CN1758953A - 多层陶瓷复合材料 - Google Patents

多层陶瓷复合材料 Download PDF

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CN1758953A
CN1758953A CNA2003801101616A CN200380110161A CN1758953A CN 1758953 A CN1758953 A CN 1758953A CN A2003801101616 A CNA2003801101616 A CN A2003801101616A CN 200380110161 A CN200380110161 A CN 200380110161A CN 1758953 A CN1758953 A CN 1758953A
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ceramic composite
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F·埃伦
O·宾克勒
R·农宁格
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Abstract

在一种用于制造陶瓷复合材料的方法中,在一个生的载体层上涂覆一个第二生层,其陶瓷颗粒具有一个x≤100nm的尺寸。在共同烧结各生层时第二颗粒层压缩成一个无缺陷的细孔的功能层。

Description

多层陶瓷复合材料
技术领域
本发明涉及一种多层多孔陶瓷复合材料的制造方法,该复合材料包括至少一个第一陶瓷颗粒层,它设置作为至少一个第二陶瓷颗粒层的载体层,其中第一层和第二层在800℃≤T≤1200℃的温度下一起烧结成一种复合材料。
背景技术
由DE 198 57 591 A1已知这种方法。
多层多孔陶瓷复合材料可以例如应用于过滤技术以及在电子技术中用于印制导线结构。陶瓷多层过滤器可以例如用于分离切屑加工中的油水乳液、澄清啤酒、燃气净化、燃气分离或液体固体混合物的分离。陶瓷过滤材料通常由相互烧结的颗粒制成,其中间空间形成气孔。为了过滤的目的需要得到尽可能大的气孔体积份量和尽可能均匀且紧密分布的气孔尺寸分布。因此为了加工陶瓷过滤材料最好使用粒度分布紧密的陶瓷粉末。
陶瓷膜通常由多孔陶瓷的多层系统组成,其各个层具有不同的气孔直径。实际的过滤层(功能层)通常是系统中最薄且气孔最细的一层。它被安排在拥有更大气孔结构的系统基底上。该基底同时承担整个系统的机械载送功能并且也经常构成过滤物收集结构。将含有陶瓷颗粒但是还没有烧结的层称为生(gruene)层,相应地将由这种材料制成的物体称为生坯。
在烧结生坯的过程中压缩这个生坯,其中气孔的形状和/或大小发生改变。在理想情况下,可以在烧结时将原始体视为球形颗粒的一个紧密包装,这些球形颗粒在接触点微小地连接,即在以所谓的“颈”粘附的情况下互相接触。在颗粒之间的中间空间形成原始体的气孔。原始的气孔是几何形状各不相同的复杂结构。在温度升高时烧结过程以两个阶段进行。在第一个阶段中总体多孔性基本保持不变。颗粒间的中心点基本保持相互远离相同距离。尽管获得表面能量,因为空穴也就是气孔的形状由初始状态的复杂结构过渡到简单的球形。因此,对于一个给定的气孔率实现一个最小的表面。颗粒在“颈”部接触,它们由于物质转移在第一个烧结阶段变粗。因此气孔倒圆,由此实现一个最小的气孔表面。这种物质转移也被称为晶界扩散。在第二个阶段,气孔逐渐地封闭。通过将空穴输运到内部和外部的表面(体积扩散),使材料压缩。由于烧结体压缩而使整个气孔率减小。充满气孔通过晶界扩散和体积扩散实现。在这一阶段中原始的粉末颗粒中心点聚集到一起。从而起到压缩或收缩烧结体的作用。
所发生的晶界扩散的程度可以通过在气孔中产生的毛细压力进行检测。气孔的形状变化通过物质转移实现,物质转移以不同的曲率半径开始。尤其是物质从颗粒的“腹部”转移到颗粒的“颈部”。原子在向内隆曲的表面(凹面)上的结合一般强于在向外隆曲的表面(凸面)上的结合。原始体“腹部”上的毛细压力为正,而“颈部”上的为负。这个压力差正是物质转移的动力。引起陶瓷生坯的烧结的毛细压力除了取决于温度和颗粒类型外,还与所使用的颗粒的大小有关,因为凸曲率半径随着颗粒尺寸的变小而增加。因此温度降低,在该温度下陶瓷生坯(在生坯的填充密度相同的前提下)随着原始颗粒的颗粒尺寸的减小开始烧结。
如果将多个有不同陶瓷颗粒的生层烧结在一起,则由于不同的物质特性在生层中会产生不同的收缩特性,即,各层不同程度地被压缩。这在层间导致应力。同时导致在功能层中非期望的缺陷形成和裂缝。
由DE 198 57 591 A1已知,在700℃到1200℃间的温度下,在一个烧结过程中制造一个具有一个载体层和一个功能层的陶瓷多层过滤器。为了补偿不同层的不同收缩,所引用的现有技术建议,用一种材料浸润陶瓷颗粒,因此在烧结期间通过附加的液相包裹颗粒。但是由此得到的功能层相对较厚,而且这些功能层有许多缺陷点,由此削弱了过滤性能。
发明内容
因此本发明的目的是,提供一种用于制造具有一无缺陷功能层的陶瓷复合材料的方法,其中将一个载体层与该功能层一起烧结。
按照本发明这个目的由此得以实现,在上述形式的方法中第二层的陶瓷颗粒仅仅是纳米级的颗粒,其颗粒大小为x≤100nm。
用按照本发明的方法可以通过同时与作为基底的载体层烧结而产生一个薄的无缺陷的作为功能层的第二层。而在一般的烧结工艺中生坯经过晶界扩散和/或体积扩散而实现压缩,通过按照本发明选择x≤100nm的颗粒尺寸可对压缩过程这样施加影响,使得触发一个目前在陶瓷体中没有被观测到的晶界漂移。通过晶界漂移可以避免在载体层和功能层之间的应力,它们尤其当在基底和功能层中使用具有不同的物质属性或大小的陶瓷颗粒时候产生。由此能够不形成缺陷地实现压缩到功能层的一个确定厚度。通过按照本发明的方法能够制造一个无缺陷功能层,它与基底一样由材料相同或不同的陶瓷颗粒制成,并且该功能层在烧结过程中或烧结后都不会与基底脱离。这种功能层适合于实现特别好的过滤效果。与制造陶瓷复合材料相比,其中将一个生层施加到在一个已经烧结的物体上,在相同的材料条件下可以使低直至150℃的烧结温度也能够用于产生较厚的无缺陷的层。在按照本发明方法中以有利的方式无需任何烧结抑制剂。此外,在纳米级颗粒中不需要添加较大的陶瓷颗粒。
所述纳米级颗粒可以具有不同的形状,例如它们可以是球形的、片状的或纤维状的。颗粒大小是指颗粒的最长尺寸,例如如果颗粒是球形的,则颗粒大小对应于直径。
所使用的陶瓷材料最好源于金属(混合)氧化物和碳化物、氮化物、硼化物、硅化物以及金属和非金属的碳氮化物。例如Al2O3、部分和完全稳定的ZrO2、莫来石、堇青石、钙钛矿、尖晶石、比如BaTiO3、PZT、PLZT以及SiC、Si3N4、B4C、BN、MoSi2、TiB2、TiN、TiC以及Ti(C,N)。很明显没有完全列数。当然也可以使用氧化物或非氧化物的复合材料及氧化物和非氧化物的混合物。
在本方法的一个扩展设计中,所述陶瓷复合材料由三层构成,其中至少一层含有纳米级颗粒。通过不同气孔率的多个颗粒层可以有针对性地影响多孔陶瓷复合材料的过滤性能。只要其中一个颗粒层没有缺陷,就可以达到特别好的过滤效果。
如果陶瓷复合材料由三层以上的颗粒层构成,其中至少两层含有纳米级颗粒,则可以构成一种多层多孔陶瓷复合材料,它具有良好的过滤性能。
如果纳米级颗粒的颗粒大小为x≤50nm,最好x≤20nm,特别优选x≤10nm,则可以在一个低激发能下触发晶界漂移。这允许在约200MPa的烧结应力下应用低烧结温度。
一个有利的变型工艺是,纳米级颗粒经过喷射、沉浸、浇注或者箔铸涂覆到基底上。如果纳米级颗粒包含在悬浮液中,则通过上述工艺步骤颗粒可以特别方便地附着到基底上。尤其是通过这些措施可以很好地控制和调节附着到基底上的生层的厚度,从而控制和调节烧结的功能层。
在涂覆纳米级颗粒之前,以有利的方式可以将一个中间层、尤其是一个有机中间层附着到载体层上。通过有机的粘合剂可以补偿载体层表面的不平度并且封闭载体层中的气孔,以避免渗入。尤其是通过有机的粘合剂可以将基底扩张成一个适合的载体结构。在烧结过程期间该有机的中间层挥发,由此使加工完成的陶瓷复合材料的过滤效果不会受到有机粘合剂的影响。
特别有利的是,在烧结前使所述载体层形成结构。通过这个结构、尤其是通过与其他相同形式的陶瓷复合材料的层压/合,可以形成用于排出过滤物的空穴和通道。特别优选的是,所述结构的一端终止在载体层中。由此通过与相同形式的陶瓷复合材料拼合可以形成一个在一个侧面上封闭的通道。所述载体层可以相互支承。当所述结构沟槽形地构成时,尤其是当它在横截面上是半圆形时,则当两个具有相应沟槽的陶瓷复合材料层合时,就可以在横截面上构成基本圆形的通道。
在一个优选的改进方案中,所述形成结构通过模压、冲压或铣削实现。特别有利的是,铣削生的载体层。与模压将材料挤入相比,在铣削时去除材料。生层的区域不会在烧结前就已经被压缩,因此保留一个均匀的生层,它在烧结时被均匀地压缩。由此可以避免干扰过滤过程的不均匀性。
一种过滤装置可以由此简单地制造,在烧结前将多个陶瓷复合材料叠层在形成空穴尤其是通道的条件下拼合、尤其是层合成陶瓷复合材料。
本发明的对象也是一种多层多孔的陶瓷复合材料,它具有一个基底和一个仅由纳米级颗粒烧结成的无缺陷的功能层。这种多孔陶瓷复合材料包括一个特别高质量的过滤层,因为它是无缺陷的。
在一个优选的实施例中,所述陶瓷复合材料具有三层,其中一层含有纳米级颗粒。这些层的材料特性能够这样相互协调,使得至少一个过滤层是无缺陷的并且形成高质量的过滤器。
在一个可选择的实施例中,所述陶瓷复合材料具有三个以上的层,其中至少有两层含有纳米级颗粒。通过这个措施可以在陶瓷复合材料内部逐步地提高过滤效果,其中至少有两层气孔特别细且无缺陷地构成。此外可以构成多层印制导线结构,其中由纳米级颗粒组成的无缺陷层是一个绝缘体。由此可以使印制导线以微小的距离相互电绝缘地设置。
如果所述陶瓷复合材料在载体层中具有空穴、尤其是通道,则可以特别好地导出过滤物。
在一种用于制造陶瓷复合材料的方法中,在一个生的载体层上附着一个生的第二层,其陶瓷颗粒具有一个x≤100nm的尺寸。在各生层共同烧结时第二层压缩成一个无缺陷的细孔的功能层。
本发明的其它特征和优点由权利要求书给出。在本发明的变型方案中各个特征可以单独地或多个任意组合地实现。

Claims (14)

1.一种用于制造多层多孔陶瓷复合材料的方法,该陶瓷复合材料包括至少一个第一陶瓷颗粒层,它作为用于至少一个第二陶瓷颗粒层的载体层,其中第一和第二颗粒层在800℃≤T≤1200℃的温度下共同烧结成一种复合材料,其特征在于,所述第二层的陶瓷颗粒仅仅是颗粒大小为x≤100nm的纳米级颗粒。
2.如权利要求1所述的方法,其特征在于,所述陶瓷复合材料由三层构成,其中至少一层含有x≤100nm的纳米级颗粒。
3.如权利要求1所述的方法,其特征在于,所述陶瓷复合材料由三层以上构成,其中至少两层含有x≤100nm的纳米级颗粒。
4.如上述权利要求中任一项所述的方法,其特征在于,所述纳米级颗粒的颗粒大小为x≤50nm,最好x≤20nm,特别优选x≤10nm。
5.如上述权利要求中任一项所述的方法,其特征在于,所述纳米级颗粒经过喷射、沉浸、浇注、箔铸或其他类似方法涂覆到基底(载体层)上。
6.如上述权利要求中任一项所述的方法,其特征在于,在涂覆纳米级颗粒前,将一个中间层、尤其是一个有机的中间层涂覆到载体层上。
7.如上述权利要求中任一项所述的方法,其特征在于,在烧结前使所述载体层形成结构。
8.如权利要求7所述的方法,其特征在于,所述形成结构通过模压、冲压或铣削实现。
9.如权利要求1前序部分所述的方法,其特征在于,所述载体层通过铣削形成结构。
10.如上述权利要求中任一项所述的方法,其特征在于,在烧结前在形成空穴尤其是通道的情况下将多个陶瓷复合材料叠层拼合、尤其是层合成陶瓷复合材料。
11.一种多层多孔的陶瓷复合材料、尤其是以如上述权利要求中任一项所述方法制成的多层多孔陶瓷复合材料,它具有一个基底和一个仅由纳米级颗粒烧结成的无缺陷功能层。
12.如权利要求11所述的陶瓷复合材料,其特征在于,所述陶瓷复合材料包括三层,其中一层含有纳米级颗粒。
13.如权利要求11中所述的陶瓷复合材料,其特征在于,所述陶瓷复合材料包括三层以上,其中至少两层含有纳米级颗粒。
14.如权利要求11至13中任一项所述的陶瓷复合材料,其特征在于,所述陶瓷复合材料在载体层中具有空穴、尤其是通道。
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