WO2013065946A1 - Usinage laser pouvant effectuer un usinage à deux faisceaux - Google Patents

Usinage laser pouvant effectuer un usinage à deux faisceaux Download PDF

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Publication number
WO2013065946A1
WO2013065946A1 PCT/KR2012/007473 KR2012007473W WO2013065946A1 WO 2013065946 A1 WO2013065946 A1 WO 2013065946A1 KR 2012007473 W KR2012007473 W KR 2012007473W WO 2013065946 A1 WO2013065946 A1 WO 2013065946A1
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WO
WIPO (PCT)
Prior art keywords
laser
laser beam
lens
scanner
laser beams
Prior art date
Application number
PCT/KR2012/007473
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English (en)
Korean (ko)
Inventor
성진우
구제훈
Original Assignee
주식회사 이오테크닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 주식회사 이오테크닉스 filed Critical 주식회사 이오테크닉스
Publication of WO2013065946A1 publication Critical patent/WO2013065946A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane

Definitions

  • the present invention relates to a laser processing apparatus that can be processed simultaneously using two beams.
  • the laser processing apparatus irradiates a laser beam emitted from a laser oscillator to a processing object through a scanner. Thereby, laser processing such as marking, exposure, etching, punching, scribing, or the like on one plane of the object may be performed.
  • the scanner can deflect the laser beam in the X, Y direction, for example.
  • Two scanning means are generally employed to deflect the laser beam in two directions.
  • X-scan means having an oscillating X-scan mirror and Y-scan means having an oscillating Y-scan mirror may be employed.
  • two condensing lenses for condensing two separately scanned laser beams onto the object to be processed may be employed.
  • the incident pupils of the condenser lenses with respect to the two scanners are different from each other, the optical characteristics of the two laser beams may be different from each other, which may hinder uniform processing quality.
  • An object of the present invention is to provide a laser processing apparatus capable of focusing two laser beams using the same condenser lens.
  • Laser processing apparatus capable of two-beam processing according to the present invention, a first scanner for deflecting the first laser beam in at least one of the first direction and a second direction orthogonal thereto; A second scanner for deflecting a second laser beam in at least one of the first direction and the second direction; A condenser lens for condensing the first and second laser beams on an object to be processed; Selectively reflecting / passing the first laser beam and the second laser beam to guide the condensing lens, the opening passing through the first and second laser beams, and a reflecting portion reflecting the second laser beam It includes; a beam guide having.
  • the reflector may have a shape surrounding the opening.
  • the first laser beam is parallel with the optical axis of the condensing lens
  • the second laser beam intersects with the optical axis of the condensing lens
  • the reflecting portion of the beam guide reflects the second laser beam outside the range of the opening so that the It can be guided in parallel with the optical axis of the condensing lens.
  • the condenser lens may be an F-theta lens.
  • the condensing lens may be a telecentric lens.
  • the laser processing apparatus includes a laser generator for emitting a laser beam; An optical separator may be further configured to separate the laser beam into the first and second laser beams.
  • the laser processing apparatus may include first and second laser generators that irradiate the first and second laser beams, respectively.
  • the laser processing apparatus of the present invention it is possible to implement a two-beam laser processing apparatus capable of reducing the cost of irradiating a processing target with two laser beams using a single condenser lens.
  • the processing area by the two laser beams can be divided into the inner region and the outer region and processed simultaneously, and the processing quality can be improved by eliminating interference between the laser beams in the processing region.
  • FIG. 1 is a block diagram of an embodiment of a laser processing apparatus according to the present invention.
  • FIG. 2 is a configuration diagram schematically showing an example of an optical configuration of the first and second scanners applied to the embodiment of the laser processing apparatus shown in FIG. 1.
  • FIG. 2 is a configuration diagram schematically showing an example of an optical configuration of the first and second scanners applied to the embodiment of the laser processing apparatus shown in FIG. 1.
  • FIG. 3 is a perspective view illustrating an example of a first scanner
  • FIG. 4 is a view showing a state in which a processing region is divided into an inner first region and an outer second region.
  • FIG. 5 is a diagram illustrating an example of a beam guide.
  • the laser processing apparatus of the present embodiment focuses two laser beams L1 and L2 onto the object to be processed W mounted on the table 50 using the condenser lens 300. For example, marking, etching, exposure, punching, scribing, etc. are performed.
  • the two laser beams L1 and L2 may be generated by, for example, branching the laser beam L emitted from one laser generator 101 by using the optical separator 103.
  • two laser beams L1 and L2 may be irradiated from the first and second laser generators 101 and 102, respectively.
  • the light separator 103 may be, for example, a polarization separator that transmits or reflects light according to a polarization direction, for example, S polarization or P polarization.
  • the optical separator 103 may be a half mirror that partially transmits and partially reflects the laser beam L.
  • the laser beam L irradiated from the laser generator 101 branches into the first and second laser beams L1 and L2 by the optical separator 103.
  • the first laser beam L1 is reflected by the optical splitter 103, and the second laser beam L2 passes through the optical splitter 103.
  • the 1st, 2nd scanner 100,200 is employ
  • the first and second scanners 100 and 200 may deflect the laser beam in the X direction (first direction) or Y direction (second direction) or in the X direction and the Y direction.
  • the first and second scanners 100 and 200 described below are biaxial scanners which deflect the first and second laser beams L1 and L2 in the X and Y directions.
  • the first scanner 100 may include an X-deflection unit 120 and a Y-deflection unit 130 for deflecting the first laser beam L1 in the X and Y directions, respectively.
  • the second scanner 200 may include an X-deflection unit 220 and a Y-deflection unit 230 for deflecting the second laser beam L2 in the X and Y directions, respectively.
  • the Y-deflection unit 230 deflects the second laser beam L2 in the Z direction, but when the second laser beam L2 is deflected in the Y direction when reflected by the beam guide 400, the Y-deflection unit 230 deflects the Y-deflection unit. Name it.
  • the X-deflection unit 120 includes an X-deflection mirror 121 and an X-deflection motor 122
  • the Y-deflection unit 130 includes the Y-deflection mirror 131 and the Y-deflection motor 132. It includes.
  • the X-deflection motor 121 and the Y-deflection motor 131 rotate the X-deflection mirror 121 and the Y-deflection mirror 131, respectively.
  • the first laser beam L1 is incident on the X-deflection mirror 121. When the X-deflection mirror 121 is rotated, the first laser beam L1 is deflected in the X direction according to the rotation angle.
  • the first laser beam L1 deflected in the X direction is incident on the Y-deflection mirror 131.
  • the Y-deflection motor 132 rotates the Y-deflection mirror 131, and according to the rotation angle, the first laser beam L1 is deflected in the Y direction.
  • the second scanner 200 has the same configuration except that the first scanner 100, the X-deflection unit 220, and the Y-deflection unit 230 are arranged in a different position and order.
  • the first and second laser beams L1 and L2 deflected in the X and Y directions are incident to the beam guide 400.
  • the first and second laser beams L1 and L2 are guided to the condenser lens 300 by the beam guide 400.
  • the condenser lens 300 condenses the first and second laser beams L1 and L2 deflected in the X direction and the Y direction at a predetermined position of the object to be processed.
  • the condenser lens 300 may be, for example, an F-theta lens in which the position of the imaging point is linearly determined according to the incident angle.
  • the condenser lens 300 may be an F-theta telecentric lens having a telecentric function of vertically injecting a beam incident within a predetermined angle range to the object to be processed (W).
  • the two scanners 100 and 200 When the two laser beams L1 and L2 are incident in the same direction for two-beam processing, the two scanners 100 and 200 so that the laser beams L1 and L2 both pass through the condenser lens 300. It is never easy to place it.
  • the laser beams L1 and L2 emitted from the first and second scanners 100 and 200 are angled to each other, and the two laser beams L1 are formed using the beam guide 400.
  • a laser processing apparatus capable of easily 2-beam processing may be implemented.
  • the first laser beam L1 is parallel to the optical axis of the condenser lens 300
  • the second laser beam L2 is orthogonal to the optical axis of the condenser lens 300 so as to intersect with the optical axis of the condenser lens 300.
  • the processing areas by the first and second laser beams L1 and L2 can be distinguished from each other.
  • the first laser beam L1 processes the inner first region S1
  • the second laser beam L2 processes the second region outside the first region S2. It may be configured to process (S2).
  • the beam guide 400 may include an opening 410 and a reflector 420.
  • the reflector 420 may be shaped to surround the opening 410.
  • the first laser beam L1-1 parallel to the optical axis of the condenser lens 300 passes through the opening 410 and is incident to the condenser lens 300.
  • the first laser beam L1 may be deflected in the X direction and the Y direction by the first scanner 100 within the range of the opening 410. If there is the first laser beam L1-2 out of the range of the opening 410, it is blocked by the beam guide 400 and cannot be incident to the condensing lens 300.
  • the beam L2-2 passing through the opening 410 of the second laser beam L2 may not be incident to the condenser lens 300.
  • only the second laser beam L2-1 incident outside the range of the opening 410 and incident on the reflecting unit 420 is reflected by the reflecting unit 420 and is incident to the condensing lens 300.
  • the processing object W can be divided into a first region S1 on the inner side and a second region S2 on the outer side which surrounds it, and thus, separate processing can be performed.
  • the mutual interference of the two laser beams L1 and L2 can be prevented.
  • the first laser beam L1 deflected by the first scanner 100 passes through the opening 410 of the beam guide 400 and is incident to the condensing lens 300, and the second scanner 200.
  • the second laser beam L2 deflected by the light is reflected by the reflector 420 of the beam guide 400 and is incident to the condenser lens 300.
  • the beam guide 400 when the beam guide 400 is a polarizing member that selectively transmits / reflects the first and second laser beams L1 and L2 by using the difference in polarization instead of the opening 410, the beam guide ( The first laser beam L1 passing through 400 may vary depending on the angle of deflection of the optical path due to the wavelength, the amount of light, the thickness and refractive index of the beam guide 400, and the like. This difference causes a difference in the position of the imaging point according to the deflection angle of the first laser beam (L1), which impedes precision machining. In addition, the angle of incidence of the first laser beam L1 with respect to the object to be processed W may deviate from a right angle, and thus the precision of vertical hole processing may be degraded.
  • the effective processing range S1 of the first laser beam L1 deflected by the first scanner 100 may be very narrow. This is true even when the beam guide 400 is a dichroic member that selectively transmits / reflects the first and second laser beams L1 and L2 using a difference in wavelength instead of the opening 410.
  • the laser processing apparatus of this embodiment since the first laser beam L1 passes through the opening 410, the change of the optical path by the beam guide 400 while reaching the condenser lens 300 from the first scanner 100. There is no. Therefore, the above-mentioned problem can be prevented and precise laser processing is possible. In addition, the deflection angle of the first laser beam L1 by the first scanner 100 can be increased, so that the effective processing range S1 can be widened.
  • the present invention is applied to a laser processing apparatus that performs laser processing such as marking, exposure, etching, punching, scribing, cutting by irradiating a laser beam to a processing object.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

Appareil d'usinage laser comprenant : un premier dispositif à balayage destiné à faire dévier un premier faisceau laser vers une première direction et/ou une seconde direction qui est orthogonale à la première direction ; un second dispositif à balayage destiné à faire dévier le second faisceau laser vers la première direction et/ou la seconde direction ; une lentille de condensation destinée à condenser les premier et second faisceaux laser sur une cible d'usinage ; et un guide de faisceau destiné à guider les premier et second faisceaux laser jusqu'à la lentille de condensation par la réflexion ou la transmission sélective des faisceaux laser.
PCT/KR2012/007473 2011-11-01 2012-09-19 Usinage laser pouvant effectuer un usinage à deux faisceaux WO2013065946A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110112878A KR20130048004A (ko) 2011-11-01 2011-11-01 2빔 가공이 가능한 레이저 가공
KR10-2011-0112878 2011-11-01

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WO2013065946A1 true WO2013065946A1 (fr) 2013-05-10

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022069457A1 (fr) * 2020-09-29 2022-04-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Dispositif pour balayer un plan cible avec plusieurs faisceaux laser et son procédé de fonctionnement

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101955002B1 (ko) * 2016-11-18 2019-03-12 (주)레전스 레이저 식각 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63273587A (ja) * 1987-04-30 1988-11-10 Toshiba Corp レ−ザ加工方法
KR20060037568A (ko) * 2004-10-28 2006-05-03 주식회사 이오테크닉스 듀얼 빔 레이저 가공 시스템
KR100603904B1 (ko) * 2004-08-03 2006-07-24 주식회사 이오테크닉스 폴리곤 미러를 이용한 다중 레이저 가공장치
KR100841426B1 (ko) * 2002-12-26 2008-06-25 히다치 비아 메카닉스 가부시키가이샤 다중빔 레이저 구멍뚫기 가공장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63273587A (ja) * 1987-04-30 1988-11-10 Toshiba Corp レ−ザ加工方法
KR100841426B1 (ko) * 2002-12-26 2008-06-25 히다치 비아 메카닉스 가부시키가이샤 다중빔 레이저 구멍뚫기 가공장치
KR100603904B1 (ko) * 2004-08-03 2006-07-24 주식회사 이오테크닉스 폴리곤 미러를 이용한 다중 레이저 가공장치
KR20060037568A (ko) * 2004-10-28 2006-05-03 주식회사 이오테크닉스 듀얼 빔 레이저 가공 시스템

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022069457A1 (fr) * 2020-09-29 2022-04-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Dispositif pour balayer un plan cible avec plusieurs faisceaux laser et son procédé de fonctionnement

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