CN1748046A - 在盐酸溶液中电解沉积铜的方法 - Google Patents
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 39
- 239000010949 copper Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000005363 electrowinning Methods 0.000 title claims abstract description 8
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims abstract description 18
- 239000011324 bead Substances 0.000 claims abstract description 15
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims abstract description 7
- 229960003280 cupric chloride Drugs 0.000 claims abstract description 7
- 229940045803 cuprous chloride Drugs 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 21
- 239000000243 solution Substances 0.000 claims description 20
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 14
- 229910052801 chlorine Inorganic materials 0.000 claims description 14
- 239000000460 chlorine Substances 0.000 claims description 14
- 238000000151 deposition Methods 0.000 claims description 14
- 230000008021 deposition Effects 0.000 claims description 14
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims description 6
- 239000003792 electrolyte Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000011780 sodium chloride Substances 0.000 claims description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- 150000004763 sulfides Chemical class 0.000 claims description 4
- 229910052948 bornite Inorganic materials 0.000 claims description 3
- 229910052955 covellite Inorganic materials 0.000 claims description 3
- 229910000510 noble metal Inorganic materials 0.000 claims description 3
- 230000003197 catalytic effect Effects 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims 1
- 229910052947 chalcocite Inorganic materials 0.000 claims 1
- 229910052951 chalcopyrite Inorganic materials 0.000 claims 1
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 claims 1
- 229910010272 inorganic material Inorganic materials 0.000 claims 1
- 239000011147 inorganic material Substances 0.000 claims 1
- 210000004027 cell Anatomy 0.000 description 13
- 239000000047 product Substances 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 238000005265 energy consumption Methods 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 229910001779 copper mineral Inorganic materials 0.000 description 5
- 210000001787 dendrite Anatomy 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
- 239000003929 acidic solution Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- -1 tantalum or titanium Chemical class 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 229910021653 sulphate ion Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000029087 digestion Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910000928 Yellow copper Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- BWFPGXWASODCHM-UHFFFAOYSA-N copper monosulfide Chemical compound [Cu]=S BWFPGXWASODCHM-UHFFFAOYSA-N 0.000 description 1
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011244 liquid electrolyte Substances 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920006120 non-fluorinated polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Catalysts (AREA)
- Conductive Materials (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
描述了基本不含枝晶的晶体形态的金属铜的生产方法,该方法包括在喷射床电解槽中从氯化亚铜或氯化铜溶液中进行电解沉积,该喷射床电解槽包含由金属珠下行床构成的阴极。
Description
发明描述
铜在电化学电池阴极上的初级沉积(电解沉积)是电冶金学中众所周知的工艺。这种类型的工艺来自铜矿物的侵蚀,通常在酸性溶液中进行;特别地,最重要的铜源是黄铜矿,特征为四方晶体的铜和铁的混合硫化物(CuFeS2),通常与适合该范围的其它铜矿物相结合,例如靛铜矿(硫化铜,CuS,六方)和斑铜矿(另一种铜和铁的混合硫化物,Cu5FeS4,立方)。合成硫化物,特别是被称为冰铜的材料代表了其它重要的铜来源,冰铜是由作为熔化铜矿物的中间产物得到的熔融硫化物的粗混物组成。几乎在所有的情形中,用酸对这些矿物进行侵蚀以便在硫酸溶液中得到亚铜离子,例如通过使用硫酸硝酸混合物进行消化,并可选地进行焙烧;然后对所述硫酸溶液进行电解以便实现铜的阴极沉积,同时在阳极上产生氧气。尽管如今已建立了这种工艺过程,但是从硫酸盐中电解沉积铜相关的能量消耗相当高;使用常规的铅阳极,电解沉积的能量消耗约为每吨产品铜20-25MJ,并且在可能时引入贵金属氧化物包覆钛阳极只能部分缓解该问题。同样因为这个原因,为了避免引入过高的过电压从而损害总的能量效率,在酸性溶液中从硫酸盐中工业电解沉积铜必须在低于1kA/m2的电流密度下进行,优选约0.5kA/m2的电流密度,如近期的国际专利申请WO02/18676所公开。在任何情形中,工艺电流密度的另一个限制因素是所得产物的品质;实际上存在一个获得合格阴极沉积物的临界电流密度,超过该临界电流密度沉积物的致密度和光泽会变差,并且通常在市场上不被接受。上述的高能耗主要与如下因素有关:阴极沉积半反应包括二电子过程,即二价铜放电变成金属铜。由亚铜溶液进行铜阴极沉积可以减少能量消耗,因为除更有利的氧化还原电势( 反应的E0为0.522V NHE,相比之下依照 的二价铜放电相关的E0为0.340V)以外,一摩尔的铜沉积意味着一摩尔而非两摩尔电子的迁移。然而,不可能在硫酸环境中使用单价铜进行该过程:亚铜离子具有比铜离子更高的还原电势的事实表明了其歧化成金属铜和铜离子的自然趋势;因此必须实现使亚铜离子足够稳定的特定条件以便用于电化学沉积。工业上获得具有足够亚铜离子浓度的稳定电镀液的最简单的方法是在具有高度过量的氯离子的盐酸环境中进行操作,氯离子可起到络合作用从而以适当的方式打破了歧化反应 的平衡。为了实现这一点,在氯气的参与下侵蚀铜矿物,氯气可以将硫化物氧化成元素硫以允许其提取;然后进行若干净化循环,主要实现铁的分离,直至获得包含氯化亚铜和氯化铜的混合物的盐酸溶液,可选加入氯化钠以便最大程度上增加单价铜的含量。
或者,可以用可选包含溶解的氯的氯化铜的酸性溶液侵蚀矿物,随后进行铁的分离。在这两种情形中,所得的有待以后进行电解沉积工艺的典型溶液包含5至75g/l的Cu+离子以及60-300g/l的NaCl和约1M的盐酸,在任何情形中pH不大于2。
在这种方法中,电解沉积铜的能量消耗明显降低,然而本领域的技术人员清楚,使用现有技术的具有固定平面几何形状电极的电解槽、从这种溶液可得到的沉积物的品质显著差于由硫酸盐得到的产品。尽管如此,正如上文所述,由硫酸盐进行的沉积必须发生在不高于1kA/m2的电流密度下,还因为沉积物附着和光亮的问题,当在氯化物环境中进行操作时,甚至在非常低的电流密度下,可以观察到显著的枝晶形成,造成产物的一致性不足和无光泽的外观,通常不适合于商品化,同样还因为清洗和随后产品自身熔化的困难。
本发明的目标是提供从盐酸溶液中电解沉积铜的方法,该方法可以克服现有技术的缺点。
一方面,本发明的目标是提供电解沉积基本不含枝晶的晶体形态的金属铜的方法,该方法的特征在于具有提高的能量效率。
另一方面,本发明的目标是提供在高于1kA/m2的电流密度下电解沉积晶体形态的铜的方法。
一方面,本发明是从盐酸溶液中生产金属铜的方法,该盐酸溶液优选包含氯化亚铜且可选包含氯化铜,该方法包括在逐渐生长金属珠下行床(descending bed)构成的阴极上的沉积。
第二方面,本发明是由提供至电解槽的盐酸溶液生产金属铜和氯的方法,该电解槽具有通过半透隔膜隔开的金属珠的阴极喷射床(spouted bed)和平面阳极,优选重复利用阳极产物以便用于侵蚀所述盐酸溶液生产所用的铜矿物。
将通过下列描述和实例进行阐明这个方面和其它方面,其目的是允许理解本发明的而不构成其限制。
本发明者意外观察到,即使在高于1kA/m2的电流密度下,利用具有逐渐生长铜珠的阴极喷射床的电解槽,可以从盐酸溶液中得到一致,有光泽且致密的晶体铜的阴极沉积物。这种类型的电解槽优选使用催化包覆钛或其它阀门金属平面元件作为阳极,并使用允许液体流过而不通过金属珠的可渗透元件作为隔膜,共同待决的意大利专利申请MI2002A001524中公开了这种电解槽,这里将其引用作为参考文献。在电冶金学领域中已知,在产生氧气作为阳极半反应的过程中,可使用喷射床电解槽在酸性溶液中沉积各种金属。相反地,对于源自使用含氯离子电解质产生氯的阳极半反应,在这方面基本没有进行研究,这还因为冶金环境中氯的生产的可行性不足,其中通常没有考虑过使用这种气体。然而,在电解沉积铜的情形中,产物氯至少部分地与电解质中的过量的单价铜反应,产生氯化铜;在亚铜离子高度过量的情形中,净阳极反应仅仅是将单价铜氧化成二价铜的氧化反应,而不发生氯的净产出。在任何情形中,由富含氯化铜的溶液组成且不含氯化亚铜且可选包含溶解的氯的阳极产物,有利地被送回实现矿石初级消化的反应器中,以便在最有利的情形中实际上以闭合循环进行操作。游离氯的可能存在使得必须对构成材料进行精确的选择,因为这种气体具有高的腐蚀能力,同样必须对激发阳极半反应的催化剂进行精确的选择。因此必须使用钛或其它阀门金属构成阳极室的所有组件,正如在工业电解槽设计中所已知的;该阳极因此将由钛,或钛合金或其它阀门金属的平面,且优选为多孔的元件组成,并具有合适催化包覆层。后者优选基于贵金属,例如钌,铂或铱,通常为氧化物的形式,且通常与阀门金属例如钽或钛的氧化物混合,正如产生氯气的电催化领域中所已知。半透隔膜可以是由任何绝缘材料构成的平面元件,或至少在一面电绝缘,能够抵抗电解槽内部的强腐蚀条件,并且在面对金属珠阴极床的至少一侧提供能够隔离珠子本身的适当孔洞或孔隙,防止它们迁移到阳极室同时允许液态电解质的流动。特别优选的材料是耐氯气聚合物网,通常由全氟化的聚合物或与全氟化的聚合物(例如聚四氟乙烯)结合的无机纤维(例如基于氧化锆的无机纤维)得到;然而,如果对工艺进行调节以便获得基本不含游离氯的阳极产物(使单价铜过量以便使几乎全部的氯转变成氯化铜),可以使用基于非氟化聚合物例如聚酯,聚乙烯或聚丙稀的隔膜。当生长的铜珠达到规定的直径时,可以分批或者通过连续过程将它们从电解槽中释放出,如引用的同一专利申请中所公开的。以这种方式进行操作,可以在最高达4kA/m2的电流密度下得到有光泽且一致的沉积物,虽然由于能量消耗的原因,通常选择以较低的电流密度进行该工艺。同常规平面阴极电解沉积槽中得到的枝晶沉积物不同,如此得到的珠子规则且易于处理。此外,可以更方便地对它们进行冲洗以便在操作末期分离电解质残留物,同时极大促进了用于它们随后再次使用的可选熔融步骤。
不希望本发明的范围受任何具体理论的限制,可以假定生长珠子下行床中的沉积物不含枝晶的意外效应是因为电场每次只能对这种珠子产生几秒钟的有效影响,这足以使铜晶体成核但是不足以使它们以枝晶形式生长。搅拌本身可能是帮助晶体规则生长的因素,正如本领域的技术人员所知,使用吹气,或等同的搅拌方法以便提高金属初级沉积不同过程中的临界电流密度;然而,使用这种类型电解槽所得结果的程度表明简单搅拌不可能是从氯化物溶液中,特别是在提高电流密度下获得高品质铜沉积物的唯一可靠因素。
实施例1
依照MI2002A001524所述的几何形状组装有效面积为60cm2的喷射床电解槽。在阳极室中使用具有氧化钌和氧化钽基包覆层的钛基DSA阳极。使用Daramic/USA生产的作为电池隔离元件的0.25mm厚聚乙烯多孔网作为隔膜。在电解槽的两个室中提供48℃下包含30g/l亚铜离子和1M HCl的溶液。
启动阴极室中的电解质循环之后,向阴极室中装入1-2mm直径的铜珠,并调节流速以便具有一致的珠下行床。施加2.5kA/m2的电流密度,这可以产生2.2V的电解槽电压。100分钟后停止该测试,测得电流效率为61%。对产物进行肉眼检查证实为典型的晶态样品和一致的铜沉积物。扫描电子显微镜测试显示没有枝晶形成。
实施例2
向电解质中加入75g/l氯化钠之后重复实施例1的测试。180分钟之后,测得电流效率为67%。再次发现形成了一致且有光泽的沉积物,并且没有发现枝晶。
Claims (11)
1.生产基本不合枝晶的晶体形态的金属铜的方法,该方法在划分为阴极室和阳极室的电解槽中进行,该方法包括在由金属珠下行床构成的阴极上从氯化亚铜和/或氯化铜溶液中进行电解沉积。
2.权利要求1的方法,其中通过半透隔膜将所述床与相关的阳极室隔开,该半透隔膜允许电解质循环同时阻止所述金属珠从阴极室进入所述的阳极室。
3.权利要求3的方法,其中所述半透隔膜是可选全氟化的聚合物网或由与全氟化聚合物结合的氧化锆或其它耐氯无机材料的纤维得到的网。
4.权利要求2或3的方法,该方法包括形成含氯化铜和可选的溶解的氯的阳极产物。
5.权利要求4的方法,其中所述阳极室包含具有催化包覆层的钛或其它阀门金属的阳极,且该包覆层含有贵金属和/或它们的氧化物。
6.权利要求4或5的方法,该方法包括使用所述阳极产物用于侵蚀铜矿石,并形成所述电解沉积中使用的所述氯化亚铜和/或氯化铜溶液。
7.权利要求6的方法,其中所述铜矿石选自黄铜矿,辉铜矿,斑铜矿,靛铜矿,冰铜和合成硫化物。
8.前述权利要求的方法,其中所述氯化亚铜和/或氯化铜溶液是包含盐酸且可选包含氯化钠的水溶液。
9.权利要求8的方法,其中所述溶液具有不高于2的pH且包含5至75g/l的亚铜离子。
10.权利要求9的方法,其中所述溶液另外包含60至300g/l的氯化钠。
11.前述权利要求的方法,其中在1000至4000A/m2的电流密度下进行所述的电解沉积。
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CN106757174A (zh) * | 2017-02-23 | 2017-05-31 | 黄芃 | 一种电沉积制备金属粉末的方法及装置 |
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US8097132B2 (en) * | 2006-07-04 | 2012-01-17 | Luis Antonio Canales Miranda | Process and device to obtain metal in powder, sheet or cathode from any metal containing material |
US8202411B2 (en) * | 2008-03-19 | 2012-06-19 | Eltron Research & Development, Inc. | Electrowinning apparatus and process |
CN102677094B (zh) * | 2011-11-15 | 2014-08-13 | 王应龙 | 一种镀铜锡铁针回收装置及镀铜锡铁针回收方法 |
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