hole h1 may be formed by adjusting the maximum displacement of the first and second mirrors 121 and 122, that is, the amplitude.
  • the laser beam L is not emitted from the laser light source 110.
  • the first scanner 120 is driven to perform a rotational motion corresponding to the size of the hole h1.
  • the second laser beam 140 may be driven to position the laser beam L emitted from the first scanner 120 in the processing area of the object to be processed. Even in this step, the laser beam L is not emitted from the laser light source 110. However, when the laser beam L is emitted from the laser light source 110, the second scanner 140 is driven to irradiate the laser beam L to the position of the hole h1 to be processed.
  • the laser beam L is emitted from the laser light source 110 to form a hole h1 on the object to be processed.
  • the laser beam L is driven to rotate by the driving of the first mirror 121 and the second mirror 122 located in the first scanner 120 and processed by the second scanner 140. Since the laser beam L is controlled to irradiate the position of the hole h1 to be irradiated, the laser beam L may form the hole h1 on the object to be processed.
  • the second scanner 140 may drive to irradiate the laser beam L to the position of the hole h2 to be processed next.
  • the laser beam L may not be emitted from the laser light source 110.
  • the first and second mirrors 121 and 122 of the first scanner 120 may also change their maximum displacement, that is, amplitude.
  • the amplitudes of the first and second mirrors 121 and 122 may not be changed.
  • the amplitudes of the first and second mirrors 121 and 122 may be varied so that L may perform a rotational motion corresponding to the size of the hole h2 to be processed.
  • the laser beam L may be emitted from the laser light source 110.
  • the laser beam L forms a hole h2 on the object to be processed.
  • Figure 6 shows a process of forming a line (line) on the object to be processed using a general laser processing apparatus.
  • a general laser processing apparatus forms a line in a straight line when forming a line in a processing object W.
  • FIG. The machining movement line 310 refers to a line to which the laser beam L is irradiated.
  • the processing line L1 may be formed.
  • the processing line L1 has a predetermined processing width 320, which may be determined according to the beam size of the laser beam L. In the case of forming a processing line with a width wider than the processing width 320 according to the beam size of the laser beam L, the above-mentioned processing operation must be performed several times, which may cause a problem of increasing processing time. .
  • FIG. 7 illustrates a process of forming a line on an object to be processed using the laser processing apparatus 100 or 200 according to the embodiment of the present invention.
  • the first scanner 120 is driven to rotate the laser beam L emitted from the laser light source 110.
  • the second scanner 140 moves the rotating laser beam L along the line to be processed. Since the rotational motion by the first scanner 120 and the linear motion by the second scanner 140 are performed at the same time, the processing movement line 410 of the laser beam L may have a shape as shown in FIG. 7. Can be.
  • the processing line L2 may be formed by the laser beam L irradiated to the processing object W along the processing movement line 410. Since there is a beam size of the laser beam L, the processing width 420 of the processing line L2 may be formed wider than the diameter of the processing movement line 410.
  • the machining width 420 of the machining line L2 may be greater than the machining width 320 of the machining line L1 shown in FIG. 6. Therefore, since the machining operation does not need to be performed several times at the time of forming a line having a width larger than the beam size, it is possible to greatly reduce the time required for processing the object (W).

Abstract

L'invention concerne un dispositif de traitement au laser et un procédé de traitement au laser utilisant celui-ci. Ledit dispositif de traitement selon l'invention destiné à traiter un objet devant être traité, qui est chargé sur une platine, à l'aide d'un laser, comprend : une source de lumière laser; un premier scanner qui est entraîné pour faire tourner un faisceau laser émis par la source de lumière laser; un second scanner qui est entraîné pour déplacer le faisceau laser émis du premier scanner vers une position prédéfinie de l'objet devant être traité; et une unité de commande de scanner destinée à commander l'entraînement du premier scanner et du second scanner.
PCT/KR2016/008775 2015-08-31 2016-08-10 Dispositif de traitement au laser et procédé de traitement au laser utilisant celui-ci WO2017039169A1 (fr)

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KR1020150123208A KR101796198B1 (ko) 2015-08-31 2015-08-31 레이저 가공장치 및 이를 이용한 레이저 가공방법
KR10-2015-0123208 2015-08-31

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Publication number Priority date Publication date Assignee Title
DE102017211982B4 (de) * 2017-07-13 2019-04-18 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Vorrichtung zum Fügen von mindestens zwei Werkstücken
KR102189459B1 (ko) * 2019-08-28 2020-12-11 주식회사 유니오텍 홀 가공 방법 및 그 장치
JP7420548B2 (ja) * 2019-12-24 2024-01-23 ファナック株式会社 ワーク搬送システム
KR102654236B1 (ko) * 2022-03-07 2024-04-03 주식회사 코윈디에스티 레이저 빔의 균질도가 향상된 레이저 가공 시스템

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10289943A (ja) * 1997-04-16 1998-10-27 Canon Inc ステージ装置およびデバイス製造方法
KR20110129791A (ko) * 2010-05-26 2011-12-02 한국기계연구원 레이저 가공 시스템 및 이를 이용한 레이저 가공 방법
KR20140030808A (ko) * 2012-09-04 2014-03-12 (주)하드램 유리 기판 레이저 절단 장치 및 방법
KR20140144390A (ko) * 2013-06-10 2014-12-19 (주)엔에스 레이저를 이용한 필름 절단장치 및 절단방법
KR20150086374A (ko) * 2013-02-27 2015-07-27 미츠비시 쥬고교 가부시키가이샤 가공장치 및 가공방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5207827B2 (ja) * 2008-05-22 2013-06-12 キヤノン株式会社 ガルバノ装置、加工装置、ガルバノ装置におけるミラーの倒れ角を得る方法、および、加工方法
CN105102171B (zh) * 2013-02-13 2018-01-30 住友化学株式会社 光学部件贴合体的制造装置
JP6345064B2 (ja) * 2013-11-22 2018-06-20 三菱電機株式会社 形状可変鏡およびレーザ加工装置
TWM486507U (zh) * 2014-03-13 2014-09-21 Tong Tai Machine & Tool Co Ltd 雷射加工系統、偵測模組及判斷電路

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10289943A (ja) * 1997-04-16 1998-10-27 Canon Inc ステージ装置およびデバイス製造方法
KR20110129791A (ko) * 2010-05-26 2011-12-02 한국기계연구원 레이저 가공 시스템 및 이를 이용한 레이저 가공 방법
KR20140030808A (ko) * 2012-09-04 2014-03-12 (주)하드램 유리 기판 레이저 절단 장치 및 방법
KR20150086374A (ko) * 2013-02-27 2015-07-27 미츠비시 쥬고교 가부시키가이샤 가공장치 및 가공방법
KR20140144390A (ko) * 2013-06-10 2014-12-19 (주)엔에스 레이저를 이용한 필름 절단장치 및 절단방법

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TW201713445A (zh) 2017-04-16
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KR20170025997A (ko) 2017-03-08

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