WO2013065947A1 - Appareil d'usinage laser pouvant effectuer un usinage à deux faisceaux et procédé associé - Google Patents

Appareil d'usinage laser pouvant effectuer un usinage à deux faisceaux et procédé associé Download PDF

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Publication number
WO2013065947A1
WO2013065947A1 PCT/KR2012/007474 KR2012007474W WO2013065947A1 WO 2013065947 A1 WO2013065947 A1 WO 2013065947A1 KR 2012007474 W KR2012007474 W KR 2012007474W WO 2013065947 A1 WO2013065947 A1 WO 2013065947A1
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WO
WIPO (PCT)
Prior art keywords
laser beam
deflection unit
laser
incident
scanner
Prior art date
Application number
PCT/KR2012/007474
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English (en)
Korean (ko)
Inventor
성진우
성천야
Original Assignee
주식회사 이오테크닉스
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Publication of WO2013065947A1 publication Critical patent/WO2013065947A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane

Definitions

  • the present invention relates to a laser processing apparatus and a laser processing method which can be processed simultaneously using two beams.
  • the laser processing apparatus irradiates a laser beam emitted from a laser oscillator to a processing object through a scanner. Thereby, laser processing such as marking, exposure, etching, punching, scribing, or the like on one plane of the object may be performed.
  • a telecentric lens is employed for injecting light of a predetermined incidence angle range perpendicularly to the object to be processed.
  • the scanner can deflect the laser beam in the X, Y direction, for example.
  • Two scanning means are generally employed to deflect the laser beam in two directions.
  • X-scan means having an oscillating X-scan mirror
  • Y-scan means having an oscillating Y-scan mirror may be employed.
  • the optical system is generally designed by placing an aperture stop of the telecentric lens between the X-scan mirror and the Y-scan mirror.
  • two scanners are required to deflect the two laser beams respectively.
  • the optical characteristics of the two laser beams may be different because the incident pupils of the telecentric lenses with respect to the two scanners are different from each other. This can hinder uniform processing quality.
  • Laser processing apparatus capable of two-beam processing according to the present invention, the first scanner for biasing the incident laser beam in at least one of the first direction and a second direction orthogonal thereto; A first laser beam incident on the incident point of the first scanner; A second laser beam not parallel to the first laser beam; A second scanner for adjusting the angle of the second laser beam with respect to the first laser beam to allow the second laser beam to enter the incident point; And a condenser lens disposed at an exit side of the first scanner to condense the first and second laser beams at different positions of the object to be processed, respectively.
  • the laser processing apparatus may include a first second laser generator configured to generate the first and second laser beams, respectively.
  • the laser processing apparatus may include an optical splitter that splits a laser beam radiated from a laser generator into the first and second laser beams.
  • the second scanner may include a third deflection unit which is movable in one of the first direction and the second direction and reflects the second laser beam to enter the incident point.
  • the first scanner includes first and second deflection units that sequentially deflect the incident laser beam in a first direction and a second direction perpendicular to the first direction, wherein the incident point is located at the first deflection unit. Can be.
  • the second scanner may include: a third deflection unit which is movable in one of the first direction and the second direction and reflects the second laser beam in another direction of the first direction and the second direction; And a fourth deflection unit movable in the first direction and the second direction and allowing the second laser beam reflected by the third deflection unit to enter the incident point.
  • the third deflection unit is installed on a first stage movable in one of the first direction and the second direction, and the fourth deflection unit is mounted on the first stage in the first direction and the second direction.
  • the second stage may be installed to be movable in the other direction.
  • the fourth deflection unit may include a reflection mirror and a driving motor for adjusting the reflection angle by rotating the reflection mirror.
  • the condensing lens may be a telecentric lens.
  • a laser processing apparatus including: a first scanner including first and second deflecting units that sequentially deflect an incident laser beam in a first direction and a second direction perpendicular to the first direction; A first laser beam incident on the incident point of the first deflection unit; A second laser beam irradiated in the first direction; A third deflection unit movable in the first direction and reflecting the second laser beam to enter the incident point; And a telecentric lens disposed at an exit side of the first scanner to condense the first and second laser beams at different positions of the object to be processed, respectively.
  • the third deflection unit reflects the second laser beam in the second direction, and is movable in the second direction, wherein the laser processing apparatus includes the second laser beam reflected by the third deflection unit. And a fourth deflection unit incident on the incident point.
  • a laser processing method including: (a) injecting a first laser beam into an incident point of a first scanner and deflecting at least one of a first direction and a second direction orthogonal thereto; (b) incident a second laser beam at an incidence point of the first scanner to be inclined with respect to the first laser beam and deflecting at least one of the first direction and the second direction; and (c) focusing the deflected first and second laser beams onto an object to be processed using a condenser lens.
  • Step (b) may include: irradiating the second laser beam in one of the first and second directions;
  • the method may include moving the third deflection unit in any one direction, and reflecting the second laser beam to the incident point by using the third deflection unit.
  • Step (b) may include: irradiating the second laser beam in one of the first and second directions; Moving the third deflection unit in one direction and reflecting the second laser beam in the other direction of the first direction and the second direction by using the third deflection unit; And moving a fourth deflection unit in the other direction and reflecting the second laser beam reflected by the third deflection unit using the fourth deflection unit to enter the incident point.
  • the condensing lens may be a telecentric lens.
  • the two laser beams are incident on the condenser lens through a common incident pupil, the optical characteristics of the two laser beams are the same. Therefore, it is possible to implement a two-beam laser processing apparatus and method with improved processing uniformity.
  • FIG. 1 is a block diagram of an embodiment of a laser processing apparatus according to the present invention.
  • FIG. 2 is a perspective view schematically showing an example of an optical configuration of the first and second scanners applied to one embodiment of the laser processing apparatus shown in FIG. 1.
  • FIG. 2 is a perspective view schematically showing an example of an optical configuration of the first and second scanners applied to one embodiment of the laser processing apparatus shown in FIG. 1.
  • FIG. 3 is a perspective view schematically showing another example of the optical configuration of the first and second scanners applied to one embodiment of the laser processing apparatus shown in FIG. 1;
  • FIG. 4 is a perspective view schematically showing another example of an optical configuration of the first and second scanners applied to the embodiment of the laser processing apparatus shown in FIG. 1;
  • the laser processing apparatus of the present embodiment focuses two laser beams L1 and L2 onto the object to be processed W mounted on the table 50 using the condenser lens 300. For example, marking, etching, exposure, punching, scribing, etc. are performed.
  • the table 50 and / or the optical unit 500 may be moved in the X direction and / or the Y direction to move the processing ranges S, S1, S2, and S3 described later.
  • the two laser beams L1 and L2 may be generated by, for example, branching the laser beam L emitted from one laser generator 101 by using the optical separator 103.
  • two laser beams L1 and L2 may be irradiated from the laser generators 101 and 102, respectively.
  • the light separator 103 may be, for example, a polarization separator that transmits or reflects light according to a polarization direction, for example, S polarization or P polarization.
  • the optical separator 103 may be a half mirror that partially transmits and partially reflects an incident laser beam.
  • the first scanner 100 is employed to irradiate the first laser beam L1 to a desired position of the object to be processed.
  • the first scanner 100 deflects the laser beam in the X direction (first direction) or Y direction (second direction) or in the X direction and the Y direction.
  • the first scanner 100 described below is a biaxial scanner that deflects the laser beam in the X and Y directions.
  • the laser beam L irradiated from the laser generator 101 is branched into the first and second laser beams L1 and L2 by the optical separator 103.
  • the first laser beam L1 passes through the optical separator 103
  • the second laser beam L2 is reflected by the optical separator 103 and travels in the X direction.
  • the first scanner 100 is provided with a first deflection unit 120 for deflecting the first laser beam L1 in the X direction and a second deflection unit 130 for deflecting the laser beam in the Y direction.
  • the first deflection unit 120 includes an X-deflection mirror 121 and an X-deflection motor 122
  • the second deflection unit 130 includes the Y-deflection mirror 131 and the Y-deflection motor 132. It includes.
  • the first laser beam L1 is incident on the incident point P of the first deflection unit 120, that is, at a predetermined position on the surface of the X-deflection mirror 121.
  • the first laser beam L1 is deflected in the X direction.
  • the first laser beam L1 deflected in the X direction is incident on the second deflection unit 130.
  • the Y-deflection mirror 131 is rotated, the first laser beam L1 is deflected in the Y direction.
  • the condenser lens 300 condenses the first laser beam L1 deflected in the X direction and the Y direction at a predetermined position of the object to be processed.
  • the condenser lens 300 may be, for example, a telecentric lens, and incident a beam incident within a predetermined angle range perpendicularly to the object to be processed (W).
  • the condenser lens 300 may be an F-theta telecentric lens having an F-theta function in which the position of the imaging point is linearly determined according to the incident angle.
  • the incident pupil 400 which is a reference for the optical design of the condenser lens 300, may include, for example, first and second deflection units 120 and 130 such that the telecentric error is not unilaterally biased in the X or Y direction. Can be determined between.
  • the first laser beam L1 can be deflected in the X direction and the Y direction by using the first scanner 100 to be irradiated to a desired position of the object to be processed (W).
  • Machining can be performed simultaneously with two laser beams to improve the machining speed.
  • providing a separate condenser lens 300 for the two laser beams may incur additional costs.
  • uniformity of processing may be impaired due to differences in optical characteristics of the two laser beams.
  • the second laser beams L1 and L2 are deflected in the X direction and / or the Y direction using the first scanner 100, and a common condenser lens 300 is used. 2 beam processing is possible by irradiating the 1st, 2nd laser beam L1, L2 on the process target object W by the said 2nd process.
  • the second scanner 200 is provided to irradiate the first and second laser beams L1 and L2 to other positions on the object W.
  • the second scanner 200 may include a third deflection unit 210.
  • the third deflection unit 210 may include a reflection mirror 211 and a driving motor 212.
  • the third deflection unit 210 may be moved in the X direction.
  • the third deflection unit 210 may be mounted on the stage 213 moved in the X direction.
  • the second laser beam L2 separated from the laser beam L by the optical separator 103 runs in the X direction, for example.
  • the third deflection unit 210 reflects the second laser beam L2 at a position separated by a predetermined distance in the X direction with respect to the first laser beam L1, and thus, the incident point P of the first scanner 100, eg For example, the light is incident on the incident point P of the first deflection unit 120.
  • the control unit (not shown) may be configured, for example, from the detection signal of the encoder (not shown) of the third deflection unit 210. The position is detected and the reflection mirror 211 is rotated so that the second laser beam L1 is incident on the incident point P by driving the driving motor 212 based on the position information.
  • the second laser beam L2 may always be incident at the incident point P regardless of the position of the third deflection unit 210 in the X direction.
  • the second laser beam L2 is deflected in the X direction and the Y direction by the first scanner 100 and is focused on the object W by the condenser lens 300.
  • the first laser beam L1 and the second laser beam L2 can be irradiated to the processing object W using the same first scanner 100 and the condenser lens 300.
  • the amount of deflection in the X direction of the second laser beam L2 with respect to the first laser beam L1 on the object W is first and second laser beams L1 incident on the incident point P in the XZ plane. It may be determined by the angle between the L2 and the focal length of the condensing lens 300. For example, when the focal length of the condenser lens 300 is f and the angle between the first and second laser beams L1 and L2 is ⁇ X (radian), the amount of displacement dx in the X direction is
  • the second laser beam L2 is irradiated at a position separated by dx from the first laser beam L1 together with the machining using the first laser beam L1 on the workpiece W at the same time. Machining is possible. That is, it is possible to process over the machining range indicated by S by the first laser beam L1, and the machining range S1 shifted by dx in the X direction from the machining range S by the second laser beam L2. Machining on is possible simultaneously. As described above, by adjusting the angle of the second laser beam L2 with respect to the first laser beam L1 using the second scanner 200, a faster and more efficient processing is possible by the processing using the two beams.
  • the first and second laser beams L1 and L2 are deflected together by the first scanner 100, the first and second laser beams L1 and L2 are configured to share a common incident pupil 400.
  • the incident light is incident on the condenser lens 300.
  • the telecentric errors of the first and second laser beams L1 and L2 are the same, so there is no difference in the relative telecentric error between the first and second laser beams L1 and L2. Therefore, even if the first and second laser beams L1 and L2 are used simultaneously, uniformity in processing can be ensured. In addition, a relatively wide processing range can be ensured with respect to the case of using one laser beam.
  • the second scanner 200 which shifts the second laser beam L2 in the X direction with respect to the first laser beam L1 has been described.
  • the second scanner 200 includes the second laser beam ( L2) may be shifted in the Y direction with respect to the first laser beam L1.
  • the second scanner 200 includes a third deflection unit 220 including a reflection mirror 221 and a driving motor 222 to deflect the second laser beam L2 in the Y direction. It can be provided.
  • the third deflection unit 220 may move in the Y direction.
  • the third deflection unit 220 may be mounted on the stage 223 moved in the Y direction.
  • the second laser beam L2 separated by the optical separator 103 runs in the Y direction, for example.
  • the third deflection unit 220 reflects the second laser beam L2 at a position spaced apart in the Y direction with respect to the first laser beam L1 by the incident point P of the first scanner 100, eg, For example, the light is incident on the incident point P of the first deflection unit 120.
  • the driving motor 222 rotates the reflection mirror 221 to allow the second laser beam L2 to enter the incident point P.
  • the second laser beam L2 may always be incident at the incident point P regardless of the position of the third deflection unit 220 in the Y direction.
  • the second laser beam L2 is deflected in the X direction and the Y direction by the first scanner 100 and is focused on the object W by the condenser lens 300.
  • the deflection amount in the Y direction of the second laser beam L2 with respect to the first laser beam L2 on the object W is first and second laser beams L1 incident on the incident point P in the YZ plane. It may be determined by the angle between the L2 and the focal length of the condensing lens 300. For example, if the focal length of the condenser lens 300 is f and the angle between the first and second laser beams L1 and L2 is ⁇ y (radian), the amount of displacement dy in the Y direction is
  • the second laser beam L2 is irradiated at a position separated by dy from the first laser beam L1 together with the machining using the first laser beam L1 on the object W, and simultaneously placed in two positions. Machining is possible, and machining is possible simultaneously for the machining range S2 shifted by dy in the Y direction from the machining range S of the first laser beam L1 by the second laser beam L2. In this way, the machining using two beams enables faster and more efficient machining, and there is no difference in relative telecentric error between the first and second laser beams L1 and L2, thereby ensuring uniformity in machining. have.
  • FIG. 4 as another embodiment of the laser processing apparatus according to the present invention, a second scanner 200 which biases the second laser beam L2 in the X and Y directions with respect to the first laser beam L1 is provided. Laser processing apparatus is shown.
  • the second scanner 200 may include a third deflection unit 230 and a fourth deflection unit 240.
  • the third deflection unit 230 may be moved in the X direction.
  • the third deflection unit 230 may be implemented by the reflection mirror 231 installed in the stage 233 movable in the X direction.
  • the reflection mirror 231 reflects the second laser beam L2 traveling in the X direction in the Y direction. That is, the reflective mirror 231 may be fixedly installed on the cage 233 to form an angle of 45 degrees in the XY plane.
  • the fourth deflection unit 240 may include a reflection mirror 241 and a driving motor 242.
  • the fourth deflection unit 240 may be moved in the Y direction.
  • the fourth deflection unit 240 may be mounted on the stage 243 installed in the stage 233 to be movable in the Y direction.
  • the driving motor 242 rotates the reflection mirror 241 to inject the second laser beam L2, which is biased in the X and Y directions by the reflection mirror 231 and the reflection mirror 241, to the incident point P. . That is, the positions of the stage 233 and the stage 243 are detected by, for example, an encoder (not shown). As a result, the controller (not shown) drives the driving motor 242 to rotate the reflection mirror 241.
  • the second laser beam L2 is controlled to face the incident point P.
  • FIG. Accordingly, the second laser beam L2 forms an angle ⁇ xy with respect to the first laser beam L1 regardless of the positions of the third and fourth deflection units 230 and 240, and is always at the incident point P. Can be incident to.
  • the second laser beam L2 is deflected in the X direction and the Y direction by the first scanner 100 and is focused on the object W by the condenser lens 300.
  • the deflection amounts in the X and Y directions of the second laser beam L2 with respect to the first laser beam L1 on the object W are first and second incident on the incident point P in the XZ plane and the YZ plane.
  • the distance between the two laser beams L1 and L2 and the focal length of the condenser lens 300 may be determined.
  • the focal length of the condenser lens 300 is f
  • the angle between the first and second laser beams L1 and L2 in the XZ plane is ⁇ x (radian) and the first and second in the YZ plane.
  • the angle between two laser beams L1 and L2 is ⁇ y (radian)
  • the deviation amounts dx and dy in the X and Y directions are respectively
  • the second laser beam L2 is irradiated at a position (dx, dy) away from the first laser beam L1 on the object to be processed, so that machining at two positions is possible at the same time. That is, it is possible to process over the machining range indicated by S by the first laser beam (L1), and the machining range (S3) shifted by (dx, dy) from the machining range S by the second laser beam (L2) ) Can be processed simultaneously.
  • the processing using two beams enables faster and more efficient processing, and since the first and second laser beams L1 and L2 share the incident pupil 400, the first and second laser beams L1. Since there is no difference in relative telecentric error between (L2), uniformity of processing can be ensured.
  • the third deflection unit 230 implements the deflection in the X direction and the fourth deflection unit 240 implements the deflection in the Y direction is described, but the scope of the present invention is not limited thereto.
  • the stage 233 on which the third deflection unit 230 is mounted is moved in the Y direction, and the third deflection unit 230 moves the second laser beam L2 traveling in the Y direction to X. Can be reflected in the direction.
  • the fourth deflection unit 240 is mounted on the stage 240 installed in the stage 233 so as to be movable in the X direction, and the second laser beam reflected by the third deflection unit 230 in the Y direction ( L2) may be reflected to the incident point P.
  • FIG. 1 the fourth deflection unit 240 is mounted on the stage 240 installed in the stage 233 so as to be movable in the X direction, and the second laser beam reflected by the third deflection unit 230 in the Y direction ( L2) may be reflected to the incident point P.
  • the first laser beam using the second scanner 200 at the incidence point P of the first scanner 100 which deflects the first laser beam L1 in the X direction and / or the Y direction.
  • the first and second laser beams L1 and L2 are simultaneously deflected by using the first scanner 100 to collect one condenser lens 300.
  • the relative position of the second laser beam L2 with respect to the first laser beam L1 on the object W that is, the amount of deflection, is the first laser of the second laser beam L2 incident on the incident point P. It can be adjusted by adjusting the angle to the beam L1. This adjustment is possible by moving the third deflection unit 230 and / or the fourth deflection unit 240 in the X direction and / or the Y direction.
  • a laser processing apparatus and method capable of rapidly and effectively two-beam laser processing as well as extending the processing range can be implemented.
  • the first and second laser beams L1 and L2 share the incident pupil 400 of the condenser lens 300, there is no relative difference in telecentric error. Therefore, the uniformity of the processing quality by 2-beam processing can be improved.
  • the present invention is applied to a laser processing apparatus and method for irradiating a laser beam to a processing object to perform laser processing such as marking, exposure, etching, punching, scribing and cutting.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

Appareil d'usinage laser pouvant effectuer un usinage à deux faisceaux, l'appareil d'usinage laser comprenant : un premier dispositif à balayage destiné à faire dévier un faisceau laser incident vers une première direction et/ou une seconde direction qui est orthogonale à la première direction ; un premier faisceau laser qui est incident sur le point d'incidence du premier dispositif à balayage ; un second faisceau laser qui n'est pas parallèle au premier faisceau laser ; un second dispositif à balayage destiné à régler l'angle du second faisceau laser sur le premier faisceau laser de sorte que l'incidence du second faisceau laser se trouve sur le point d'incident du second dispositif à balayage ; et une lentille de condensation, qui est positionnée sur le côté sortie du premier dispositif à balayage, pour condenser les premier et second faisceaux laser sur des emplacements mutuellement différents de l'objet cible.
PCT/KR2012/007474 2011-11-01 2012-09-19 Appareil d'usinage laser pouvant effectuer un usinage à deux faisceaux et procédé associé WO2013065947A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110112879A KR101299234B1 (ko) 2011-11-01 2011-11-01 2빔 가공이 가능한 레이저 가공 장치 및 방법
KR10-2011-0112879 2011-11-01

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WO2013065947A1 true WO2013065947A1 (fr) 2013-05-10

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KR (1) KR101299234B1 (fr)
WO (1) WO2013065947A1 (fr)

Cited By (2)

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