CN1770471A - 鳍型场效应晶体管及其制造方法 - Google Patents
鳍型场效应晶体管及其制造方法 Download PDFInfo
- Publication number
- CN1770471A CN1770471A CNA2005101096638A CN200510109663A CN1770471A CN 1770471 A CN1770471 A CN 1770471A CN A2005101096638 A CNA2005101096638 A CN A2005101096638A CN 200510109663 A CN200510109663 A CN 200510109663A CN 1770471 A CN1770471 A CN 1770471A
- Authority
- CN
- China
- Prior art keywords
- fin
- raceway groove
- groove extension
- grid conductor
- channel part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title description 4
- 239000004020 conductor Substances 0.000 claims abstract description 44
- 239000012212 insulator Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 32
- 238000005516 engineering process Methods 0.000 claims description 32
- 239000000203 mixture Substances 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000005669 field effect Effects 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 206010020751 Hypersensitivity Diseases 0.000 description 3
- 208000026935 allergic disease Diseases 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000009610 hypersensitivity Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
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- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
Abstract
Description
Claims (28)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/904,357 US7274053B2 (en) | 2004-11-05 | 2004-11-05 | Fin device with capacitor integrated under gate electrode |
US10/904,357 | 2004-11-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1770471A true CN1770471A (zh) | 2006-05-10 |
CN100459162C CN100459162C (zh) | 2009-02-04 |
Family
ID=36315461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101096638A Expired - Fee Related CN100459162C (zh) | 2004-11-05 | 2005-09-19 | 鳍型场效应晶体管及其制造方法 |
Country Status (2)
Country | Link |
---|---|
US (2) | US7274053B2 (zh) |
CN (1) | CN100459162C (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7915108B2 (en) | 2006-09-29 | 2011-03-29 | Hynix Semiconductor Inc. | Method for fabricating a semiconductor device with a FinFET |
CN104603931A (zh) * | 2012-09-04 | 2015-05-06 | 高通股份有限公司 | FinFET电容器及其制造方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004031385B4 (de) * | 2004-06-29 | 2010-12-09 | Qimonda Ag | Verfahren zur Herstellung von Stegfeldeffekttransistoren in einer DRAM-Speicherzellenanordnung, Feldeffekttransistoren mit gekrümmtem Kanal und DRAM-Speicherzellenanordnung |
US8889494B2 (en) | 2010-12-29 | 2014-11-18 | Globalfoundries Singapore Pte. Ltd. | Finfet |
US8703553B2 (en) | 2012-05-15 | 2014-04-22 | International Business Machines Corporation | MOS capacitors with a finFET process |
US11145757B2 (en) | 2019-06-18 | 2021-10-12 | Samsung Electronics Co., Ltd. | Integrated circuit devices including a vertical field-effect transistor (VFET) and methods of forming the same |
CN112103343A (zh) | 2019-06-18 | 2020-12-18 | 三星电子株式会社 | 包括垂直场效应晶体管的集成电路器件 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5391506A (en) * | 1992-01-31 | 1995-02-21 | Kawasaki Steel Corporation | Manufacturing method for semiconductor devices with source/drain formed in substrate projection. |
JPH0793441B2 (ja) * | 1992-04-24 | 1995-10-09 | ヒュンダイ エレクトロニクス インダストリーズ カンパニー リミテッド | 薄膜トランジスタ及びその製造方法 |
KR100431489B1 (ko) * | 2001-09-04 | 2004-05-12 | 한국과학기술원 | 플래쉬 메모리 소자 및 제조방법 |
US20030151077A1 (en) * | 2002-02-13 | 2003-08-14 | Leo Mathew | Method of forming a vertical double gate semiconductor device and structure thereof |
US6720619B1 (en) * | 2002-12-13 | 2004-04-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor-on-insulator chip incorporating partially-depleted, fully-depleted, and multiple-gate devices |
US6762483B1 (en) * | 2003-01-23 | 2004-07-13 | Advanced Micro Devices, Inc. | Narrow fin FinFET |
US7244640B2 (en) * | 2004-10-19 | 2007-07-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for fabricating a body contact in a Finfet structure and a device including the same |
-
2004
- 2004-11-05 US US10/904,357 patent/US7274053B2/en not_active Expired - Fee Related
-
2005
- 2005-09-19 CN CNB2005101096638A patent/CN100459162C/zh not_active Expired - Fee Related
-
2007
- 2007-06-12 US US11/761,438 patent/US7741184B2/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7915108B2 (en) | 2006-09-29 | 2011-03-29 | Hynix Semiconductor Inc. | Method for fabricating a semiconductor device with a FinFET |
CN104603931A (zh) * | 2012-09-04 | 2015-05-06 | 高通股份有限公司 | FinFET电容器及其制造方法 |
US9768161B2 (en) | 2012-09-04 | 2017-09-19 | Qualcomm Incorporated | FinFET capacitor circuit |
CN104603931B (zh) * | 2012-09-04 | 2018-01-16 | 高通股份有限公司 | FinFET电容器及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN100459162C (zh) | 2009-02-04 |
US7274053B2 (en) | 2007-09-25 |
US20060097329A1 (en) | 2006-05-11 |
US20070231987A1 (en) | 2007-10-04 |
US7741184B2 (en) | 2010-06-22 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171127 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171127 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090204 Termination date: 20180919 |