CN1761046A - 夹紧装置和用于传送基片的传送机构 - Google Patents

夹紧装置和用于传送基片的传送机构 Download PDF

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CN1761046A
CN1761046A CNA2005101070708A CN200510107070A CN1761046A CN 1761046 A CN1761046 A CN 1761046A CN A2005101070708 A CNA2005101070708 A CN A2005101070708A CN 200510107070 A CN200510107070 A CN 200510107070A CN 1761046 A CN1761046 A CN 1761046A
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clamping device
jaw
substrate
power
removable
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吉恩-巴普蒂斯特·贝尔塞
梅尔廷·德弗洛林
帕斯卡尔·梅内
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Unaxis Shi Weiss Co ltd
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Unaxis International Trading AG
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/002Magnetic work holders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B5/00Clamps
    • B25B5/06Arrangements for positively actuating jaws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
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  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
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Abstract

一种夹紧装置,包括沿垂直方向固定的夹爪(15);沿垂直方向可移动的夹爪(16);以及用于向可移动夹爪(16)施加力的力传感器。可移动夹爪(16)是弯曲的。力传感器优选地包括线圈(21)和铁芯(22)。在夹紧装置的未夹紧状态,可移动夹爪(16)由铁芯(22)的重量加载。为了夹紧,电流施加于线圈(21),产生磁场,将铁芯(22)压靠于可移动夹爪(16)。

Description

夹紧装置和用于传送基片的传送机构
技术领域
本发明涉及一种夹紧装置和带有这种夹紧装置的用于传送基片的传送机构。
背景技术
这种传送机构用于例如丝焊器中以传送基片。丝焊器是一种在半导体芯片安装到基片之后利用其通过压力、超声波和热焊接半导体芯片的机器。传送机构包括两个导轨、可以沿导轨前后移动的至少一个夹紧装置、以及至少一个固定装置。可移动的夹紧装置用来沿导轨传送基片到焊接台和离开焊接台。固定装置用来在传送阶段之间固定基片。固定装置例如是刚性设置的夹紧装置或者是抵靠在基片上将基片压靠于导轨的辊子。辊子包含特殊的轴承,其允许辊子沿一个方向转动而阻止辊子沿相反的方向转动。带有辊子的解决方案较为昂贵并且具有如下缺点,即基片沿传送方向的运动总是可能的,因为辊子仅仅使得沿相反于传送方向的运动不可能。刚性设置的夹紧装置具有的缺陷是,夹爪必须移动以便夹紧基片。移动的夹爪是一个运动的质量,当冲击在基片上时,其向基片传递一定的能量并且震动基片。尤其对于薄基片一有些基片仅仅50微米厚,振动会导致已经焊接好的半导体芯片的焊丝变形,并且在某些情况下,相邻焊丝相互接触并产生电短路。
从EP330′831、CH679′878和CH689′188可以获知带有固定的和/或可移动的夹紧装置的传送机构。
发明内容
本发明的目的是开发一种夹紧装置,当夹紧时不会震动基片。
夹紧装置的结构和功能基于示例加以说明,将由该夹紧装置夹紧的物体是其上安装有半导体芯片的基片。夹紧装置包含沿垂直方向固定的夹爪、沿垂直方向可移动的夹爪、以及用于向可移动夹爪施加力的力传感器。在未夹紧状态,力传感器的任务是向可移动夹爪施加第一、较低的力,使得可移动夹爪或者与固定夹爪接触,只要在这两个夹爪之间没有插入基片;或者与将被夹紧的基片接触。可移动夹爪被弯曲,从而与固定夹爪一起形成锥形入口,基片可以插入该入口内而不会产生基片附着在可移动夹爪上的危险。然后,当基片插入夹紧装置时,可移动夹爪偏转到基片厚度的程度:现在它运行了一个行程。为了夹紧基片,力传感器在可移动夹爪上施加第二、较大的力。当从未夹紧状态向夹紧状态转变时,可移动夹爪不再移动并且因此不再运行行程。
在一个优选实施例中,力传感器包括由线圈、即所谓的螺线管驱动的铁芯。在夹紧装置的未夹紧状态,可移动夹爪由铁芯的重量加载。为了夹紧,电流施加于线圈,产生磁场,将铁芯压靠于可移动夹爪。
在另一个实施例中,力传感器包括由弹簧预张紧的气动螺栓。弹簧将螺栓压靠于可移动夹爪。为了夹紧基片,另外将气压施加于螺栓,从而由螺栓作用在可移动夹爪上的力增大。
夹紧装置特别适合用在用于沿预定传送方向传送基片的传送机构中。
附图说明
下面,根据实施例并根据附图更详细地说明本发明。
包含于本说明书并构成本说明书一部分的附图表示出本发明的一个或多个实施例,其与详细说明一起用来说明本发明的原理和实施。
附图没有按比例绘制。
附图中:
图1、2示出传送机构的平面图和横截面图,
图3示出根据本发明的夹紧装置的第一实施例,以及
图4示出处于夹紧状态的夹紧装置。
具体实施方式
图1和2示出丝焊器的用于沿传送方向2传送基片1的传送机构的平面图和横截面图。传送机构包括两个沿传送方向2相互平行设置的导轨3和4、至少一个可移动夹紧装置5、以及至少一个固定夹紧装置6。可移动夹紧装置5可以沿传送方向2前后移动。它用来将例如从储料盒7推出并位于传送区起点的基片1传送到处理台8,并且然后从处理台8传送到传送区的末端,基片1从该末端由推进器推入到第二储料盒9。第一导轨3包含槽10,该槽10包括确定槽10的边界的边缘14、以及从边缘14突出的两个支腿11和12。第一支腿11形成一个水平支撑面13,其上搁置基片1。边缘14用做止挡件,以引导和对齐基片1。第二支腿12形成一个边框从而基片1不会脱离槽10。第二支腿12并非总是必要的并且可以略去。第二导轨4仅仅用做基片1的支撑件。
传送机构特别适合于用在丝焊器上,在该丝焊器中,安装在基片1上的半导体芯片在处理台8被焊接到基片1。在技术行话中处理台称为焊接台。
图3示出根据本发明的刚性设置的夹紧装置的一个实施例的侧视图。该实施例适合于夹紧装置沿垂直方向运行的情况。夹紧装置具有固定夹爪15以及沿由z方向表示的夹紧方向可移动的可移动夹爪16。夹紧装置沿垂直方向运行。固定夹爪由导轨3的槽10的支撑面13形成。可移动夹爪16由弯曲板17构成。槽10的第二支腿12在夹紧装置的区域内被中断并被板17取代。板17的一端18在中断处的一侧固定于第二支腿12,板17的另一端19在中断处的另一侧搁置在第二支腿12上。夹紧装置包括作为力传感器的由线圈21驱动的铁芯22。线圈21由安装件23连接于导轨3。铁芯22支撑在线圈内可以沿垂直方向(z方向)移动。由于其自重,铁芯22落在板17上并且将板17压在支撑面13上。这是没有基片时夹紧装置的状态。作为可选方案,板17不连接于导轨3而是连接于铁芯22。
然后在基片1沿传送方向2被传送并到达夹紧装置时,当将基片1插入到夹紧装置内时,板17和铁芯22沿z方向移动。板17的弯曲形式形成锥形入口并且确保基片1当插入时不会阻塞。现在铁芯22由其自重压靠于板17并且因此还压靠于基片1。这种状态表示在图4中。一旦传送阶段完成,电流施加于电磁体的线圈21。流经线圈21的电流产生磁场,以预定力将铁芯22压靠于板17。由铁芯22作用在板17上的力取决于流经线圈21的电流强度。现在夹紧装置牢固地夹紧基片1。本发明的夹紧装置的优点在于夹爪15、16不必移动行程来牢固地夹紧基片1。一旦切断流经线圈21的电流,夹紧装置的力降低到铁芯22的自重。现在基片1可以由可移动夹紧装置进一步传送。
本发明也可以应用于沿导轨4前后移动的夹紧装置。该夹紧装置构造为与参照图3和4说明的夹紧装置相同,但是不同之处在于板17不连接于导轨4而是连接于铁芯22。夹爪15或者可以由导轨4形成或者连接于夹紧装置并在此情况下随夹紧装置前后移动。
包括线圈21和铁芯22的力传感器可以由具有螺栓的气动力传感器替换,其中压力可以施加于该螺栓并且该螺栓由弹簧预张紧。当夹紧装置不是沿垂直方向运行时这种方案特别合适。
尽管表示和说明了本发明的实施例和应用,但是对于本领域技术人员来说,在本说明的启发下可以做出更多的修改,而不脱离本发明的概念。因此本发明并不局限于所附权利要求及其等同物内。

Claims (3)

1.夹紧装置,包括:
夹爪(15),相对于夹紧方向(z)固定;
夹爪(16),沿夹紧方向(z)可移动,可移动夹爪(16)被弯曲从而其与固定夹爪(15)形成锥形入口;以及
力传感器,用于向可移动夹爪(16)施加力,
其中在夹紧装置的未夹紧状态,力传感器在可移动夹爪(16)上施加第一力,并且将可移动夹爪(16)或者压靠于固定夹爪(15)或者压靠于将被夹紧的物体,并且其中在夹紧状态,力传感器在可移动夹爪(16)上施加大于第一力的第二力。
2.如权利要求1所述的夹紧装置,其特征在于,力传感器包括线圈(21)和铁芯(22),并且其中在夹紧装置的未夹紧状态,可移动夹爪(16)由铁芯(22)的重量加载。
3.用于沿传送方向(2)传送基片(1)的传送机构,包括刚性设置的根据权利要求1或2所述的夹紧装置,以及可以沿传送方向(2)前后移动的夹紧装置。
CNA2005101070708A 2004-10-01 2005-09-29 夹紧装置和用于传送基片的传送机构 Pending CN1761046A (zh)

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CN104777335A (zh) * 2014-01-09 2015-07-15 本田技研工业株式会社 电流施加装置以及半导体元件的制造方法

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CN104777335B (zh) * 2014-01-09 2017-10-13 本田技研工业株式会社 电流施加装置以及半导体元件的制造方法

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DE102005044047A1 (de) 2006-05-04
KR20060051722A (ko) 2006-05-19
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TW200618159A (en) 2006-06-01
US7396005B2 (en) 2008-07-08
CH697200A5 (de) 2008-06-25

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