CN1742119B - 电镀方法 - Google Patents
电镀方法 Download PDFInfo
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- CN1742119B CN1742119B CN200480002822.8A CN200480002822A CN1742119B CN 1742119 B CN1742119 B CN 1742119B CN 200480002822 A CN200480002822 A CN 200480002822A CN 1742119 B CN1742119 B CN 1742119B
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Images
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- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP015236/2003 | 2003-01-23 | ||
JP2003015236A JP4312465B2 (ja) | 2003-01-23 | 2003-01-23 | めっき方法およびめっき装置 |
JP2003149827A JP4423354B2 (ja) | 2003-05-27 | 2003-05-27 | めっき方法 |
JP149827/2003 | 2003-05-27 | ||
JP161237/2003 | 2003-06-05 | ||
JP2003161236A JP4361760B2 (ja) | 2003-06-05 | 2003-06-05 | めっき方法 |
JP2003161237A JP4423355B2 (ja) | 2003-06-05 | 2003-06-05 | めっき装置 |
JP161236/2003 | 2003-06-05 | ||
PCT/JP2004/000528 WO2004065664A1 (ja) | 2003-01-23 | 2004-01-22 | めっき装置及びめっき方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1742119A CN1742119A (zh) | 2006-03-01 |
CN1742119B true CN1742119B (zh) | 2010-04-28 |
Family
ID=33111950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200480002822.8A Expired - Fee Related CN1742119B (zh) | 2003-01-23 | 2004-01-22 | 电镀方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4312465B2 (zh) |
CN (1) | CN1742119B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4468191B2 (ja) | 2005-01-27 | 2010-05-26 | 株式会社日立製作所 | 金属構造体及びその製造方法 |
JP4624873B2 (ja) * | 2005-06-28 | 2011-02-02 | 株式会社荏原製作所 | めっき方法 |
JP5937876B2 (ja) * | 2012-04-18 | 2016-06-22 | 名古屋メッキ工業株式会社 | めっき繊維製造装置及び方法 |
SG196693A1 (en) * | 2012-07-20 | 2014-02-13 | Rokko Systems Pte Ltd | Method and apparatus for the engagement of ic units |
JP6176235B2 (ja) * | 2014-12-26 | 2017-08-09 | トヨタ自動車株式会社 | 金属皮膜の成膜装置およびその成膜方法 |
DE102015210061A1 (de) | 2015-06-01 | 2016-12-01 | Siemens Aktiengesellschaft | Verfahren zur elektrischen Kontaktierung eines Bauteils und Bauteilmodul |
JP6447575B2 (ja) * | 2016-05-23 | 2019-01-09 | トヨタ自動車株式会社 | 金属皮膜の成膜方法およびその成膜装置 |
TWI663294B (zh) | 2017-12-15 | 2019-06-21 | Chipbond Technology Corporation | 電鍍裝置及其壓力艙 |
CN109338439A (zh) * | 2018-12-27 | 2019-02-15 | 肇庆市英拓自动化设备科技有限公司 | 用于微型电子元器件的离心电镀机 |
CN113556879B (zh) * | 2020-04-23 | 2023-12-12 | 源秩科技(上海)有限公司 | 电路板制作方法及其线路层加工装置 |
CN112105159B (zh) * | 2020-09-28 | 2021-11-30 | 江苏盐海电镀中心有限公司 | 一种超长尺寸特种高密度印制电路板电镀刨边装置 |
CN112239878A (zh) * | 2020-10-23 | 2021-01-19 | 华虹半导体(无锡)有限公司 | 消泡电镀设备 |
TWI763424B (zh) * | 2021-04-12 | 2022-05-01 | 宇泰和股份有限公司 | 垂直連續電鍍框架之供電系統 |
CN113960148B (zh) * | 2021-09-30 | 2022-07-08 | 深圳市联合蓝海黄金材料科技股份有限公司 | 预测电镀液的电镀均匀性的电化学方法、筛选电镀液的方法和应用 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1341166A (zh) * | 1999-12-24 | 2002-03-20 | 株式会社荏原制作所 | 基片的电镀装置和电镀方法以及电解处理方法及其装置 |
US6375823B1 (en) * | 1999-02-10 | 2002-04-23 | Kabushiki Kaisha Toshiba | Plating method and plating apparatus |
-
2003
- 2003-01-23 JP JP2003015236A patent/JP4312465B2/ja not_active Expired - Fee Related
-
2004
- 2004-01-22 CN CN200480002822.8A patent/CN1742119B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6375823B1 (en) * | 1999-02-10 | 2002-04-23 | Kabushiki Kaisha Toshiba | Plating method and plating apparatus |
CN1341166A (zh) * | 1999-12-24 | 2002-03-20 | 株式会社荏原制作所 | 基片的电镀装置和电镀方法以及电解处理方法及其装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1742119A (zh) | 2006-03-01 |
JP2004263202A (ja) | 2004-09-24 |
JP4312465B2 (ja) | 2009-08-12 |
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