CN1842543A - 含导电聚合物的光致图案形成导电电极层 - Google Patents

含导电聚合物的光致图案形成导电电极层 Download PDF

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Publication number
CN1842543A
CN1842543A CNA200480024498XA CN200480024498A CN1842543A CN 1842543 A CN1842543 A CN 1842543A CN A200480024498X A CNA200480024498X A CN A200480024498XA CN 200480024498 A CN200480024498 A CN 200480024498A CN 1842543 A CN1842543 A CN 1842543A
Authority
CN
China
Prior art keywords
conductivity
conductive
modifier
conductive polymer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200480024498XA
Other languages
English (en)
Chinese (zh)
Inventor
M·莱伦塔尔
C·C·安德森
Y·王
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of CN1842543A publication Critical patent/CN1842543A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/093—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antistatic means, e.g. for charge depletion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/211—Changing the shape of the active layer in the devices, e.g. patterning by selective transformation of an existing layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
CNA200480024498XA 2003-08-26 2004-08-23 含导电聚合物的光致图案形成导电电极层 Pending CN1842543A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/648,419 2003-08-26
US10/648,419 US6893790B2 (en) 2003-08-26 2003-08-26 Photopatterning of conductive electrode layers containing electrically-conductive polymer particles

Publications (1)

Publication Number Publication Date
CN1842543A true CN1842543A (zh) 2006-10-04

Family

ID=34216726

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200480024498XA Pending CN1842543A (zh) 2003-08-26 2004-08-23 含导电聚合物的光致图案形成导电电极层

Country Status (7)

Country Link
US (1) US6893790B2 (enExample)
EP (1) EP1658313B1 (enExample)
JP (1) JP4842815B2 (enExample)
CN (1) CN1842543A (enExample)
DE (1) DE602004009201T2 (enExample)
TW (1) TW200530277A (enExample)
WO (1) WO2005021597A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102762026A (zh) * 2011-04-27 2012-10-31 瑞化股份有限公司 透明导电线路的构造及制造方法
CN101889061B (zh) * 2007-09-04 2013-03-13 H.C.斯达克克莱维欧斯有限公司 制备导电聚合物的方法
CN103713473A (zh) * 2013-12-29 2014-04-09 陕西师范大学 一种利用受限光催化氧化改性ito的方法及其应用
US8920971B2 (en) 2007-11-27 2014-12-30 Maria Strömme Composite materials including an intrinsically conducting polymer, and methods and devices
CN113444242A (zh) * 2021-07-16 2021-09-28 黑龙江大学 以三蝶烯为中心含甲氧基三苯胺类聚酰胺及其制备方法和应用
CN115826365A (zh) * 2022-12-23 2023-03-21 南京工业大学 一种通过全水基电子束曝光技术制备聚合物发光微纳结构的方法

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FI121831B (fi) * 2005-07-07 2011-04-29 M Real Oyj Anturirakenne, menetelmä sen valmistamiseksi ja siitä valmistettava tuote
KR101438172B1 (ko) * 2006-08-21 2014-09-11 아그파-게바에르트 엔.브이. 유기 도전성 층, 패턴 또는 인쇄물 제조용 ｕｖ­광중합성 조성물
US8836439B2 (en) * 2007-10-12 2014-09-16 Los Alamos National Security Llc Dynamic frequency tuning of electric and magnetic metamaterial response
JP4416032B2 (ja) * 2007-12-10 2010-02-17 セイコーエプソン株式会社 充填液
US8512933B2 (en) 2008-12-22 2013-08-20 Eastman Kodak Company Method of producing electronic circuit boards using electrophotography
US20100155128A1 (en) * 2008-12-22 2010-06-24 Tombs Thomas N Printed electronic circuit boards and other articles having patterned coonductive images
US20100159648A1 (en) * 2008-12-22 2010-06-24 Tombs Thomas N Electrophotograph printed electronic circuit boards
KR101898404B1 (ko) * 2014-12-17 2018-09-12 미쓰이 가가쿠 가부시키가이샤 기판 중간체, 관통 비어 전극 기판 및 관통 비어 전극 형성 방법

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101889061B (zh) * 2007-09-04 2013-03-13 H.C.斯达克克莱维欧斯有限公司 制备导电聚合物的方法
US8920971B2 (en) 2007-11-27 2014-12-30 Maria Strömme Composite materials including an intrinsically conducting polymer, and methods and devices
CN101874274B (zh) * 2007-11-27 2016-06-22 玛丽亚·斯特罗姆 包含本征型导电聚合物的复合材料及方法和装置
CN102762026A (zh) * 2011-04-27 2012-10-31 瑞化股份有限公司 透明导电线路的构造及制造方法
CN102762026B (zh) * 2011-04-27 2015-03-18 瑞化股份有限公司 透明导电线路的构造及制造方法
CN103713473A (zh) * 2013-12-29 2014-04-09 陕西师范大学 一种利用受限光催化氧化改性ito的方法及其应用
CN113444242A (zh) * 2021-07-16 2021-09-28 黑龙江大学 以三蝶烯为中心含甲氧基三苯胺类聚酰胺及其制备方法和应用
CN113444242B (zh) * 2021-07-16 2022-05-31 黑龙江大学 以三蝶烯为中心含甲氧基三苯胺类聚酰胺及其制备方法和应用
CN115826365A (zh) * 2022-12-23 2023-03-21 南京工业大学 一种通过全水基电子束曝光技术制备聚合物发光微纳结构的方法

Also Published As

Publication number Publication date
US6893790B2 (en) 2005-05-17
JP4842815B2 (ja) 2011-12-21
JP2007503698A (ja) 2007-02-22
DE602004009201T2 (de) 2008-06-26
DE602004009201D1 (de) 2007-11-08
WO2005021597A1 (en) 2005-03-10
TW200530277A (en) 2005-09-16
US20050048405A1 (en) 2005-03-03
EP1658313A1 (en) 2006-05-24
EP1658313B1 (en) 2007-09-26

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication