CN1799758A - Leaf-free solder and its preparation method - Google Patents
Leaf-free solder and its preparation method Download PDFInfo
- Publication number
- CN1799758A CN1799758A CN 200610032637 CN200610032637A CN1799758A CN 1799758 A CN1799758 A CN 1799758A CN 200610032637 CN200610032637 CN 200610032637 CN 200610032637 A CN200610032637 A CN 200610032637A CN 1799758 A CN1799758 A CN 1799758A
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- China
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- preparation
- welding
- scolder
- free solder
- lead
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Abstract
The invention relates to a welding material, especially providing a leadless solder with better anti-oxidation ability in high temperature and relative preparation method. Said solder comprises following weight percents: 1-6% Cu, 0.04-3% Ni, 0.0001-0.5% P, 0.0001-0.3% Ce and Sn. The invention comprises following advantages: better welding property on wire and transformer, less welding defects, bright welding point, non-connected welding, better appetency to base material (fixed material), anti-high temperature oxidation, and improved welding quality.
Description
Technical field
The present invention relates to welding material, relate in particular to a kind of unleadedly, and under the high-temperature soldering condition, have lead-free solder of good oxidation resistance and preparation method thereof.
Background technology
The welding material of electronics industry is mainly based on leypewter, though leypewter has excellent welding performance, but lead is noxious material, in bone, constantly accumulate and difficult the discharge after entering human body, cause operating personnel's lead poisoning, therefore, unleaded is the development trend of domestic and international microelectronics assembling industry soldering tech.But existing lead-free solder, when at high temperature welding, often welding slag is too much, and bridge defects is more.
Summary of the invention
The object of the present invention is to provide a kind of environmental protection type hyperthermia oxidation resistance weld material, this scolder is not leaded, and its tin stove oxidizing slag is few, lead-free solder that the bridge contact quality is high and preparation method thereof.
Purpose of the present invention is achieved through the following technical solutions:
Lead-free solder of the present invention and preparation method thereof, the composition percentage by weight of this scolder is:
Cu1-6%, Ni0.04-3%, P0.0001-0.5%, Ce0.0001-0.3% and Sn surplus are formed.
Preparation method of the present invention adopts following steps:
(1) at first selects high-purity tin for use,, stir repeated treatments 2-3 time while burning earlier by 500 ℃ of molten burnings of high temperature;
(2) add highly purified copper, after 700 ℃ of fusings, stirred by one hour, copper addition 1-6% adds nickel 0.04-3% again, stirs by one hour again, alloy is produced, slowly uniform decrease in temperature adds phosphorus, phosphorus content 100-300ppm when temperature drops to 340 ℃ by the time, add gallium again, the gallium addition is 100-3000ppm;
(3) scolder that stirs is poured in the mould, promptly obtained required scolder.
Lead-free solder of the present invention has the following advantages:
Wire rod, transformer are had very welding performance, and weld defect is few, the solder joint light, full, do not have to connect and weld phenomenon.Easier and base material (Gu material) produces good affinity, resistance to high temperature oxidation, and the solder joint surface-brightening has improved welding quality effectively.
The specific embodiment
Below in conjunction with specific embodiment the present invention is described in further detail:
Embodiment lead-free solder prescription
| Composition | 1 | 2 | 3 |
| Cu | 1 | 2 | 6 |
| Ni | 0.04 | 0.5 | 3 |
| P | 0.0001 | 0.01 | 0.5 |
| Ce | 0.0001 | 0.02 | 0.3 |
| Sn | 98.9598 | 97.47 | 90.2 |
Lead-free solder of the present invention and preparation method thereof, the composition percentage by weight of scolder is:
Cu1-6%, Ni0.04-3%, P0.0001-0.5%, Ce0.0001-0.3% and Sn surplus are formed.
The preparation method
(1) at first select high-purity tin for use,, stir, the material of the easy oxidation of small part is oxidized away while burning earlier by 500 ℃ of molten burnings of high temperature,
Mechanism:
1. an oxidation part is easy to the remaining pure tin of oxidation material, makes it purer, has more high temperature resistant property.
2. change the physical property of tin, make block tin, change the tin internal structure with new crystallization, so repeatedly after two or three time high-temperature process, the physical property of electrolysis pure tin is become cremate pure tin physical property fully, possess oxidation-resistance property, after above operation processing finishes thereby have.
(2) add highly purified copper, after 700 ℃ of fusings, stirred by one hour, copper addition 1-6% adds nickel 0.04-3% again, stirs by one hour again, alloy is produced, slowly uniform decrease in temperature adds phosphorus, phosphorus content 100-300ppm when temperature drops to 340 ℃ by the time, add and sow, sowing addition is 100-3000ppm;
(3) scolder that stirs is poured in the mould, promptly obtained required scolder.
These properties of product
500 ℃ of high temperature resistances be can reach and oxidative phenomena, the few good scolder of brightness of scruff do not produced.
Tin is pluged with molten metal plain purpose: can not weld by 260 ℃ of these materials of bearing temperature in order to adapt to some, and must some relevant scolders of exploitation.
Tin is pluged with molten metal: this alloy is except that fusing point is low.
Also has following performance
Antibiotic corrosivity is usually used in having the scolder of the chlorine industry equipment of corrosion resistance, scolder of imitation gold copper-base alloy etc.; A large amount of stanniferous is pluged with molten metal the base low-melting alloy as thermal signal and heat controller material; Be mainly used in light current device and optics industry.
Tin is pluged with molten metal and is closed price subsidies and filled lead-free solder and do not have this blank of low melting point, and open accommodation is enlarged.Thereby a new road is opened up in no lead welding development and utilization from now on.
Claims (2)
1, a kind of lead-free solder and preparation method thereof is characterized in that the composition percentage by weight of this scolder is: Cu 1-6%, Ni 0.04-3%, P 0.0001-0.5%, Ce 0.0001-0.3% and Sn surplus.
2, the preparation method of lead-free solder according to claim 1 is characterized in that this preparation method adopts following steps:
(1) at first select high-purity tin for use,, stir, the material of the easy oxidation of small part is oxidized away while burning earlier by 500 ℃ of molten burnings of high temperature,
(2) add highly purified copper, after 700 ℃ of fusings, stirred by one hour, copper addition 1-6% adds nickel 0.04-3% again, stirs by one hour again, alloy is produced, slowly uniform decrease in temperature adds phosphorus, phosphorus content 100-300ppm when temperature drops to 340 ℃ by the time, add cerium again, the cerium addition is 100-3000ppm;
(3) scolder that stirs is poured in the mould, promptly obtained required scolder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610032637 CN1799758A (en) | 2006-01-04 | 2006-01-04 | Leaf-free solder and its preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610032637 CN1799758A (en) | 2006-01-04 | 2006-01-04 | Leaf-free solder and its preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1799758A true CN1799758A (en) | 2006-07-12 |
Family
ID=36810097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610032637 Pending CN1799758A (en) | 2006-01-04 | 2006-01-04 | Leaf-free solder and its preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1799758A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103740955A (en) * | 2013-12-23 | 2014-04-23 | 苏州宏泉高压电容器有限公司 | Preparation method for anti-corrosion welding material |
| CN105290653A (en) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | Manufacturing method for rosin soldering tin bar |
-
2006
- 2006-01-04 CN CN 200610032637 patent/CN1799758A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103740955A (en) * | 2013-12-23 | 2014-04-23 | 苏州宏泉高压电容器有限公司 | Preparation method for anti-corrosion welding material |
| CN105290653A (en) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | Manufacturing method for rosin soldering tin bar |
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Legal Events
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |