CN1767725A - 形成导电图案的方法、线路基底、电子器件和电子设备 - Google Patents

形成导电图案的方法、线路基底、电子器件和电子设备 Download PDF

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Publication number
CN1767725A
CN1767725A CNA200510116055XA CN200510116055A CN1767725A CN 1767725 A CN1767725 A CN 1767725A CN A200510116055X A CNA200510116055X A CN A200510116055XA CN 200510116055 A CN200510116055 A CN 200510116055A CN 1767725 A CN1767725 A CN 1767725A
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CN
China
Prior art keywords
substrate
metal core
electroless
conductive pattern
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200510116055XA
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English (en)
Chinese (zh)
Inventor
松井邦容
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN1767725A publication Critical patent/CN1767725A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/2033—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CNA200510116055XA 2004-10-26 2005-10-25 形成导电图案的方法、线路基底、电子器件和电子设备 Pending CN1767725A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004311589A JP2006128228A (ja) 2004-10-26 2004-10-26 導電膜の形成方法、配線基板、電子デバイスおよび電子機器
JP2004311589 2004-10-26

Publications (1)

Publication Number Publication Date
CN1767725A true CN1767725A (zh) 2006-05-03

Family

ID=36205205

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200510116055XA Pending CN1767725A (zh) 2004-10-26 2005-10-25 形成导电图案的方法、线路基底、电子器件和电子设备

Country Status (5)

Country Link
US (1) US20060086619A1 (ja)
JP (1) JP2006128228A (ja)
KR (1) KR100745545B1 (ja)
CN (1) CN1767725A (ja)
TW (1) TW200635461A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101994104A (zh) * 2009-08-10 2011-03-30 住友电木株式会社 非电解镍-钯-金镀敷方法、镀敷处理物、印刷布线板、内插板以及半导体装置
CN103716984A (zh) * 2012-10-05 2014-04-09 泰科电子日本合同会社 玻璃布线板
CN104284521A (zh) * 2013-07-05 2015-01-14 Si弗莱克斯有限公司 利用剥离型油墨的复合镀层遮蔽方法
CN109156076A (zh) * 2016-03-26 2019-01-04 维纳米技术公司 使用三维喷墨打印来制造带有屏蔽轨道和/或组件的pcb和fpc
CN110831350A (zh) * 2019-11-14 2020-02-21 四会富仕电子科技股份有限公司 一种无底铜电路板的制作方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070281099A1 (en) * 2006-05-31 2007-12-06 Cabot Corporation Solderable pads utilizing nickel and silver nanoparticle ink jet inks
US20090285976A1 (en) * 2006-06-14 2009-11-19 Basf Se Method for producing electrically conductive surfaces on a support
EP2127507A1 (de) * 2007-01-19 2009-12-02 Basf Se Verfahren zur herstellung strukturierter, elektrisch leitfähiger oberflächen
JP4355965B2 (ja) * 2007-04-02 2009-11-04 セイコーエプソン株式会社 配線基板の製造方法
ATE503037T1 (de) 2008-10-17 2011-04-15 Atotech Deutschland Gmbh Spannungsreduzierte ni-p/pd-stapel für waferoberfläche
DE102008043125A1 (de) * 2008-10-23 2010-04-29 BSH Bosch und Siemens Hausgeräte GmbH Bedienelement für ein Haushaltsgerät
JP4835705B2 (ja) * 2009-02-27 2011-12-14 ソニー株式会社 反射電極の形成方法並びに駆動基板および表示装置
JP5970207B2 (ja) * 2012-03-08 2016-08-17 株式会社小糸製作所 面発光体
JP6314376B2 (ja) * 2013-07-01 2018-04-25 株式会社リコー 導電性パターンを有する三次元構造体の製造方法及び三次元構造体
JP6466110B2 (ja) * 2014-09-09 2019-02-06 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
JP6484026B2 (ja) * 2014-12-22 2019-03-13 住友電気工業株式会社 プリント配線板用基板及びプリント配線板並びにプリント配線板用基板の製造方法
JP6457304B2 (ja) * 2015-03-11 2019-01-23 京セラ株式会社 配線基板
CN110972386A (zh) * 2018-09-28 2020-04-07 深圳正峰印刷有限公司 适用于印刷电子元件的电路板
KR20230049702A (ko) 2020-10-21 2023-04-13 아사히 가세이 가부시키가이샤 도전성 패턴을 갖는 구조체의 제조 방법

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
JPS63502041A (ja) 1985-12-30 1988-08-11 ゼネラル・エレクトリック・カンパニイ 改良された増量置換法による導電体の形成法
JPH06177499A (ja) * 1992-12-03 1994-06-24 Matsushita Electric Works Ltd セラミック配線板
EP0762813A1 (en) * 1995-08-25 1997-03-12 Macdermid Incorporated Method for the manufacture of printed circuit boards
JP3152637B2 (ja) * 1997-11-06 2001-04-03 釜屋電機株式会社 回路配線基板の製造方法
JP2915888B1 (ja) * 1998-01-28 1999-07-05 日本特殊陶業株式会社 配線基板及びその製造方法
JP2000323618A (ja) * 1999-05-07 2000-11-24 Sumitomo Electric Ind Ltd 銅回路接合基板及びその製造方法
JP2001148561A (ja) * 1999-11-19 2001-05-29 Kyocera Corp 配線基板の製造方法
JP2004143571A (ja) * 2001-11-22 2004-05-20 Fuji Photo Film Co Ltd 導電パターン描画用基板およびインク、ならびに導電パターンの形成方法
US20030146019A1 (en) * 2001-11-22 2003-08-07 Hiroyuki Hirai Board and ink used for forming conductive pattern, and method using thereof
JP4068883B2 (ja) * 2002-04-22 2008-03-26 セイコーエプソン株式会社 導電膜配線の形成方法、膜構造体の製造方法、電気光学装置の製造方法、及び電子機器の製造方法
JP4277976B2 (ja) * 2002-12-17 2009-06-10 株式会社アルバック メッキ用シードパターン及び導電膜パターンの形成方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101994104A (zh) * 2009-08-10 2011-03-30 住友电木株式会社 非电解镍-钯-金镀敷方法、镀敷处理物、印刷布线板、内插板以及半导体装置
CN103716984A (zh) * 2012-10-05 2014-04-09 泰科电子日本合同会社 玻璃布线板
CN104284521A (zh) * 2013-07-05 2015-01-14 Si弗莱克斯有限公司 利用剥离型油墨的复合镀层遮蔽方法
CN104284521B (zh) * 2013-07-05 2017-06-16 Si弗莱克斯有限公司 利用剥离型油墨的复合镀层遮蔽方法
CN109156076A (zh) * 2016-03-26 2019-01-04 维纳米技术公司 使用三维喷墨打印来制造带有屏蔽轨道和/或组件的pcb和fpc
CN109156076B (zh) * 2016-03-26 2022-06-17 维纳米技术公司 使用三维喷墨打印来制造带有屏蔽轨道和/或组件的pcb和fpc
CN110831350A (zh) * 2019-11-14 2020-02-21 四会富仕电子科技股份有限公司 一种无底铜电路板的制作方法

Also Published As

Publication number Publication date
TW200635461A (en) 2006-10-01
US20060086619A1 (en) 2006-04-27
KR20060054133A (ko) 2006-05-22
KR100745545B1 (ko) 2007-08-03
JP2006128228A (ja) 2006-05-18

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