CN1694270A - 光学表面安装技术封装件 - Google Patents

光学表面安装技术封装件 Download PDF

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CN1694270A
CN1694270A CNA200510005131XA CN200510005131A CN1694270A CN 1694270 A CN1694270 A CN 1694270A CN A200510005131X A CNA200510005131X A CN A200510005131XA CN 200510005131 A CN200510005131 A CN 200510005131A CN 1694270 A CN1694270 A CN 1694270A
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tube core
packaging part
cofferdam
optics
package substrate
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CN100452450C (zh
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罗伯特·E·威尔逊
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Avago Technologies International Sales Pte Ltd
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Agilent Technologies Inc
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Abstract

本发明提供了一种光学表面安装技术半导体封装件。该半导体封装件包括封装件衬底、在封装件衬底顶面上的光学器件管芯、在管芯顶面上的透明光学元件、围绕管芯的光学围堰以及完全覆盖管芯并部分地覆盖透明光学元件的密封剂。

Description

光学表面安装技术封装件
技术领域
本发明涉及表面安装技术封装件，更具体地，涉及光学器件的表面安装技术封装件。
背景技术
用于光学器件的表面安装技术(SMT)封装件在纤维光学(FO)中得到了应用。现今有很多用于诸如硅集成电路(IC)的非光学器件的在工业中可用的SMT封装件。可选择的包括铸模在环氧树脂中的有引线的封装件、陶瓷球栅阵列(BGA)、层压(laminate)BGA以及许多其他选择。这些IC封装件可以是热增强型、多芯片型、低成本型等等。但是不存在这么丰富的光学SMT封装件。
封装IC的最廉价的方法之一是如图1所示的板上芯片(COB)。管芯12被直接安装到印刷电路板(PCB)14上，并且焊线16进行管芯12上的迹线与PCB 14上的迹线之间的连接。如图2所示，通过用称作“滴胶盖(globtop)”的不透明环氧树脂18覆盖器件来提供环境保护。为了降低环氧树脂18的热膨胀系数(CTE)以便热循环不使焊线应力过大，成滴的环氧树脂被大量地用具有与PCB 14类似的CTE的材料“填充”。由于填充材料(经常是二氧化硅)并不透明，所以COB 10通常不能用于光学器件。因此，需要的是用于光学器件的SMT封装件。
发明内容
在本发明的一个实施例中，半导体封装件包括封装件衬底、在封装件衬底顶面上的光学器件管芯、在管芯顶面上的透明光学元件、围绕管芯的光学围堰以及完全覆盖管芯并部分地覆盖透明光学元件的密封剂。
附图说明
图1和图2图示了传统的板上芯片封装件。
图3和图4图示了本发明一个实施例中的用于光学器件的封装件。
图5和图6图示了本发明另一个实施例中的用于光学器件的封装件。
图7、图8和图9图示了本发明另一个实施例中的用于光学器件的封装件。
图10和图11图示了本发明另一个实施例中的用于光学器件的封装件。
图12图示了在本发明一个实施例中的装配过程期间保护封装件的一个实施例的方法。
不同的附图中使用相同的参考标号指示类似或者相同的元件。
具体实施方式
图3和图4图示了本发明一个实施例中的用于光学器件的表面安装技术(SMT)封装件20。管芯22被安装在封装件衬底24上。管芯22包括诸如垂直腔表面发射激光器(VCSEL)、发光二极管(LED)或光电二极管之类的光学器件。封装件衬底24可以是印刷电路板(PCB)或者陶瓷衬底。封装件衬底24的底面可以提供球栅阵列(BGA)29，以电连接到另一个衬底(例如，用户PCB)上。管芯22上的迹线通过焊线26被连接到封装件衬底24上的迹线。
透明光学元件27被安装在管芯22上，以创建穿过“滴胶盖”的窗，该滴胶盖是通过在封装件衬底24上沉积密封剂28而形成的。在一个实施例中，窗27是一个矩形玻璃或石英片，并且密封剂28是填充有用于提供与封装件衬底24相类似的热膨胀系数(CTE)的材料的环氧树脂。窗27的要求的透明度是根据应用所规定的(例如，10％到100％)。在一个实施例中，窗27是引导光的透镜、透过某种波长的光的滤光器或者它们的组合。为了环境上的保护，密封剂28被沉积在封装件衬底24上，以完全覆盖管芯22并部分地覆盖窗27。窗27被部分地覆盖，而其顶面没有密封剂28，使得光可以从管芯22射出或者进入管芯22。
图5和图6图示了本发明一个实施例中的用于光学器件的SMT封装件30。类似于封装件20，封装件30包括管芯22、封装件衬底24、焊线26和窗27。封装件30还包括在封装件衬底24上围绕管芯22、焊线26和窗27形成的围堰33。围堰33具有比管芯22高的高度，以便它可以被密封剂38填充以完全覆盖管芯22并部分地覆盖窗27。这产生了具有略微凸出的窗27的基本平坦的滴胶盖。在一个实施例中，密封剂38类似于密封剂28。如所示出的，围堰33通常为具有圆角的矩形的形状，但是其他形状也可以被用于包围要被密封剂38保护的部件。在一个实施例中，围堰33是一种环氧树脂，该环氧树脂具有所希望的粘度和流动性以形成围堰的壁(例如，触变环氧树脂)。
封装件30具有若干优点。首先，由于材料的体积被限定在围堰33中，所以它容易控制所分配的密封剂38的量。其次，围堰33产生了平坦的滴胶盖，其易于利用传统制造工艺中所使用的真空拾取头来操作。
图7、图8和图9图示了本发明一个实施例中的用于光学器件的SMT封装件40。封装件40类似于封装件30。封装件40包括具有多个光学器件(例如，四个VCSEL)的管芯42A，以代替管芯22。此外，封装件40包括另一个管芯42B，该管芯42B具有用于这些光学器件的驱动器IC。管芯42A和42B上的迹线通过焊线46A连接，而管芯42B和封装件衬底44上的迹线通过焊线46B连接。例如，封装件40包含了一个四信道发射器，而发射器驱动器IC被包括在封装件中。如可以看到的，在管芯42A顶面上安装了更大的窗47。围堰43围绕管芯42A、管芯42B、焊线46A和焊线46B。密封剂48填充围堰43，以完全覆盖管芯42A、管芯42B、焊线46A和焊线46B，并部分地覆盖窗47。封装件衬底44的底部可以提供BGA 49，以电连接到另一个衬底(例如，用户PCB)。
图10和图11图示了本发明一个实施例中的用于光学器件的SMT封装件50。封装件50类似于封装件40，除了窗47被多个用于每个光学器件的透镜57(为了清楚，只标记出了一个)替换了。在一个实施例中，透镜57每个都是被安装在管芯42A顶面上在相应的光学器件上方的透明球透镜，以引导来自相应的光学器件的光或者将光引导到相应的光学器件。
图12图示了如果上述封装件中的任何一个(例如，封装件50)需要在装配过程期间被保护，则封装件的顶部可以用一片带子90覆盖。
所公开的实施例的特征的各种其他修改和组合都在本发明的范围之内。所附权利要求包括了许多实施例。

Claims (22)

1.一种半导体封装件，包括：
封装件衬底；
在所述封装件衬底顶面上的管芯，所述管芯包括光学器件；
在所述管芯顶面上的透明光学元件；和
完全覆盖所述管芯并部分地覆盖所述透明光学元件的密封剂。
2.根据权利要求1所述的封装件，其中，所述透明光学元件选自由滤光器和透镜组成的组。
3.根据权利要求2所述的封装件，其中，所述透镜选自由矩形透镜和球透镜组成的组。
4.根据权利要求1所述的封装件，还包括围绕所述管芯的围堰，其中，所述密封剂被沉积在所述围堰之内。
5.根据权利要求4所述的封装件，其中，所述围堰包括触变环氧树脂。
6.根据权利要求4所述的封装件，其中，所述围堰是具有圆角的矩形。
7.根据权利要求4所述的封装件，其中，所述光学器件选自由激光器、发光二极管和光电二极管组成的组。
8.根据权利要求7所述的封装件，还包括位于所述围堰内部并且被所述密封剂覆盖的另一个管芯，所述另一个管芯包括驱动所述光学器件的电路。
9.根据权利要求1所述的封装件，其中，所述封装件衬底选自由印刷电路板和陶瓷衬底组成的组。
10.根据权利要求1所述的封装件，其中，所述封装件衬底包括处在底面上的球栅阵列。
11.根据权利要求1所述的封装件，其中，所述管芯包括光学器件的阵列。
12.一种用于制造半导体封装件的方法，包括：
在封装件衬底顶面上安装管芯，所述管芯包括光学器件；
在所述管芯顶面上安装透明光学元件；以及
沉积密封剂，以完全覆盖所述管芯并部分地覆盖所述透明光学元件。
13.根据权利要求12所述的方法，其中，所述透明光学元件选自由滤光器和透镜组成的组。
14.根据权利要求13所述的方法，其中，所述透镜选自由矩形透镜和球透镜组成的组。
15.根据权利要求12所述的方法，还包括在所述沉积密封剂的操作之前，形成围绕所述管芯的围堰，其中，所述密封剂被沉积在所述围堰之内。
16.根据权利要求15所述的方法，其中，所述围堰包括触变环氧树脂。
17.根据权利要求15所述的方法，其中，所述形成围堰的操作包括形成具有圆角的矩形围堰。
18.根据权利要求15所述的方法，其中，所述光学器件选自由激光器、发光二极管和光电二极管组成的组。
19.根据权利要求18所述的方法，还包括在所述沉积密封剂的操作之前，在所述封装件衬底上安装另一个管芯，所述另一个管芯包括驱动所述光学器件的电路，其中，所述围堰围绕所述管芯和所述另一个管芯，并且所述密封剂覆盖所述管芯和所述另一个管芯。
20.根据权利要求12所述的方法，其中，所述封装件衬底选自由印刷电路板和陶瓷衬底组成的组。
21.根据权利要求12所述的方法，其中，所述封装件衬底包括处在底面上的球栅阵列。
22.根据权利要求12所述的方法，其中，所述管芯包括光学器件的阵列。
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